JPH05109958A - リードフレーム - Google Patents

リードフレーム

Info

Publication number
JPH05109958A
JPH05109958A JP3298219A JP29821991A JPH05109958A JP H05109958 A JPH05109958 A JP H05109958A JP 3298219 A JP3298219 A JP 3298219A JP 29821991 A JP29821991 A JP 29821991A JP H05109958 A JPH05109958 A JP H05109958A
Authority
JP
Japan
Prior art keywords
plating layer
lead frame
layer
iron
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3298219A
Other languages
English (en)
Japanese (ja)
Inventor
Akihiko Murata
明彦 村田
Norio Wakabayashi
則男 若林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP3298219A priority Critical patent/JPH05109958A/ja
Priority to KR1019920018712A priority patent/KR930009046A/ko
Priority to EP92309379A priority patent/EP0538019A2/en
Publication of JPH05109958A publication Critical patent/JPH05109958A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/451—Multilayered leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
JP3298219A 1991-10-17 1991-10-17 リードフレーム Pending JPH05109958A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP3298219A JPH05109958A (ja) 1991-10-17 1991-10-17 リードフレーム
KR1019920018712A KR930009046A (ko) 1991-10-17 1992-10-12 리드프레임
EP92309379A EP0538019A2 (en) 1991-10-17 1992-10-14 Lead frame for a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3298219A JPH05109958A (ja) 1991-10-17 1991-10-17 リードフレーム

Publications (1)

Publication Number Publication Date
JPH05109958A true JPH05109958A (ja) 1993-04-30

Family

ID=17856767

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3298219A Pending JPH05109958A (ja) 1991-10-17 1991-10-17 リードフレーム

Country Status (3)

Country Link
EP (1) EP0538019A2 (2)
JP (1) JPH05109958A (2)
KR (1) KR930009046A (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0773769A (ja) * 1993-09-03 1995-03-17 Ngk Spark Plug Co Ltd 半導体パッケージの外部接続端子及びその製造方法
JP2014099637A (ja) * 2009-03-12 2014-05-29 Lg Innotek Co Ltd リードフレーム及びその製造方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5650661A (en) * 1993-12-27 1997-07-22 National Semiconductor Corporation Protective coating combination for lead frames
US5728285A (en) * 1993-12-27 1998-03-17 National Semiconductor Corporation Protective coating combination for lead frames
US5436082A (en) * 1993-12-27 1995-07-25 National Semiconductor Corporation Protective coating combination for lead frames
US6140703A (en) * 1996-08-05 2000-10-31 Motorola, Inc. Semiconductor metallization structure
KR100254271B1 (ko) * 1997-08-04 2000-05-01 유무성 다층 도금 리이드 프레임
US10366946B2 (en) 2017-10-30 2019-07-30 Infineon Technologies Ag Connection member with bulk body and electrically and thermally conductive coating
CN110265376A (zh) 2018-03-12 2019-09-20 意法半导体股份有限公司 引线框架表面精整
US11735512B2 (en) 2018-12-31 2023-08-22 Stmicroelectronics International N.V. Leadframe with a metal oxide coating and method of forming the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4141029A (en) * 1977-12-30 1979-02-20 Texas Instruments Incorporated Integrated circuit device
DE3312713A1 (de) * 1983-04-08 1984-10-11 The Furukawa Electric Co., Ltd., Tokio/Tokyo Silberbeschichtete elektrische materialien und verfahren zu ihrer herstellung
JPS607157A (ja) * 1983-06-25 1985-01-14 Masami Kobayashi Ｉｃ用リ−ドフレ−ム
EP0384586A3 (en) * 1989-02-22 1991-03-06 Texas Instruments Incorporated High reliability plastic package for integrated circuits
JPH02222567A (ja) * 1989-02-23 1990-09-05 Hitachi Cable Ltd リードフレーム
JPH03225947A (ja) * 1990-01-31 1991-10-04 Shinko Electric Ind Co Ltd リードフレーム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0773769A (ja) * 1993-09-03 1995-03-17 Ngk Spark Plug Co Ltd 半導体パッケージの外部接続端子及びその製造方法
JP2014099637A (ja) * 2009-03-12 2014-05-29 Lg Innotek Co Ltd リードフレーム及びその製造方法

Also Published As

Publication number Publication date
EP0538019A2 (en) 1993-04-21
KR930009046A (ko) 1993-05-22
EP0538019A3 (2) 1994-03-09

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