JPS6146751U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6146751U
JPS6146751U JP1984132546U JP13254684U JPS6146751U JP S6146751 U JPS6146751 U JP S6146751U JP 1984132546 U JP1984132546 U JP 1984132546U JP 13254684 U JP13254684 U JP 13254684U JP S6146751 U JPS6146751 U JP S6146751U
Authority
JP
Japan
Prior art keywords
gui
pad
semiconductor equipment
semiconductor device
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984132546U
Other languages
English (en)
Inventor
健二 森実
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP1984132546U priority Critical patent/JPS6146751U/ja
Publication of JPS6146751U publication Critical patent/JPS6146751U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】 第１図゜は本考案半導体装置の一実施例を示す断面図、
第２図、第３図、第４図及び第５図は夫々第１図の製造
工程の例を示す線図、第６図及び第７図は夫々従来の半
導体装置の例を示す線図である。 １ばグイパッド、２はグイ、３はリード、４は裏打ち用
樹脂板、５はワイヤ、８及び９は夫々グイパッド支持部
、１３は封止樹脂である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子が保持−されたグイパッドを支持するグイパ
    ッド支持部が、封止樹脂により完全に覆われた樹脂封止
    形の半導体装置において、リードフレームに裏打ちされ
    た樹脂板によってグイパッドが固定されていることを特
    徴とする半導体装置。
JP1984132546U 1984-08-31 1984-08-31 半導体装置 Pending JPS6146751U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984132546U JPS6146751U (ja) 1984-08-31 1984-08-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984132546U JPS6146751U (ja) 1984-08-31 1984-08-31 半導体装置

Publications (1)

Publication Number Publication Date
JPS6146751U true JPS6146751U (ja) 1986-03-28

Family

ID=30691108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984132546U Pending JPS6146751U (ja) 1984-08-31 1984-08-31 半導体装置

Country Status (1)

Country Link
JP (1) JPS6146751U (ja)

Similar Documents

Publication Publication Date Title
JPS5858353U (ja) 半導体装置用リ−ドフレ−ム
JPS60130649U (ja) 樹脂封止型半導体装置
JPS58118751U (ja) 半導体装置
JPS60939U (ja) 半導体装置
JPS6133450U (ja) 半導体装置用リ−ドフレ−ム
JPS5878654U (ja) モ−ルド型半導体素子
JPS5834741U (ja) 樹脂封止型半導体装置
JPS583038U (ja) リ−ドフレ−ム
JPS5895641U (ja) 樹脂封止半導体装置
JPS6122342U (ja) 半導体装置
JPS6099547U (ja) 半導体装置
JPS6117750U (ja) 半導体装置用フレ−ム
JPS6068654U (ja) 半導体装置
JPS6033452U (ja) 樹脂封止型半導体装置
JPS585347U (ja) 樹脂封止型半導体装置
JPS60163752U (ja) 半導体装置
JPS5895062U (ja) 半導体装置
JPS5881937U (ja) 半導体装置
JPS5887355U (ja) 半導体装置
JPS59146965U (ja) 半導体装置用リ−ドフレ−ム
JPS5996843U (ja) 半導体装置
JPS5844843U (ja) 半導体装置
JPS6139950U (ja) 樹脂封止半導体装置
JPS6027444U (ja) 樹脂封止形半導体装置
JPS6073249U (ja) 樹脂封止半導体装置