JPH0482861U - - Google Patents

Info

Publication number
JPH0482861U
JPH0482861U JP1990124149U JP12414990U JPH0482861U JP H0482861 U JPH0482861 U JP H0482861U JP 1990124149 U JP1990124149 U JP 1990124149U JP 12414990 U JP12414990 U JP 12414990U JP H0482861 U JPH0482861 U JP H0482861U
Authority
JP
Japan
Prior art keywords
support plate
external lead
extending
lead frame
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990124149U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990124149U priority Critical patent/JPH0482861U/ja
Publication of JPH0482861U publication Critical patent/JPH0482861U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案によるリードフレームの断面図
、第２図は平面図、第３図は側面図、第４図は樹
脂封止後の断面図、第５図は従来のリードフレー
ムについて異物の侵入経路を示す略図である。 １……リードフレーム、２……支持板、２ａ，
２ｂ……主面、２ｃ，２ｄ……側面、２ｅ，２ｆ
……溝、３……外部リード、４……支持リード、
９……半導体素子（電子素子）。

Claims (1)

  1. 【実用新案登録請求の範囲】 支持板及び該支持板から導出された外部リード
    を備え、前記支持板の２つの主面の間に前記外部
    リードの長さ方向に対して略直角な方向に伸びる
    側面を形成した樹脂封止型電子部品用リードフレ
    ームにおいて、 前記支持板の幅方向に延伸する溝を前記側面に
    形成したことを特徴とする樹脂封止型電子部品用
    リードフレーム。
JP1990124149U 1990-11-28 1990-11-28 Pending JPH0482861U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990124149U JPH0482861U (ja) 1990-11-28 1990-11-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990124149U JPH0482861U (ja) 1990-11-28 1990-11-28

Publications (1)

Publication Number Publication Date
JPH0482861U true JPH0482861U (ja) 1992-07-20

Family

ID=31871811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990124149U Pending JPH0482861U (ja) 1990-11-28 1990-11-28

Country Status (1)

Country Link
JP (1) JPH0482861U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63110763A (ja) * 1986-10-29 1988-05-16 Mitsubishi Electric Corp リ−ドフレ−ム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63110763A (ja) * 1986-10-29 1988-05-16 Mitsubishi Electric Corp リ−ドフレ−ム

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