JPH0426781B2 - - Google Patents

Info

Publication number
JPH0426781B2
JPH0426781B2 JP61170182A JP17018286A JPH0426781B2 JP H0426781 B2 JPH0426781 B2 JP H0426781B2 JP 61170182 A JP61170182 A JP 61170182A JP 17018286 A JP17018286 A JP 17018286A JP H0426781 B2 JPH0426781 B2 JP H0426781B2
Authority
JP
Japan
Prior art keywords
resin
cut end
semiconductor device
cut
connecting band
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP61170182A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6327029A (ja
Inventor
Mutsuo Yamanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kansai Nippon Electric Co Ltd
Original Assignee
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kansai Nippon Electric Co Ltd filed Critical Kansai Nippon Electric Co Ltd
Priority to JP61170182A priority Critical patent/JPS6327029A/ja
Publication of JPS6327029A publication Critical patent/JPS6327029A/ja
Publication of JPH0426781B2 publication Critical patent/JPH0426781B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP61170182A 1986-07-18 1986-07-18 樹脂封止型半導体装置の製造方法 Granted JPS6327029A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61170182A JPS6327029A (ja) 1986-07-18 1986-07-18 樹脂封止型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61170182A JPS6327029A (ja) 1986-07-18 1986-07-18 樹脂封止型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6327029A JPS6327029A (ja) 1988-02-04
JPH0426781B2 true JPH0426781B2 (da) 1992-05-08

Family

ID=15900204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61170182A Granted JPS6327029A (ja) 1986-07-18 1986-07-18 樹脂封止型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6327029A (da)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1042769C (zh) * 1991-08-27 1999-03-31 Tdk株式会社 高压穿心式陶瓷电容器
JP3473795B2 (ja) * 1995-05-22 2003-12-08 Ｔｄｋ株式会社 高電圧コンデンサ及びマグネトロン

Also Published As

Publication number Publication date
JPS6327029A (ja) 1988-02-04

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