JPS5815362U - 高耐圧半導体整流素子 - Google Patents

高耐圧半導体整流素子

Info

Publication number
JPS5815362U
JPS5815362U JP1981109379U JP10937981U JPS5815362U JP S5815362 U JPS5815362 U JP S5815362U JP 1981109379 U JP1981109379 U JP 1981109379U JP 10937981 U JP10937981 U JP 10937981U JP S5815362 U JPS5815362 U JP S5815362U
Authority
JP
Japan
Prior art keywords
voltage semiconductor
high voltage
semiconductor rectifier
rectifying element
drum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981109379U
Other languages
English (en)
Inventor
進 林
実 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP1981109379U priority Critical patent/JPS5815362U/ja
Publication of JPS5815362U publication Critical patent/JPS5815362U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Rectifiers (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図、第２図は従来構造を示す断面図、第３図、第４
図は本考案の実施例構造を示す断面図である。 図において、１は高耐圧整流素子の各単位体、１ａ〜１
ｄはダイオードペレット、１ｅ〜１ｈはベース電極、２
はリード線、２′及び２’　ａ、　２′ｂはリード線端
子部、２″は回り止め部、３は表面保護材、４は鼓状接
続子、４′及び４’　ａ〜４’　ｄは鼓状接続子端子部
、５は封止樹脂、６は表面保護材の沿面距離である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 複数個の半導体整流ベレットを同一整流方向に積層した
    整流素子単位体を所要耐圧に応じて複数個鼓状接続子を
    用いて直列接続してなる高耐圧半導体整流素子において
    前記鼓状接続子の端子部周縁に溝もしくは凹部を設けた
    ことを特徴とする高耐圧半導体整流素子。
JP1981109379U 1981-07-23 1981-07-23 高耐圧半導体整流素子 Pending JPS5815362U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981109379U JPS5815362U (ja) 1981-07-23 1981-07-23 高耐圧半導体整流素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981109379U JPS5815362U (ja) 1981-07-23 1981-07-23 高耐圧半導体整流素子

Publications (1)

Publication Number Publication Date
JPS5815362U true JPS5815362U (ja) 1983-01-31

Family

ID=29903759

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981109379U Pending JPS5815362U (ja) 1981-07-23 1981-07-23 高耐圧半導体整流素子

Country Status (1)

Country Link
JP (1) JPS5815362U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61173402U (ja) * 1985-04-17 1986-10-28
JPS61173403U (ja) * 1985-04-17 1986-10-28

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5128463A (ja) * 1974-09-03 1976-03-10 Nippon Electric Co Toranjisutakairo
JPS5145981A (en) * 1974-10-17 1976-04-19 Matsushita Electronics Corp Kotaiatsuseiryusoshi
JPS522597A (en) * 1975-06-24 1977-01-10 Glory Ltd Liquid discharging machine
JPS532167B2 (ja) * 1973-08-07 1978-01-26

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS532167B2 (ja) * 1973-08-07 1978-01-26
JPS5128463A (ja) * 1974-09-03 1976-03-10 Nippon Electric Co Toranjisutakairo
JPS5145981A (en) * 1974-10-17 1976-04-19 Matsushita Electronics Corp Kotaiatsuseiryusoshi
JPS522597A (en) * 1975-06-24 1977-01-10 Glory Ltd Liquid discharging machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61173402U (ja) * 1985-04-17 1986-10-28
JPS61173403U (ja) * 1985-04-17 1986-10-28

Similar Documents

Publication Publication Date Title
JPS5815362U (ja) 高耐圧半導体整流素子
JPS5945931U (ja) 半導体装置
JPS6081665U (ja) 積層型半導体高圧整流素子
JPS60141148U (ja) 半導体装置
JPS602848U (ja) 半導体装置
JPS5887360U (ja) 半導体装置
JPS5943739Y2 (ja) 半導体装置
JPS58432U (ja) モ−ルド型半導体整流装置
JPS596843U (ja) 半導体装置
JPS5829848U (ja) 半導体装置
JPS6142856U (ja) 半導体装置
JPS6013755U (ja) ダイオ−ド装置
JPS59151456U (ja) 半導体装置
JPS6144835U (ja) 半導体装置
JPS58155851U (ja) モ−ルド型半導体装置
JPS6115750U (ja) 高電圧半導体装置
JPS60190186U (ja) 連鎖接続型整流器
JPS6142853U (ja) 樹脂封止型半導体装置
JPS5895659U (ja) 半導体装置
JPS60106348U (ja) 半導体装置
JPS5916138U (ja) 半導体装置
JPS593791U (ja) 高電圧整流スタツク
JPS60125754U (ja) 半導体装置
JPS60192433U (ja) 電解コンデンサ
JPS6027457U (ja) 半導体装置