JPH0448628U - - Google Patents

Info

Publication number
JPH0448628U
JPH0448628U JP1990091340U JP9134090U JPH0448628U JP H0448628 U JPH0448628 U JP H0448628U JP 1990091340 U JP1990091340 U JP 1990091340U JP 9134090 U JP9134090 U JP 9134090U JP H0448628 U JPH0448628 U JP H0448628U
Authority
JP
Japan
Prior art keywords
semiconductor device
type semiconductor
lead type
thin metal
inner lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990091340U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990091340U priority Critical patent/JPH0448628U/ja
Publication of JPH0448628U publication Critical patent/JPH0448628U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例を示す側断面図、第２
図は第１図半導体装置の要部断面斜視図、第３図
および第５図は本考案の他の実施例を示す要部側
断面図、第４図は第３図実施例のバンプ電極の製
造方法を示す側断面図、第６図はＴＡＢリード型
半導体装置の一例を示す側断面図である。 ３ａ……インナリード、４……半導体ペレツト
、４ｂ……バンプ電極、５……金属細線。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 半導体ペレツト上に形成したバンプ電極と
    導電箔よりなるインナリードとを圧着接続したＴ
    ＡＢリード型半導体装置において、 上記バンプ電極をインナリードの延長方向に細
    長く形成したことを特徴とするＴＡＢリード型半
    導体装置。 (2) バンプ電極が金属細線をステツチボンデイ
    ングして形成されたことを特徴とする実用新案登
    録請求の範囲第１項記載のＴＡＢリード型半導体
    装置。 (3) ステツチボンデイングされた金属細線の終
    端位置がインナリードの遊端側に位置しているこ
    とを特徴とする実用新案登録請求の範囲第２項記
    載のＴＡＢリード型半導体装置。 (4) バンプ電極が金属細線の一端をボールボン
    テイングしたことを特徴とする実用新案登録請求
    の範囲第２項記載のＴＡＢリード型半導体装置。 (5) ボールボンデイング位置がインナリードの
    遊端より内方に位置していることを特徴とする実
    用新案登録請求の範囲第４項記載のＴＡＢリード
    型半導体装置。
JP1990091340U 1990-08-30 1990-08-30 Pending JPH0448628U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990091340U JPH0448628U (ja) 1990-08-30 1990-08-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990091340U JPH0448628U (ja) 1990-08-30 1990-08-30

Publications (1)

Publication Number Publication Date
JPH0448628U true JPH0448628U (ja) 1992-04-24

Family

ID=31826866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990091340U Pending JPH0448628U (ja) 1990-08-30 1990-08-30

Country Status (1)

Country Link
JP (1) JPH0448628U (ja)

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