JPH0451135U - - Google Patents

Info

Publication number
JPH0451135U
JPH0451135U JP1990093046U JP9304690U JPH0451135U JP H0451135 U JPH0451135 U JP H0451135U JP 1990093046 U JP1990093046 U JP 1990093046U JP 9304690 U JP9304690 U JP 9304690U JP H0451135 U JPH0451135 U JP H0451135U
Authority
JP
Japan
Prior art keywords
chip
bumps
view
inner lead
plan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990093046U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990093046U priority Critical patent/JPH0451135U/ja
Publication of JPH0451135U publication Critical patent/JPH0451135U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例のＩＣチツプの平面
図、第２図は第１図に示すチツプを用いてインナ
ーリードボンデイングを行つたものの平面図、第
３図は従来のＩＣチツプの平面図、第４図は第３
図に示すチツプを用いてインナーリードボンデイ
ングを行つたものの平面図、第５図はインナーリ
ード変形によるチツプエツヂとの接触時の状態を
示す断面図である。 符号の説明、１……ＩＣチツプ、２……電極バ
ンプ、３……フイルム、４……インナーリード、
５……ダミーバンプ、６……ダミーインナーリー
ド、７……フイルムデバイスホール。

Claims (1)

    【実用新案登録請求の範囲】
  1. ＴＡＢ用ＩＣチツプに於いて、電極バンプ間の
    空きスペースにダミーバンプを設けてなることを
    特徴とするＴＡＢ用ＩＣチツプ。
JP1990093046U 1990-09-03 1990-09-03 Pending JPH0451135U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990093046U JPH0451135U (ja) 1990-09-03 1990-09-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990093046U JPH0451135U (ja) 1990-09-03 1990-09-03

Publications (1)

Publication Number Publication Date
JPH0451135U true JPH0451135U (ja) 1992-04-30

Family

ID=31829965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990093046U Pending JPH0451135U (ja) 1990-09-03 1990-09-03

Country Status (1)

Country Link
JP (1) JPH0451135U (ja)

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