JPH0458180B2 - - Google Patents

Info

Publication number
JPH0458180B2
JPH0458180B2 JP62313328A JP31332887A JPH0458180B2 JP H0458180 B2 JPH0458180 B2 JP H0458180B2 JP 62313328 A JP62313328 A JP 62313328A JP 31332887 A JP31332887 A JP 31332887A JP H0458180 B2 JPH0458180 B2 JP H0458180B2
Authority
JP
Japan
Prior art keywords
resin
lead frame
lead
resin body
guide hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62313328A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01152735A (ja
Inventor
Takaaki Yokoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP62313328A priority Critical patent/JPH01152735A/ja
Publication of JPH01152735A publication Critical patent/JPH01152735A/ja
Publication of JPH0458180B2 publication Critical patent/JPH0458180B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP62313328A 1987-12-10 1987-12-10 樹脂封止型電子部品の製造方法 Granted JPH01152735A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62313328A JPH01152735A (ja) 1987-12-10 1987-12-10 樹脂封止型電子部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62313328A JPH01152735A (ja) 1987-12-10 1987-12-10 樹脂封止型電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPH01152735A JPH01152735A (ja) 1989-06-15
JPH0458180B2 true JPH0458180B2 (fr) 1992-09-16

Family

ID=18039911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62313328A Granted JPH01152735A (ja) 1987-12-10 1987-12-10 樹脂封止型電子部品の製造方法

Country Status (1)

Country Link
JP (1) JPH01152735A (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2630686B2 (ja) * 1991-03-04 1997-07-16 ローム株式会社 電子部品製造用フレーム、およびこれを用いた電子部品製造方法、ならびにこの製造方法により製造された電子部品
JP6064649B2 (ja) * 2013-02-14 2017-01-25 大日本印刷株式会社 樹脂付きリードフレームの多面付け体、光半導体装置の多面付け体

Also Published As

Publication number Publication date
JPH01152735A (ja) 1989-06-15

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees