JPS5923419Y2 - ワイヤボンデイング用キヤピラリ− - Google Patents

ワイヤボンデイング用キヤピラリ−

Info

Publication number
JPS5923419Y2
JPS5923419Y2 JP1979151341U JP15134179U JPS5923419Y2 JP S5923419 Y2 JPS5923419 Y2 JP S5923419Y2 JP 1979151341 U JP1979151341 U JP 1979151341U JP 15134179 U JP15134179 U JP 15134179U JP S5923419 Y2 JPS5923419 Y2 JP S5923419Y2
Authority
JP
Japan
Prior art keywords
capillary
wire
guide hole
pressure surface
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1979151341U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5670644U (2
Inventor
昭弘 窪田
茂 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1979151341U priority Critical patent/JPS5923419Y2/ja
Publication of JPS5670644U publication Critical patent/JPS5670644U/ja
Application granted granted Critical
Publication of JPS5923419Y2 publication Critical patent/JPS5923419Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped

Landscapes

  • Wire Bonding (AREA)
JP1979151341U 1979-10-31 1979-10-31 ワイヤボンデイング用キヤピラリ− Expired JPS5923419Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979151341U JPS5923419Y2 (ja) 1979-10-31 1979-10-31 ワイヤボンデイング用キヤピラリ−

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979151341U JPS5923419Y2 (ja) 1979-10-31 1979-10-31 ワイヤボンデイング用キヤピラリ−

Publications (2)

Publication Number Publication Date
JPS5670644U JPS5670644U (2) 1981-06-11
JPS5923419Y2 true JPS5923419Y2 (ja) 1984-07-12

Family

ID=29382313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979151341U Expired JPS5923419Y2 (ja) 1979-10-31 1979-10-31 ワイヤボンデイング用キヤピラリ−

Country Status (1)

Country Link
JP (1) JPS5923419Y2 (2)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59191338A (ja) * 1983-04-14 1984-10-30 Shinkawa Ltd ワイヤボンダ用ツ−ル

Also Published As

Publication number Publication date
JPS5670644U (2) 1981-06-11

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