JPS58164234A - 半導体用ワイヤボンデイング装置 - Google Patents

半導体用ワイヤボンデイング装置

Info

Publication number
JPS58164234A
JPS58164234A JP57046271A JP4627182A JPS58164234A JP S58164234 A JPS58164234 A JP S58164234A JP 57046271 A JP57046271 A JP 57046271A JP 4627182 A JP4627182 A JP 4627182A JP S58164234 A JPS58164234 A JP S58164234A
Authority
JP
Japan
Prior art keywords
bonding
wire bonding
frame
semiconductor
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57046271A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0345539B2 (2
Inventor
Shinichi Shibata
柴田　進一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP57046271A priority Critical patent/JPS58164234A/ja
Publication of JPS58164234A publication Critical patent/JPS58164234A/ja
Publication of JPH0345539B2 publication Critical patent/JPH0345539B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP57046271A 1982-03-25 1982-03-25 半導体用ワイヤボンデイング装置 Granted JPS58164234A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57046271A JPS58164234A (ja) 1982-03-25 1982-03-25 半導体用ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57046271A JPS58164234A (ja) 1982-03-25 1982-03-25 半導体用ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS58164234A true JPS58164234A (ja) 1983-09-29
JPH0345539B2 JPH0345539B2 (2) 1991-07-11

Family

ID=12742558

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57046271A Granted JPS58164234A (ja) 1982-03-25 1982-03-25 半導体用ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS58164234A (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0714856A (ja) * 1993-06-28 1995-01-17 Nec Corp 半導体製造装置
CN103801866A (zh) * 2014-03-06 2014-05-21 成都先进功率半导体股份有限公司 一种焊线机推片下料装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2968391A1 (en) 2013-03-13 2016-01-20 Moderna Therapeutics, Inc. Long-lived polynucleotide molecules

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5513824A (en) * 1978-07-14 1980-01-31 Hitachi Ltd Passage of gas chromatography
JPS55127025A (en) * 1979-03-26 1980-10-01 Toshiba Corp Assembly for semiconductor device and its apparatus
JPS55138246A (en) * 1979-04-13 1980-10-28 Toshiba Corp Manufacture of semicondoctor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5513824A (en) * 1978-07-14 1980-01-31 Hitachi Ltd Passage of gas chromatography
JPS55127025A (en) * 1979-03-26 1980-10-01 Toshiba Corp Assembly for semiconductor device and its apparatus
JPS55138246A (en) * 1979-04-13 1980-10-28 Toshiba Corp Manufacture of semicondoctor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0714856A (ja) * 1993-06-28 1995-01-17 Nec Corp 半導体製造装置
CN103801866A (zh) * 2014-03-06 2014-05-21 成都先进功率半导体股份有限公司 一种焊线机推片下料装置
CN103801866B (zh) * 2014-03-06 2015-07-01 成都先进功率半导体股份有限公司 一种焊线机推片下料装置

Also Published As

Publication number Publication date
JPH0345539B2 (2) 1991-07-11

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