JPS6262440U - - Google Patents

Info

Publication number
JPS6262440U
JPS6262440U JP1985153824U JP15382485U JPS6262440U JP S6262440 U JPS6262440 U JP S6262440U JP 1985153824 U JP1985153824 U JP 1985153824U JP 15382485 U JP15382485 U JP 15382485U JP S6262440 U JPS6262440 U JP S6262440U
Authority
JP
Japan
Prior art keywords
wire
lead frame
wire bonding
thin metal
transfer guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985153824U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985153824U priority Critical patent/JPS6262440U/ja
Publication of JPS6262440U publication Critical patent/JPS6262440U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は、この考案に係る半導体製造装置の構
成ブロツク図である。第２図は、この考案の一実
施例の構成を示すブロツク図である。第３図は、
この考案の一実施例による半導体装置の製造過程
を示す図である。第４図は、従来装置によつてホ
イヤボンデイングされた半導体ペレツトとリード
フレームとを示す斜視図である。第５図は、従来
装置の構成ブロツク図である。第６図は、半導体
ペレツトの一例を示す斜視図である。 図において、５はフレームローダ部、６ａ，６
ｂはワイヤボンデイング部、７はアンローダ部、
８は移送案内路を示す。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 半導体ペレツトの電極部と外部電極との間
    を金属細線で電気的に接続するワイヤボンデイン
    グ部を含む半導体製造装置であつて、 前記半導体ペレツトが、外部電極と金属細線で
    接続されるべき少なくとも２つの独立した電極部
    を含む場合に、各電極部と外部電極との接続を異
    なる線径の金属細線で接続可能なように、少なく
    とも２つのワイヤボンデイング部を備えることを
    特徴とする、半導体製造装置。 (2) 前記半導体製造装置は、ワイヤボンデイン
    グを施すべき半導体ペレツトがダイボンデイング
    されたリードフレームを収納するローダ部と、 前記ローダ部にその始端が結合され、前記リー
    ドフレームを搬送するリードフレーム移送案内手
    段と、 前記リードフレーム移送案内手段に沿つて設け
    られた、第１の線径の金属細線を用いてワイヤボ
    ンデイングを行う第１ワイヤボンデイング部と、 前記リードフレーム移送案内手段に沿つて設け
    られた、前記第１の線径と異なる第２の線径の金
    属細線を用いてワイヤボンデイングを行なう第２
    のワイヤボンデイング部と、 前記リードフレーム移送案内手段の終端に結合
    された、ワイヤボンデイング完了後の前記リード
    フレームを収納するフレームアンローダ部とを含
    む、実用新案登録請求の範囲第１項記載の半導体
    製造装置。
JP1985153824U 1985-10-08 1985-10-08 Pending JPS6262440U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985153824U JPS6262440U (ja) 1985-10-08 1985-10-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985153824U JPS6262440U (ja) 1985-10-08 1985-10-08

Publications (1)

Publication Number Publication Date
JPS6262440U true JPS6262440U (ja) 1987-04-17

Family

ID=31073054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985153824U Pending JPS6262440U (ja) 1985-10-08 1985-10-08

Country Status (1)

Country Link
JP (1) JPS6262440U (ja)

Similar Documents

Publication Publication Date Title
JPH02273944A (ja) リード付き半導体素子の製造方法
JPS63201331U (ja)
JPH0346497Y2 (ja)
JP2846095B2 (ja) 半導体装置の製造方法
JPS63188945U (ja)
JPS6037253U (ja) 半導体装置
JPS60130635U (ja) 樹脂封止型半導体装置の製造装置
JPS62162840U (ja)
JPH0288237U (ja)
JPS6138818U (ja) 被覆線の端末処理装置
JPH04370942A (ja) ワイヤボンデイング方法
JPS6018546U (ja) 半導体装置
JPS63122134A (ja) 半導体パツケ−ジ
JPS6355435U (ja)
JPS6359325U (ja)
JPS6066031U (ja) 半導体装置
JPS58148931U (ja) 半導体装置
JPS58422U (ja) ワイヤボンデイングの接続構造
JPS5863758U (ja) 樹脂封止型半導体装置
JPH01104046U (ja)
JPS61125029A (ja) ワイヤボンダのキヤピラリ
JPH05299462A (ja) 半導体集積回路装置及びその製造装置
JPS5991747U (ja) 半導体装置
JPH0176043U (ja)
JPS5883157U (ja) 樹脂封止半導体装置