JPS6237938U - - Google Patents

Info

Publication number
JPS6237938U
JPS6237938U JP1985130300U JP13030085U JPS6237938U JP S6237938 U JPS6237938 U JP S6237938U JP 1985130300 U JP1985130300 U JP 1985130300U JP 13030085 U JP13030085 U JP 13030085U JP S6237938 U JPS6237938 U JP S6237938U
Authority
JP
Japan
Prior art keywords
semiconductor chip
bonding
mold layer
resin mold
bed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985130300U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985130300U priority Critical patent/JPS6237938U/ja
Publication of JPS6237938U publication Critical patent/JPS6237938U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例になる樹脂封止型半
導体装置を示す断面図であり、第２図はその製造
工程を順を追つて示す説明図、第３図は従来の樹
脂封止型半導体装置を示す断面図、第４図は第１
図の実施例になる樹脂封止型半導体装置について
実施した信頼性試験の結果を、従来の半導体装置
についての試験結果と比較して示す線図である。 １…ベツド部、２…リード部、３…マウント剤
層、４…半導体チツプ、５…アルミニウム配線層
、６…パツシベーシヨン膜、７…ボンデイングワ
イヤ、８…樹脂モールド層、９…リド部外装、１
０…隙間、１１，１２…型、１３…ローラ。

Claims (1)

    【実用新案登録請求の範囲】
  1. ベツド部上にダイボンデイングされた半導体チ
    ツプと、該半導体チツプ表面に形成されたボンデ
    イングパツドと、一端部を前記半導体チツプの周
    囲にこれと離間して配置され、且つボンデイング
    ワイヤを介して前記ボンデイングパツドに接続さ
    れたリード部と、前記ベツド部、前記半導体チツ
    プ、前記ボンデイングワイヤ及び前記リード部の
    一端部を封止する樹脂モールド層とを具備し、前
    記リード部が前記ベツド部と平行に延在されると
    共に他端部が前記樹脂モールド層から外方に延出
    し、且つリード部の延出部分が前記樹脂モールド
    層による封止後に前記半導体チツプのダイボンデ
    イング側と同じ方向に折曲げられていることを特
    徴とする樹脂封止型半導体装置。
JP1985130300U 1985-08-27 1985-08-27 Pending JPS6237938U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985130300U JPS6237938U (ja) 1985-08-27 1985-08-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985130300U JPS6237938U (ja) 1985-08-27 1985-08-27

Publications (1)

Publication Number Publication Date
JPS6237938U true JPS6237938U (ja) 1987-03-06

Family

ID=31027664

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985130300U Pending JPS6237938U (ja) 1985-08-27 1985-08-27

Country Status (1)

Country Link
JP (1) JPS6237938U (ja)

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