JPS5872841U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5872841U
JPS5872841U JP1981167977U JP16797781U JPS5872841U JP S5872841 U JPS5872841 U JP S5872841U JP 1981167977 U JP1981167977 U JP 1981167977U JP 16797781 U JP16797781 U JP 16797781U JP S5872841 U JPS5872841 U JP S5872841U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
metal wire
thin metal
bonding pad
pad portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981167977U
Other languages
English (en)
Inventor
小林　新司
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1981167977U priority Critical patent/JPS5872841U/ja
Publication of JPS5872841U publication Critical patent/JPS5872841U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の半導体装置の要部の平面図、第２図は第
１図の■−■線に沿う断面図、第３図はこの考案の一実
施例の半導体装置の要部の平面図、第４図は第３図のＩ
Ｖ−ＩＶ線に沿う断面図である。 ２・・・・・・ポンディングパッド、３・・・・・・絶
縁膜、４・・・・・・金属細線、４ａ・・・・・・膨大
部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁膜より露呈したポンディングパッド部に金属細線を
    固着してなる半導体装置において、前記ポンディングパ
    ッド部を金属細線の膨大部で完全に被覆したことを特徴
    とする半導体装置。
JP1981167977U 1981-11-10 1981-11-10 半導体装置 Pending JPS5872841U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981167977U JPS5872841U (ja) 1981-11-10 1981-11-10 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981167977U JPS5872841U (ja) 1981-11-10 1981-11-10 半導体装置

Publications (1)

Publication Number Publication Date
JPS5872841U true JPS5872841U (ja) 1983-05-17

Family

ID=29960030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981167977U Pending JPS5872841U (ja) 1981-11-10 1981-11-10 半導体装置

Country Status (1)

Country Link
JP (1) JPS5872841U (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5317165B2 (ja) * 1974-03-12 1978-06-06
JPS5363974A (en) * 1976-11-19 1978-06-07 Hitachi Ltd Electronic parts

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5317165B2 (ja) * 1974-03-12 1978-06-06
JPS5363974A (en) * 1976-11-19 1978-06-07 Hitachi Ltd Electronic parts

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