JPS57154863A - Manufacture of resin sealing type electronic parts - Google Patents

Manufacture of resin sealing type electronic parts

Info

Publication number
JPS57154863A
JPS57154863A JP56039796A JP3979681A JPS57154863A JP S57154863 A JPS57154863 A JP S57154863A JP 56039796 A JP56039796 A JP 56039796A JP 3979681 A JP3979681 A JP 3979681A JP S57154863 A JPS57154863 A JP S57154863A
Authority
JP
Japan
Prior art keywords
resin sealing
electronic parts
external connecting
semiconductor element
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56039796A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6234154B2 (2
Inventor
Tetsuo Sano
Makoto Asada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56039796A priority Critical patent/JPS57154863A/ja
Publication of JPS57154863A publication Critical patent/JPS57154863A/ja
Publication of JPS6234154B2 publication Critical patent/JPS6234154B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP56039796A 1981-03-19 1981-03-19 Manufacture of resin sealing type electronic parts Granted JPS57154863A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56039796A JPS57154863A (en) 1981-03-19 1981-03-19 Manufacture of resin sealing type electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56039796A JPS57154863A (en) 1981-03-19 1981-03-19 Manufacture of resin sealing type electronic parts

Publications (2)

Publication Number Publication Date
JPS57154863A true JPS57154863A (en) 1982-09-24
JPS6234154B2 JPS6234154B2 (2) 1987-07-24

Family

ID=12562909

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56039796A Granted JPS57154863A (en) 1981-03-19 1981-03-19 Manufacture of resin sealing type electronic parts

Country Status (1)

Country Link
JP (1) JPS57154863A (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5843552A (ja) * 1981-09-08 1983-03-14 Toshiba Corp 半導体装置の製造方法
JPS6155349U (2) * 1984-08-29 1986-04-14
US7540319B2 (en) 2004-12-17 2009-06-02 Fujikura Ltd. Heat transfer device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3907743B2 (ja) * 1995-05-11 2007-04-18 ローム株式会社 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5843552A (ja) * 1981-09-08 1983-03-14 Toshiba Corp 半導体装置の製造方法
JPS6155349U (2) * 1984-08-29 1986-04-14
US7540319B2 (en) 2004-12-17 2009-06-02 Fujikura Ltd. Heat transfer device

Also Published As

Publication number Publication date
JPS6234154B2 (2) 1987-07-24

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