JPS5996845U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5996845U
JPS5996845U JP1982192656U JP19265682U JPS5996845U JP S5996845 U JPS5996845 U JP S5996845U JP 1982192656 U JP1982192656 U JP 1982192656U JP 19265682 U JP19265682 U JP 19265682U JP S5996845 U JPS5996845 U JP S5996845U
Authority
JP
Japan
Prior art keywords
guibond
resin
semiconductor equipment
semiconductor device
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982192656U
Other languages
English (en)
Inventor
安藤　重雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1982192656U priority Critical patent/JPS5996845U/ja
Publication of JPS5996845U publication Critical patent/JPS5996845U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の樹脂封止型半導体装置の一例の断面図、
第２図ａ、　　ｂは本考案の第１の実施例の平面図及び
断面図、第３図は本考案の第２の実施例の断面図である
。 １・・・・・・半導体素子、２′・・・・・・グイボン
ド部、３・・・ど・放熱板、５・・・・・・穴、６・・
・・・・外部引出しリード、ｉ・・・・・・樹脂、１２
・・・・・・グイボンド部、１３・・開放熱板、２２．
・・・・・・グイボンド部、２３・曲・放熱板。。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子が搭載固着されるグイボンド部と、該タイボ
    ンド部と外部引出しリードの一部とを封止する樹脂と、
    前記グイボンド部と一体化接続し前記樹脂の外側部分は
    前記グイボンド部と厚さが異なる実装基板取付用放熱板
    とを含むことを特徴とする半導体装置。
JP1982192656U 1982-12-20 1982-12-20 半導体装置 Pending JPS5996845U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982192656U JPS5996845U (ja) 1982-12-20 1982-12-20 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982192656U JPS5996845U (ja) 1982-12-20 1982-12-20 半導体装置

Publications (1)

Publication Number Publication Date
JPS5996845U true JPS5996845U (ja) 1984-06-30

Family

ID=30414556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982192656U Pending JPS5996845U (ja) 1982-12-20 1982-12-20 半導体装置

Country Status (1)

Country Link
JP (1) JPS5996845U (ja)

Similar Documents

Publication Publication Date Title
JPS5996845U (ja) 半導体装置
JPS6090843U (ja) Ｉｃなどの放熱装置
JPS59169048U (ja) 半導体装置
JPS5834742U (ja) 樹脂封止形半導体装置の放熱構造
JPS6134750U (ja) 半導体装置
JPS594644U (ja) 樹脂モ−ルド半導体装置
JPS59140446U (ja) 混成集積回路用パツケ−ジ
JPS5840843U (ja) 樹脂封止型半導体装置
JPS59164242U (ja) 半導体装置
JPS5897844U (ja) 高電力用混成集積回路装置
JPS59109151U (ja) 樹脂封止型半導体装置
JPS59111052U (ja) 混成集積回路装置
JPS58138350U (ja) リ−ドフレ−ム
JPS6061729U (ja) 半導体装置
JPS6122342U (ja) 半導体装置
JPS60190051U (ja) 半導体装置
JPS6068652U (ja) 半導体装置
JPS59107157U (ja) ＧａＡｓ半導体装置
JPS60125738U (ja) 混成集積回路装置
JPS5954944U (ja) 樹脂封止型半導体装置
JPS6076040U (ja) 半導体装置
JPS59119040U (ja) 樹脂封止形半導体装置
JPS5923748U (ja) 半導体部品
JPS5952644U (ja) 集積回路
JPS5887356U (ja) 半導体装置