ATE539450T1 - Siliziumkarbid leistungs-mosfets mit kurzgeschlossenem kanal und verfahren zur deren herstellung - Google Patents
Siliziumkarbid leistungs-mosfets mit kurzgeschlossenem kanal und verfahren zur deren herstellungInfo
- Publication number
- ATE539450T1 ATE539450T1 AT01977328T AT01977328T ATE539450T1 AT E539450 T1 ATE539450 T1 AT E539450T1 AT 01977328 T AT01977328 T AT 01977328T AT 01977328 T AT01977328 T AT 01977328T AT E539450 T1 ATE539450 T1 AT E539450T1
- Authority
- AT
- Austria
- Prior art keywords
- silicon carbide
- mosfets
- type silicon
- regions
- drift layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/01—Manufacture or treatment
- H10D12/031—Manufacture or treatment of IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/028—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs
- H10D30/0291—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/028—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs
- H10D30/0291—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs
- H10D30/0295—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs using recessing of the source electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/63—Vertical IGFETs
- H10D30/635—Vertical IGFETs having no inversion channels, e.g. vertical accumulation channel FETs [ACCUFET] or normally-on vertical IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/393—Body regions of DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
- H10D62/8325—Silicon carbide
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/013—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator
- H10D64/01366—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the semiconductor being silicon carbide
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/637—Lateral IGFETs having no inversion channels, e.g. buried channel lateral IGFETs, normally-on lateral IGFETs or depletion-mode lateral IGFETs
Landscapes
- Insulated Gate Type Field-Effect Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Physical Vapour Deposition (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US23782200P | 2000-10-03 | 2000-10-03 | |
| US23742600P | 2000-10-03 | 2000-10-03 | |
| US09/834,283 US6610366B2 (en) | 2000-10-03 | 2001-04-12 | Method of N2O annealing an oxide layer on a silicon carbide layer |
| US29430701P | 2001-05-30 | 2001-05-30 | |
| US09/911,995 US6956238B2 (en) | 2000-10-03 | 2001-07-24 | Silicon carbide power metal-oxide semiconductor field effect transistors having a shorting channel and methods of fabricating silicon carbide metal-oxide semiconductor field effect transistors having a shorting channel |
| PCT/US2001/030715 WO2002029900A2 (en) | 2000-10-03 | 2001-09-28 | Silicon carbide power mosfets having a shorting channel and methods of fabrication them |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE539450T1 true ATE539450T1 (de) | 2012-01-15 |
Family
ID=27540082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT01977328T ATE539450T1 (de) | 2000-10-03 | 2001-09-28 | Siliziumkarbid leistungs-mosfets mit kurzgeschlossenem kanal und verfahren zur deren herstellung |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US6956238B2 (de) |
| EP (2) | EP1325522B1 (de) |
| JP (2) | JP4865984B2 (de) |
| KR (1) | KR100838632B1 (de) |
| CN (1) | CN1319176C (de) |
| AT (1) | ATE539450T1 (de) |
| AU (1) | AU2001296455A1 (de) |
| CA (1) | CA2457919C (de) |
| TW (1) | TW561624B (de) |
| WO (1) | WO2002029900A2 (de) |
Families Citing this family (133)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7396563B2 (en) * | 2002-05-23 | 2008-07-08 | Sixtron Advanced Materials, Inc. | Ceramic thin film on various substrates, and process for producing same |
| KR100873419B1 (ko) | 2002-06-18 | 2008-12-11 | 페어차일드코리아반도체 주식회사 | 높은 항복 전압, 낮은 온 저항 및 작은 스위칭 손실을갖는 전력용 반도체 소자 |
| JP4463482B2 (ja) * | 2002-07-11 | 2010-05-19 | パナソニック株式会社 | Misfet及びその製造方法 |
| JP4188637B2 (ja) * | 2002-08-05 | 2008-11-26 | 独立行政法人産業技術総合研究所 | 半導体装置 |
| US7022378B2 (en) * | 2002-08-30 | 2006-04-04 | Cree, Inc. | Nitrogen passivation of interface states in SiO2/SiC structures |
| US7221010B2 (en) * | 2002-12-20 | 2007-05-22 | Cree, Inc. | Vertical JFET limited silicon carbide power metal-oxide semiconductor field effect transistors |
| EP1604404B1 (de) | 2003-03-19 | 2011-06-22 | Infineon Technologies AG | Halbleiteraufbau mit hoch dotiertem kanalleitungsgebiet und verfahren zur herstellung eines halbleiteraufbaus |
| US6979863B2 (en) * | 2003-04-24 | 2005-12-27 | Cree, Inc. | Silicon carbide MOSFETs with integrated antiparallel junction barrier Schottky free wheeling diodes and methods of fabricating the same |
| US7074643B2 (en) * | 2003-04-24 | 2006-07-11 | Cree, Inc. | Silicon carbide power devices with self-aligned source and well regions and methods of fabricating same |
| US7473929B2 (en) * | 2003-07-02 | 2009-01-06 | Panasonic Corporation | Semiconductor device and method for fabricating the same |
| US6974720B2 (en) * | 2003-10-16 | 2005-12-13 | Cree, Inc. | Methods of forming power semiconductor devices using boule-grown silicon carbide drift layers and power semiconductor devices formed thereby |
| US7622741B2 (en) * | 2004-02-27 | 2009-11-24 | Rohm Co., Ltd. | Semiconductor device and method for manufacturing same |
| US7118970B2 (en) * | 2004-06-22 | 2006-10-10 | Cree, Inc. | Methods of fabricating silicon carbide devices with hybrid well regions |
| JP4761942B2 (ja) * | 2004-11-16 | 2011-08-31 | 株式会社東芝 | 半導体装置 |
| US7569900B2 (en) * | 2004-11-16 | 2009-08-04 | Kabushiki Kaisha Toshiba | Silicon carbide high breakdown voltage semiconductor device |
| JP4604241B2 (ja) * | 2004-11-18 | 2011-01-05 | 独立行政法人産業技術総合研究所 | 炭化ケイ素mos電界効果トランジスタおよびその製造方法 |
| US7615801B2 (en) * | 2005-05-18 | 2009-11-10 | Cree, Inc. | High voltage silicon carbide devices having bi-directional blocking capabilities |
| US20060261346A1 (en) * | 2005-05-18 | 2006-11-23 | Sei-Hyung Ryu | High voltage silicon carbide devices having bi-directional blocking capabilities and methods of fabricating the same |
| US7391057B2 (en) * | 2005-05-18 | 2008-06-24 | Cree, Inc. | High voltage silicon carbide devices having bi-directional blocking capabilities |
| US7414268B2 (en) | 2005-05-18 | 2008-08-19 | Cree, Inc. | High voltage silicon carbide MOS-bipolar devices having bi-directional blocking capabilities |
| US7528040B2 (en) | 2005-05-24 | 2009-05-05 | Cree, Inc. | Methods of fabricating silicon carbide devices having smooth channels |
| JP5033316B2 (ja) * | 2005-07-05 | 2012-09-26 | 日産自動車株式会社 | 半導体装置の製造方法 |
| US7727904B2 (en) * | 2005-09-16 | 2010-06-01 | Cree, Inc. | Methods of forming SiC MOSFETs with high inversion layer mobility |
| US8022465B2 (en) * | 2005-11-15 | 2011-09-20 | Macronrix International Co., Ltd. | Low hydrogen concentration charge-trapping layer structures for non-volatile memory |
| JP4545800B2 (ja) * | 2006-02-07 | 2010-09-15 | 三菱電機株式会社 | 炭化珪素半導体装置およびその製造方法 |
| SG136058A1 (en) * | 2006-03-10 | 2007-10-29 | Chartered Semiconductor Mfg | Integrated circuit system with double doped drain transistor |
| JP4955292B2 (ja) * | 2006-03-31 | 2012-06-20 | 株式会社豊田中央研究所 | 半導体装置 |
| US7883949B2 (en) * | 2006-06-29 | 2011-02-08 | Cree, Inc | Methods of forming silicon carbide switching devices including P-type channels |
| US8432012B2 (en) | 2006-08-01 | 2013-04-30 | Cree, Inc. | Semiconductor devices including schottky diodes having overlapping doped regions and methods of fabricating same |
| US7728402B2 (en) | 2006-08-01 | 2010-06-01 | Cree, Inc. | Semiconductor devices including schottky diodes with controlled breakdown |
| US8710510B2 (en) | 2006-08-17 | 2014-04-29 | Cree, Inc. | High power insulated gate bipolar transistors |
| US7598567B2 (en) | 2006-11-03 | 2009-10-06 | Cree, Inc. | Power switching semiconductor devices including rectifying junction-shunts |
| JP5283147B2 (ja) * | 2006-12-08 | 2013-09-04 | 国立大学法人東北大学 | 半導体装置および半導体装置の製造方法 |
| US20080157117A1 (en) * | 2006-12-28 | 2008-07-03 | Mcnutt Ty R | Insulated gate bipolar transistor with enhanced conductivity modulation |
| US8835987B2 (en) | 2007-02-27 | 2014-09-16 | Cree, Inc. | Insulated gate bipolar transistors including current suppressing layers |
| JP4793293B2 (ja) * | 2007-03-16 | 2011-10-12 | 日産自動車株式会社 | 炭化珪素半導体装置及びその製造方法 |
| US8866150B2 (en) * | 2007-05-31 | 2014-10-21 | Cree, Inc. | Silicon carbide power devices including P-type epitaxial layers and direct ohmic contacts |
| WO2009019837A1 (ja) | 2007-08-07 | 2009-02-12 | Panasonic Corporation | 炭化珪素半導体素子およびその製造方法 |
| US7687825B2 (en) * | 2007-09-18 | 2010-03-30 | Cree, Inc. | Insulated gate bipolar conduction transistors (IBCTS) and related methods of fabrication |
| US8237172B2 (en) | 2007-10-24 | 2012-08-07 | Panasonic Corporation | Semiconductor device having a silicon carbide substrate with an ohmic electrode layer in which a reaction layer is arranged in contact with the silicon carbide substrate |
| JP5157843B2 (ja) * | 2007-12-04 | 2013-03-06 | 住友電気工業株式会社 | 炭化ケイ素半導体装置およびその製造方法 |
| US20090159896A1 (en) * | 2007-12-20 | 2009-06-25 | General Electric Company | Silicon carbide mosfet devices and methods of making |
| US7795691B2 (en) | 2008-01-25 | 2010-09-14 | Cree, Inc. | Semiconductor transistor with P type re-grown channel layer |
| US8232558B2 (en) | 2008-05-21 | 2012-07-31 | Cree, Inc. | Junction barrier Schottky diodes with current surge capability |
| JP5646139B2 (ja) * | 2008-09-26 | 2014-12-24 | 株式会社東芝 | 半導体装置 |
| US8217398B2 (en) * | 2008-10-15 | 2012-07-10 | General Electric Company | Method for the formation of a gate oxide on a SiC substrate and SiC substrates and devices prepared thereby |
| US8106487B2 (en) | 2008-12-23 | 2012-01-31 | Pratt & Whitney Rocketdyne, Inc. | Semiconductor device having an inorganic coating layer applied over a junction termination extension |
| US7829402B2 (en) * | 2009-02-10 | 2010-11-09 | General Electric Company | MOSFET devices and methods of making |
| US8288220B2 (en) * | 2009-03-27 | 2012-10-16 | Cree, Inc. | Methods of forming semiconductor devices including epitaxial layers and related structures |
| US8294507B2 (en) | 2009-05-08 | 2012-10-23 | Cree, Inc. | Wide bandgap bipolar turn-off thyristor having non-negative temperature coefficient and related control circuits |
| US8629509B2 (en) | 2009-06-02 | 2014-01-14 | Cree, Inc. | High voltage insulated gate bipolar transistors with minority carrier diverter |
| US8193848B2 (en) | 2009-06-02 | 2012-06-05 | Cree, Inc. | Power switching devices having controllable surge current capabilities |
| US8541787B2 (en) | 2009-07-15 | 2013-09-24 | Cree, Inc. | High breakdown voltage wide band-gap MOS-gated bipolar junction transistors with avalanche capability |
| US8314462B2 (en) | 2009-07-28 | 2012-11-20 | Cree, Inc. | Semiconductor devices including electrodes with integrated resistances |
| US20110024765A1 (en) * | 2009-07-31 | 2011-02-03 | General Electric Company | Silicon carbide semiconductor structures, devices and methods for making the same |
| US8252647B2 (en) * | 2009-08-31 | 2012-08-28 | Alpha & Omega Semiconductor Incorporated | Fabrication of trench DMOS device having thick bottom shielding oxide |
| US8354690B2 (en) | 2009-08-31 | 2013-01-15 | Cree, Inc. | Solid-state pinch off thyristor circuits |
| JP5075280B2 (ja) * | 2009-10-23 | 2012-11-21 | パナソニック株式会社 | 半導体装置およびその製造方法 |
| WO2011089861A1 (ja) * | 2010-01-19 | 2011-07-28 | パナソニック株式会社 | 半導体装置およびその製造方法 |
| US9117739B2 (en) | 2010-03-08 | 2015-08-25 | Cree, Inc. | Semiconductor devices with heterojunction barrier regions and methods of fabricating same |
| US8415671B2 (en) | 2010-04-16 | 2013-04-09 | Cree, Inc. | Wide band-gap MOSFETs having a heterojunction under gate trenches thereof and related methods of forming such devices |
| KR101063935B1 (ko) | 2010-07-16 | 2011-09-14 | 한국전기연구원 | 자기정렬법을 이용한 탄화규소 전계효과 트랜지스터 소자의 제조방법 |
| US20120083133A1 (en) * | 2010-10-05 | 2012-04-05 | Applied Materials, Inc. | Amine curing silicon-nitride-hydride films |
| CN102598265A (zh) * | 2010-10-29 | 2012-07-18 | 松下电器产业株式会社 | 半导体元件 |
| US8815721B2 (en) * | 2010-12-17 | 2014-08-26 | General Electric Company | Semiconductor device and method of manufacturing the same |
| CN102097479A (zh) * | 2010-12-19 | 2011-06-15 | 电子科技大学 | 一种低压埋沟vdmos器件 |
| CN103430315B (zh) * | 2010-12-20 | 2017-03-01 | 香港科技大学 | 栅介质中具有电荷俘获材料的功率半导体场效应晶体管结构 |
| US9478616B2 (en) | 2011-03-03 | 2016-10-25 | Cree, Inc. | Semiconductor device having high performance channel |
| US8823089B2 (en) * | 2011-04-15 | 2014-09-02 | Infineon Technologies Ag | SiC semiconductor power device |
| US9029945B2 (en) | 2011-05-06 | 2015-05-12 | Cree, Inc. | Field effect transistor devices with low source resistance |
| US9142662B2 (en) | 2011-05-06 | 2015-09-22 | Cree, Inc. | Field effect transistor devices with low source resistance |
| US9984894B2 (en) | 2011-08-03 | 2018-05-29 | Cree, Inc. | Forming SiC MOSFETs with high channel mobility by treating the oxide interface with cesium ions |
| US8680587B2 (en) | 2011-09-11 | 2014-03-25 | Cree, Inc. | Schottky diode |
| US9640617B2 (en) | 2011-09-11 | 2017-05-02 | Cree, Inc. | High performance power module |
| WO2013036370A1 (en) | 2011-09-11 | 2013-03-14 | Cree, Inc. | High current density power module comprising transistors with improved layout |
| US8664665B2 (en) | 2011-09-11 | 2014-03-04 | Cree, Inc. | Schottky diode employing recesses for elements of junction barrier array |
| US8618582B2 (en) | 2011-09-11 | 2013-12-31 | Cree, Inc. | Edge termination structure employing recesses for edge termination elements |
| US9373617B2 (en) | 2011-09-11 | 2016-06-21 | Cree, Inc. | High current, low switching loss SiC power module |
| JP5896667B2 (ja) * | 2011-09-26 | 2016-03-30 | トランスフォーム・ジャパン株式会社 | 化合物半導体装置及びその製造方法 |
| JP5745997B2 (ja) * | 2011-10-31 | 2015-07-08 | トヨタ自動車株式会社 | スイッチング素子とその製造方法 |
| JP5811829B2 (ja) | 2011-12-22 | 2015-11-11 | 住友電気工業株式会社 | 半導体装置の製造方法 |
| WO2013145023A1 (ja) | 2012-03-30 | 2013-10-03 | 株式会社日立製作所 | 電界効果型炭化珪素トランジスタ |
| WO2014010006A1 (ja) * | 2012-07-09 | 2014-01-16 | 株式会社日立製作所 | Mos型電界効果トランジスタ |
| US8860040B2 (en) | 2012-09-11 | 2014-10-14 | Dow Corning Corporation | High voltage power semiconductor devices on SiC |
| US9018639B2 (en) | 2012-10-26 | 2015-04-28 | Dow Corning Corporation | Flat SiC semiconductor substrate |
| US9123798B2 (en) * | 2012-12-12 | 2015-09-01 | General Electric Company | Insulating gate field effect transistor device and method for providing the same |
| KR101920717B1 (ko) | 2013-01-14 | 2018-11-21 | 삼성전자주식회사 | 이중 병렬 채널 구조를 갖는 반도체 소자 및 상기 반도체 소자의 제조 방법 |
| US9738991B2 (en) | 2013-02-05 | 2017-08-22 | Dow Corning Corporation | Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a supporting shelf which permits thermal expansion |
| US9797064B2 (en) | 2013-02-05 | 2017-10-24 | Dow Corning Corporation | Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a support shelf which permits thermal expansion |
| US9276401B2 (en) * | 2013-06-28 | 2016-03-01 | Hamilton Sundstrand Corporation | Solid state circuit-breaker switch devices |
| US10347489B2 (en) | 2013-07-02 | 2019-07-09 | General Electric Company | Semiconductor devices and methods of manufacture |
| JP6230323B2 (ja) * | 2013-08-01 | 2017-11-15 | 株式会社東芝 | 半導体装置 |
| US9331197B2 (en) | 2013-08-08 | 2016-05-03 | Cree, Inc. | Vertical power transistor device |
| CN103441151B (zh) * | 2013-08-27 | 2017-02-01 | 无锡市芯茂微电子有限公司 | 一种低正向压降的二极管 |
| CN103681859A (zh) * | 2013-08-27 | 2014-03-26 | 厦门天睿电子有限公司 | 一种碳化硅半导体器件及其制作方法 |
| JP6206012B2 (ja) * | 2013-09-06 | 2017-10-04 | 住友電気工業株式会社 | 炭化珪素半導体装置 |
| US10600903B2 (en) | 2013-09-20 | 2020-03-24 | Cree, Inc. | Semiconductor device including a power transistor device and bypass diode |
| US20150084063A1 (en) * | 2013-09-20 | 2015-03-26 | Cree, Inc. | Semiconductor device with a current spreading layer |
| US9991376B2 (en) | 2013-09-20 | 2018-06-05 | Monolith Semiconductor Inc. | High voltage MOSFET devices and methods of making the devices |
| US9214572B2 (en) | 2013-09-20 | 2015-12-15 | Monolith Semiconductor Inc. | High voltage MOSFET devices and methods of making the devices |
| US10868169B2 (en) * | 2013-09-20 | 2020-12-15 | Cree, Inc. | Monolithically integrated vertical power transistor and bypass diode |
| US9111919B2 (en) * | 2013-10-03 | 2015-08-18 | Cree, Inc. | Field effect device with enhanced gate dielectric structure |
| US9438227B2 (en) | 2013-12-02 | 2016-09-06 | The Hong Kong University Of Science And Technology | Gate-controlled p-i-n switch with a charge trapping material in the gate dielectric and a self-depleted channel |
| KR101870558B1 (ko) * | 2014-06-27 | 2018-06-22 | 미쓰비시덴키 가부시키가이샤 | 탄화규소 반도체 장치 |
| JP6271356B2 (ja) * | 2014-07-07 | 2018-01-31 | 株式会社東芝 | 半導体装置の製造方法 |
| US9279192B2 (en) | 2014-07-29 | 2016-03-08 | Dow Corning Corporation | Method for manufacturing SiC wafer fit for integration with power device manufacturing technology |
| KR20160048599A (ko) * | 2014-10-24 | 2016-05-04 | 김대형 | 수상발전선을 이용한 수상발전 시스템 |
| WO2016114055A1 (ja) | 2015-01-16 | 2016-07-21 | 富士電機株式会社 | 炭化珪素半導体装置および炭化珪素半導体装置の製造方法 |
| CN104716045A (zh) * | 2015-02-28 | 2015-06-17 | 上海芯亮电子科技有限公司 | 改善SiC热氧化后的界面态的制造方法 |
| DE102016112877B4 (de) | 2015-09-07 | 2021-07-15 | Fuji Electric Co., Ltd. | Verfahren zum Herstellen einer Halbleitervorrichtung und für das Verfahren verwendete Halbleiterherstellungsvorrichtung |
| JP6523887B2 (ja) * | 2015-09-11 | 2019-06-05 | 株式会社東芝 | 半導体装置 |
| CN105206513B (zh) * | 2015-09-28 | 2018-01-09 | 安徽工业大学 | 用氮和硼改善4H‑SiC MOSFET反型层迁移率的方法 |
| WO2017138247A1 (ja) * | 2016-02-10 | 2017-08-17 | 住友電気工業株式会社 | 炭化珪素エピタキシャル基板および炭化珪素半導体装置の製造方法 |
| US10050139B2 (en) | 2016-06-24 | 2018-08-14 | Infineon Technologies Ag | Semiconductor device including a LDMOS transistor and method |
| US10242932B2 (en) | 2016-06-24 | 2019-03-26 | Infineon Technologies Ag | LDMOS transistor and method |
| US10622284B2 (en) | 2016-06-24 | 2020-04-14 | Infineon Technologies Ag | LDMOS transistor and method |
| US9960229B2 (en) * | 2016-06-24 | 2018-05-01 | Infineon Technologies Ag | Semiconductor device including a LDMOS transistor |
| US9875933B2 (en) | 2016-06-24 | 2018-01-23 | Infineon Technologies Ag | Substrate and method including forming a via comprising a conductive liner layer and conductive plug having different microstructures |
| KR102704347B1 (ko) * | 2016-10-14 | 2024-09-06 | 한국전기연구원 | SiC 금속 산화물 반도체 소자의 제조 방법 |
| US10497777B2 (en) | 2017-09-08 | 2019-12-03 | Hestia Power Inc. | Semiconductor power device |
| CN108231898B (zh) * | 2017-12-14 | 2021-07-13 | 东南大学 | 一种低导通电阻的碳化硅功率半导体器件 |
| CN108321080A (zh) * | 2017-12-21 | 2018-07-24 | 秦皇岛京河科学技术研究院有限公司 | 高可靠性的SiC MOSFET器件的制备方法及其结构 |
| CN109659223B (zh) * | 2018-12-31 | 2023-04-28 | 中国电子科技集团公司第五十五研究所 | 一种改进型SiC平面MOSFET器件的制备方法 |
| US11018228B2 (en) * | 2019-08-07 | 2021-05-25 | Fast SiC Semiconductor Incorporated | Silicon carbide semiconductor device |
| CN110783174A (zh) * | 2019-10-22 | 2020-02-11 | 中国电子科技集团公司第五十五研究所 | 一种在碳化硅材料上制造栅极氧化层的方法 |
| WO2021145484A1 (ko) * | 2020-01-16 | 2021-07-22 | 엘지전자 주식회사 | 금속-산화막 반도체 전계효과 트랜지스터 소자 및 그 제조 방법 |
| US11776994B2 (en) * | 2021-02-16 | 2023-10-03 | Alpha And Omega Semiconductor International Lp | SiC MOSFET with reduced channel length and high Vth |
| JP7476130B2 (ja) * | 2021-03-18 | 2024-04-30 | 株式会社東芝 | 半導体装置、半導体装置の製造方法、インバータ回路、駆動装置、車両、及び、昇降機 |
| JP7500524B2 (ja) | 2021-09-16 | 2024-06-17 | 株式会社東芝 | 半導体装置の製造方法 |
| CN114613849B (zh) * | 2022-05-10 | 2022-08-12 | 深圳市威兆半导体股份有限公司 | 一种改善短路特性的碳化硅mos器件 |
| US12376331B2 (en) | 2022-06-16 | 2025-07-29 | Leap Semiconductor Corp. | Semiconductor power device and method of manufacturing the same |
| CN116759464B (zh) * | 2023-08-15 | 2023-11-28 | 苏州华太电子技术股份有限公司 | 一种横向SiC-JFET器件及其制备方法 |
| CN119743984B (zh) * | 2023-09-27 | 2026-03-06 | 创圆科技股份有限公司 | 半导体装置和恒流二极管电路 |
Family Cites Families (100)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3629011A (en) * | 1967-09-11 | 1971-12-21 | Matsushita Electric Industrial Co Ltd | Method for diffusing an impurity substance into silicon carbide |
| US3924024A (en) | 1973-04-02 | 1975-12-02 | Ncr Co | Process for fabricating MNOS non-volatile memories |
| US4466172A (en) | 1979-01-08 | 1984-08-21 | American Microsystems, Inc. | Method for fabricating MOS device with self-aligned contacts |
| US4811065A (en) * | 1987-06-11 | 1989-03-07 | Siliconix Incorporated | Power DMOS transistor with high speed body diode |
| US4875083A (en) | 1987-10-26 | 1989-10-17 | North Carolina State University | Metal-insulator-semiconductor capacitor formed on silicon carbide |
| US5111253A (en) * | 1989-05-09 | 1992-05-05 | General Electric Company | Multicellular FET having a Schottky diode merged therewith |
| JPH0766971B2 (ja) | 1989-06-07 | 1995-07-19 | シャープ株式会社 | 炭化珪素半導体装置 |
| JPH03157974A (ja) | 1989-11-15 | 1991-07-05 | Nec Corp | 縦型電界効果トランジスタ |
| JP2542448B2 (ja) * | 1990-05-24 | 1996-10-09 | シャープ株式会社 | 電界効果トランジスタおよびその製造方法 |
| US5270554A (en) * | 1991-06-14 | 1993-12-14 | Cree Research, Inc. | High power high frequency metal-semiconductor field-effect transistor formed in silicon carbide |
| US5170455A (en) | 1991-10-30 | 1992-12-08 | At&T Bell Laboratories | Optical connective device |
| US5242841A (en) * | 1992-03-25 | 1993-09-07 | Texas Instruments Incorporated | Method of making LDMOS transistor with self-aligned source/backgate and photo-aligned gate |
| US6344663B1 (en) | 1992-06-05 | 2002-02-05 | Cree, Inc. | Silicon carbide CMOS devices |
| US5459107A (en) | 1992-06-05 | 1995-10-17 | Cree Research, Inc. | Method of obtaining high quality silicon dioxide passivation on silicon carbide and resulting passivated structures |
| US5629531A (en) * | 1992-06-05 | 1997-05-13 | Cree Research, Inc. | Method of obtaining high quality silicon dioxide passivation on silicon carbide and resulting passivated structures |
| US5726463A (en) | 1992-08-07 | 1998-03-10 | General Electric Company | Silicon carbide MOSFET having self-aligned gate structure |
| US5587870A (en) | 1992-09-17 | 1996-12-24 | Research Foundation Of State University Of New York | Nanocrystalline layer thin film capacitors |
| JP3146694B2 (ja) * | 1992-11-12 | 2001-03-19 | 富士電機株式会社 | 炭化けい素mosfetおよび炭化けい素mosfetの製造方法 |
| US5506421A (en) | 1992-11-24 | 1996-04-09 | Cree Research, Inc. | Power MOSFET in silicon carbide |
| KR100305123B1 (ko) | 1992-12-11 | 2001-11-22 | 비센트 비.인그라시아, 알크 엠 아헨 | 정적랜덤액세스메모리셀및이를포함하는반도체장치 |
| JPH0799312A (ja) * | 1993-02-22 | 1995-04-11 | Texas Instr Inc <Ti> | 半導体装置とその製法 |
| US5479316A (en) | 1993-08-24 | 1995-12-26 | Analog Devices, Inc. | Integrated circuit metal-oxide-metal capacitor and method of making same |
| US5510630A (en) | 1993-10-18 | 1996-04-23 | Westinghouse Electric Corporation | Non-volatile random access memory cell constructed of silicon carbide |
| GB9326344D0 (en) * | 1993-12-23 | 1994-02-23 | Texas Instruments Ltd | High voltage transistor for sub micron cmos processes |
| US5385855A (en) * | 1994-02-24 | 1995-01-31 | General Electric Company | Fabrication of silicon carbide integrated circuits |
| US5510281A (en) * | 1995-03-20 | 1996-04-23 | General Electric Company | Method of fabricating a self-aligned DMOS transistor device using SiC and spacers |
| JP3521246B2 (ja) | 1995-03-27 | 2004-04-19 | 沖電気工業株式会社 | 電界効果トランジスタおよびその製造方法 |
| SE9501310D0 (sv) * | 1995-04-10 | 1995-04-10 | Abb Research Ltd | A method for introduction of an impurity dopant in SiC, a semiconductor device formed by the mehtod and a use of a highly doped amorphous layer as a source for dopant diffusion into SiC |
| US5734180A (en) * | 1995-06-02 | 1998-03-31 | Texas Instruments Incorporated | High-performance high-voltage device structures |
| KR100199997B1 (ko) * | 1995-09-06 | 1999-07-01 | 오카메 히로무 | 탄화규소 반도체장치 |
| JPH11261061A (ja) | 1998-03-11 | 1999-09-24 | Denso Corp | 炭化珪素半導体装置及びその製造方法 |
| JP4075150B2 (ja) | 1998-03-20 | 2008-04-16 | 株式会社デンソー | 炭化珪素半導体装置及びその製造方法 |
| US6573534B1 (en) | 1995-09-06 | 2003-06-03 | Denso Corporation | Silicon carbide semiconductor device |
| JP3385938B2 (ja) | 1997-03-05 | 2003-03-10 | 株式会社デンソー | 炭化珪素半導体装置及びその製造方法 |
| JP4001960B2 (ja) | 1995-11-03 | 2007-10-31 | フリースケール セミコンダクター インコーポレイテッド | 窒化酸化物誘電体層を有する半導体素子の製造方法 |
| US5972801A (en) | 1995-11-08 | 1999-10-26 | Cree Research, Inc. | Process for reducing defects in oxide layers on silicon carbide |
| US6136728A (en) | 1996-01-05 | 2000-10-24 | Yale University | Water vapor annealing process |
| US6133587A (en) * | 1996-01-23 | 2000-10-17 | Denso Corporation | Silicon carbide semiconductor device and process for manufacturing same |
| JPH09205202A (ja) | 1996-01-26 | 1997-08-05 | Matsushita Electric Works Ltd | 半導体装置 |
| SE9601174D0 (sv) * | 1996-03-27 | 1996-03-27 | Abb Research Ltd | A method for producing a semiconductor device having a semiconductor layer of SiC and such a device |
| US5877045A (en) | 1996-04-10 | 1999-03-02 | Lsi Logic Corporation | Method of forming a planar surface during multi-layer interconnect formation by a laser-assisted dielectric deposition |
| US5763905A (en) | 1996-07-09 | 1998-06-09 | Abb Research Ltd. | Semiconductor device having a passivation layer |
| SE9602745D0 (sv) * | 1996-07-11 | 1996-07-11 | Abb Research Ltd | A method for producing a channel region layer in a SiC-layer for a voltage controlled semiconductor device |
| US6002159A (en) | 1996-07-16 | 1999-12-14 | Abb Research Ltd. | SiC semiconductor device comprising a pn junction with a voltage absorbing edge |
| US5917203A (en) * | 1996-07-29 | 1999-06-29 | Motorola, Inc. | Lateral gate vertical drift region transistor |
| US5939763A (en) | 1996-09-05 | 1999-08-17 | Advanced Micro Devices, Inc. | Ultrathin oxynitride structure and process for VLSI applications |
| US6028012A (en) | 1996-12-04 | 2000-02-22 | Yale University | Process for forming a gate-quality insulating layer on a silicon carbide substrate |
| US5837572A (en) | 1997-01-10 | 1998-11-17 | Advanced Micro Devices, Inc. | CMOS integrated circuit formed by using removable spacers to produce asymmetrical NMOS junctions before asymmetrical PMOS junctions for optimizing thermal diffusivity of dopants implanted therein |
| US6180958B1 (en) * | 1997-02-07 | 2001-01-30 | James Albert Cooper, Jr. | Structure for increasing the maximum voltage of silicon carbide power transistors |
| JP3206727B2 (ja) | 1997-02-20 | 2001-09-10 | 富士電機株式会社 | 炭化けい素縦型mosfetおよびその製造方法 |
| DE19809554B4 (de) | 1997-03-05 | 2008-04-03 | Denso Corp., Kariya | Siliziumkarbidhalbleitervorrichtung |
| US5877041A (en) * | 1997-06-30 | 1999-03-02 | Harris Corporation | Self-aligned power field effect transistor in silicon carbide |
| US6063698A (en) | 1997-06-30 | 2000-05-16 | Motorola, Inc. | Method for manufacturing a high dielectric constant gate oxide for use in semiconductor integrated circuits |
| DE19832329A1 (de) | 1997-07-31 | 1999-02-04 | Siemens Ag | Verfahren zur Strukturierung von Halbleitern mit hoher Präzision, guter Homogenität und Reproduzierbarkeit |
| JP3180895B2 (ja) | 1997-08-18 | 2001-06-25 | 富士電機株式会社 | 炭化けい素半導体装置の製造方法 |
| EP1010204A1 (de) | 1997-08-20 | 2000-06-21 | Siemens Aktiengesellschaft | Halbleiterstruktur mit einem alpha-siliziumcarbidbereich sowie verwendung dieser halbleiterstruktur |
| US6239463B1 (en) | 1997-08-28 | 2001-05-29 | Siliconix Incorporated | Low resistance power MOSFET or other device containing silicon-germanium layer |
| SE9704150D0 (sv) | 1997-11-13 | 1997-11-13 | Abb Research Ltd | Semiconductor device of SiC with insulating layer a refractory metal nitride layer |
| JPH11191559A (ja) | 1997-12-26 | 1999-07-13 | Matsushita Electric Works Ltd | Mosfetの製造方法 |
| JPH11251592A (ja) * | 1998-01-05 | 1999-09-17 | Denso Corp | 炭化珪素半導体装置 |
| JP3216804B2 (ja) | 1998-01-06 | 2001-10-09 | 富士電機株式会社 | 炭化けい素縦形fetの製造方法および炭化けい素縦形fet |
| JPH11266017A (ja) | 1998-01-14 | 1999-09-28 | Denso Corp | 炭化珪素半導体装置及びその製造方法 |
| JPH11238742A (ja) | 1998-02-23 | 1999-08-31 | Denso Corp | 炭化珪素半導体装置の製造方法 |
| JP3893725B2 (ja) | 1998-03-25 | 2007-03-14 | 株式会社デンソー | 炭化珪素半導体装置の製造方法 |
| JP4296633B2 (ja) * | 1998-05-20 | 2009-07-15 | 株式会社デンソー | 炭化珪素半導体装置の製造方法 |
| US6627539B1 (en) | 1998-05-29 | 2003-09-30 | Newport Fab, Llc | Method of forming dual-damascene interconnect structures employing low-k dielectric materials |
| US6107142A (en) | 1998-06-08 | 2000-08-22 | Cree Research, Inc. | Self-aligned methods of fabricating silicon carbide power devices by implantation and lateral diffusion |
| US6100169A (en) | 1998-06-08 | 2000-08-08 | Cree, Inc. | Methods of fabricating silicon carbide power devices by controlled annealing |
| JP4123636B2 (ja) | 1998-06-22 | 2008-07-23 | 株式会社デンソー | 炭化珪素半導体装置及びその製造方法 |
| US5960289A (en) | 1998-06-22 | 1999-09-28 | Motorola, Inc. | Method for making a dual-thickness gate oxide layer using a nitride/oxide composite region |
| JP2000106371A (ja) * | 1998-07-31 | 2000-04-11 | Denso Corp | 炭化珪素半導体装置の製造方法 |
| JP3959856B2 (ja) | 1998-07-31 | 2007-08-15 | 株式会社デンソー | 炭化珪素半導体装置及びその製造方法 |
| US6221700B1 (en) | 1998-07-31 | 2001-04-24 | Denso Corporation | Method of manufacturing silicon carbide semiconductor device with high activation rate of impurities |
| US6246076B1 (en) | 1998-08-28 | 2001-06-12 | Cree, Inc. | Layered dielectric on silicon carbide semiconductor structures |
| US6972436B2 (en) * | 1998-08-28 | 2005-12-06 | Cree, Inc. | High voltage, high temperature capacitor and interconnection structures |
| JP2000133633A (ja) | 1998-09-09 | 2000-05-12 | Texas Instr Inc <Ti> | ハ―ドマスクおよびプラズマ活性化エッチャントを使用した材料のエッチング方法 |
| JP4186337B2 (ja) * | 1998-09-30 | 2008-11-26 | 株式会社デンソー | 炭化珪素半導体装置及びその製造方法 |
| US6048766A (en) | 1998-10-14 | 2000-04-11 | Advanced Micro Devices | Flash memory device having high permittivity stacked dielectric and fabrication thereof |
| US6204203B1 (en) | 1998-10-14 | 2001-03-20 | Applied Materials, Inc. | Post deposition treatment of dielectric films for interface control |
| US6190973B1 (en) | 1998-12-18 | 2001-02-20 | Zilog Inc. | Method of fabricating a high quality thin oxide |
| US6228720B1 (en) | 1999-02-23 | 2001-05-08 | Matsushita Electric Industrial Co., Ltd. | Method for making insulated-gate semiconductor element |
| JP3443589B2 (ja) | 1999-03-01 | 2003-09-02 | 独立行政法人産業技術総合研究所 | 半導体装置の製造方法 |
| US6420225B1 (en) | 1999-04-01 | 2002-07-16 | Apd Semiconductor, Inc. | Method of fabricating power rectifier device |
| US6399996B1 (en) | 1999-04-01 | 2002-06-04 | Apd Semiconductor, Inc. | Schottky diode having increased active surface area and method of fabrication |
| US6448160B1 (en) | 1999-04-01 | 2002-09-10 | Apd Semiconductor, Inc. | Method of fabricating power rectifier device to vary operating parameters and resulting device |
| US6238967B1 (en) | 1999-04-12 | 2001-05-29 | Motorola, Inc. | Method of forming embedded DRAM structure |
| JP2000349081A (ja) | 1999-06-07 | 2000-12-15 | Sony Corp | 酸化膜形成方法 |
| JP4192353B2 (ja) * | 1999-09-21 | 2008-12-10 | 株式会社デンソー | 炭化珪素半導体装置及びその製造方法 |
| US6303508B1 (en) * | 1999-12-16 | 2001-10-16 | Philips Electronics North America Corporation | Superior silicon carbide integrated circuits and method of fabricating |
| US6429041B1 (en) * | 2000-07-13 | 2002-08-06 | Cree, Inc. | Methods of fabricating silicon carbide inversion channel devices without the need to utilize P-type implantation |
| DE10036208B4 (de) | 2000-07-25 | 2007-04-19 | Siced Electronics Development Gmbh & Co. Kg | Halbleiteraufbau mit vergrabenem Inselgebiet und Konaktgebiet |
| US7067176B2 (en) * | 2000-10-03 | 2006-06-27 | Cree, Inc. | Method of fabricating an oxide layer on a silicon carbide layer utilizing an anneal in a hydrogen environment |
| US6767843B2 (en) | 2000-10-03 | 2004-07-27 | Cree, Inc. | Method of N2O growth of an oxide layer on a silicon carbide layer |
| US6610366B2 (en) | 2000-10-03 | 2003-08-26 | Cree, Inc. | Method of N2O annealing an oxide layer on a silicon carbide layer |
| US6593620B1 (en) | 2000-10-06 | 2003-07-15 | General Semiconductor, Inc. | Trench DMOS transistor with embedded trench schottky rectifier |
| JP3881840B2 (ja) * | 2000-11-14 | 2007-02-14 | 独立行政法人産業技術総合研究所 | 半導体装置 |
| DE10214150B4 (de) * | 2001-03-30 | 2009-06-18 | Denso Corporation, Kariya | Siliziumkarbidhalbleitervorrichtung und Verfahren zur Herstellung derselben |
| US6979863B2 (en) * | 2003-04-24 | 2005-12-27 | Cree, Inc. | Silicon carbide MOSFETs with integrated antiparallel junction barrier Schottky free wheeling diodes and methods of fabricating the same |
| US7074643B2 (en) * | 2003-04-24 | 2006-07-11 | Cree, Inc. | Silicon carbide power devices with self-aligned source and well regions and methods of fabricating same |
| GB201223528D0 (en) | 2012-12-31 | 2013-02-13 | Element Six Abrasives Sa | A cutter element for rock removal applications |
-
2001
- 2001-07-24 US US09/911,995 patent/US6956238B2/en not_active Expired - Lifetime
- 2001-09-28 CN CNB018200079A patent/CN1319176C/zh not_active Expired - Lifetime
- 2001-09-28 JP JP2002533381A patent/JP4865984B2/ja not_active Expired - Lifetime
- 2001-09-28 KR KR1020037004672A patent/KR100838632B1/ko not_active Expired - Lifetime
- 2001-09-28 CA CA2457919A patent/CA2457919C/en not_active Expired - Lifetime
- 2001-09-28 EP EP01977328A patent/EP1325522B1/de not_active Expired - Lifetime
- 2001-09-28 WO PCT/US2001/030715 patent/WO2002029900A2/en not_active Ceased
- 2001-09-28 EP EP10182120.5A patent/EP2261955B1/de not_active Expired - Lifetime
- 2001-09-28 AT AT01977328T patent/ATE539450T1/de active
- 2001-10-02 TW TW090124444A patent/TW561624B/zh not_active IP Right Cessation
- 2001-10-02 AU AU2001296455A patent/AU2001296455A1/en not_active Abandoned
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2011
- 2011-09-22 JP JP2011207011A patent/JP5909064B2/ja not_active Expired - Lifetime
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| EP2261955B1 (de) | 2013-05-15 |
| CN1478302A (zh) | 2004-02-25 |
| CN1319176C (zh) | 2007-05-30 |
| CA2457919C (en) | 2015-01-06 |
| KR20030064763A (ko) | 2003-08-02 |
| KR100838632B1 (ko) | 2008-06-19 |
| US20020038891A1 (en) | 2002-04-04 |
| JP2011254119A (ja) | 2011-12-15 |
| US6956238B2 (en) | 2005-10-18 |
| TW561624B (en) | 2003-11-11 |
| EP2261955A3 (de) | 2011-02-16 |
| WO2002029900A3 (en) | 2002-10-31 |
| JP4865984B2 (ja) | 2012-02-01 |
| JP5909064B2 (ja) | 2016-04-26 |
| WO2002029900A2 (en) | 2002-04-11 |
| EP2261955A2 (de) | 2010-12-15 |
| EP1325522A2 (de) | 2003-07-09 |
| JP2004519842A (ja) | 2004-07-02 |
| AU2001296455A1 (en) | 2002-04-15 |
| EP1325522B1 (de) | 2011-12-28 |
| CA2457919A1 (en) | 2002-04-11 |
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