DK1481973T3 - Heterocyklusforbindelse-bærende-onium-salte - Google Patents

Heterocyklusforbindelse-bærende-onium-salte

Info

Publication number
DK1481973T3
DK1481973T3 DK02775329T DK02775329T DK1481973T3 DK 1481973 T3 DK1481973 T3 DK 1481973T3 DK 02775329 T DK02775329 T DK 02775329T DK 02775329 T DK02775329 T DK 02775329T DK 1481973 T3 DK1481973 T3 DK 1481973T3
Authority
DK
Denmark
Prior art keywords
formula
haloalkyl
aralkyl
alkyl
acid
Prior art date
Application number
DK02775329T
Other languages
Danish (da)
English (en)
Inventor
Masahiro Takahashi
Masami Ishihara
Yoji Urano
Original Assignee
Wako Pure Chem Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wako Pure Chem Ind Ltd filed Critical Wako Pure Chem Ind Ltd
Application granted granted Critical
Publication of DK1481973T3 publication Critical patent/DK1481973T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D311/00—Heterocyclic compounds containing six-membered rings having one oxygen atom as the only hetero atom, condensed with other rings
    • C07D311/02—Heterocyclic compounds containing six-membered rings having one oxygen atom as the only hetero atom, condensed with other rings ortho- or peri-condensed with carbocyclic rings or ring systems
    • C07D311/04—Benzo[b]pyrans, not hydrogenated in the carbocyclic ring
    • C07D311/06—Benzo[b]pyrans, not hydrogenated in the carbocyclic ring with oxygen or sulfur atoms directly attached in position 2
    • C07D311/08—Benzo[b]pyrans, not hydrogenated in the carbocyclic ring with oxygen or sulfur atoms directly attached in position 2 not hydrogenated in the hetero ring
    • C07D311/16—Benzo[b]pyrans, not hydrogenated in the carbocyclic ring with oxygen or sulfur atoms directly attached in position 2 not hydrogenated in the hetero ring substituted in position 7
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D311/00—Heterocyclic compounds containing six-membered rings having one oxygen atom as the only hetero atom, condensed with other rings
    • C07D311/02—Heterocyclic compounds containing six-membered rings having one oxygen atom as the only hetero atom, condensed with other rings ortho- or peri-condensed with carbocyclic rings or ring systems
    • C07D311/78—Ring systems having three or more relevant rings
    • C07D311/80—Dibenzopyrans; Hydrogenated dibenzopyrans
    • C07D311/82—Xanthenes
    • C07D311/84—Xanthenes with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached in position 9
    • C07D311/86—Oxygen atoms, e.g. xanthones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/08—Saturated oxiranes
    • C08G65/10—Saturated oxiranes characterised by the catalysts used
    • C08G65/105—Onium compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterized by the type of post-polymerisation functionalisation
    • C08G2650/16—Photopolymerisation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Polymerization Catalysts (AREA)
  • Pyridine Compounds (AREA)
  • Pyrane Compounds (AREA)
  • Epoxy Resins (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DK02775329T 2002-03-04 2002-10-11 Heterocyklusforbindelse-bærende-onium-salte DK1481973T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002056697 2002-03-04
PCT/JP2002/010605 WO2003074509A1 (fr) 2002-03-04 2002-10-11 Sels d'onium comportant des heterocycles

Publications (1)

Publication Number Publication Date
DK1481973T3 true DK1481973T3 (da) 2009-03-30

Family

ID=27784645

Family Applications (1)

Application Number Title Priority Date Filing Date
DK02775329T DK1481973T3 (da) 2002-03-04 2002-10-11 Heterocyklusforbindelse-bærende-onium-salte

Country Status (11)

Country Link
US (2) US7318991B2 (fr)
EP (2) EP1953149B1 (fr)
JP (2) JP4341406B2 (fr)
KR (2) KR100893607B1 (fr)
CN (2) CN100475803C (fr)
AT (2) ATE419241T1 (fr)
AU (1) AU2002343973A1 (fr)
DE (2) DE60237933D1 (fr)
DK (1) DK1481973T3 (fr)
TW (2) TWI249077B (fr)
WO (1) WO2003074509A1 (fr)

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US7230122B2 (en) 2003-11-04 2007-06-12 National Starch And Chemical Investment Holding Corporation Sulfonium salt photinitiators and use thereof
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JP4866605B2 (ja) * 2005-12-28 2012-02-01 富士フイルム株式会社 感光性組成物、該感光性組成物を用いたパターン形成方法及び該感光性組成物に用いられる化合物
GB0623936D0 (en) * 2006-11-29 2007-01-10 Univ Strathclyde Polymers with transmission into the ultraviolet
JP2008201913A (ja) * 2007-02-20 2008-09-04 Fujifilm Corp 光重合性組成物
JP2013148878A (ja) * 2011-12-19 2013-08-01 Sumitomo Chemical Co Ltd レジスト組成物
JP6144164B2 (ja) * 2012-09-15 2017-06-07 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ オニウム化合物およびその合成方法
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WO2016147356A1 (fr) * 2015-03-18 2016-09-22 株式会社Adeka Composé de sel de sulfonium aromatique, générateur de photoacide, composition de réserve, initiateur de polymérisation cationique, et composition polymérisable par voie cationique
JP6708382B2 (ja) * 2015-09-03 2020-06-10 サンアプロ株式会社 硬化性組成物及びそれを用いた硬化体
EP3475332A1 (fr) * 2016-06-22 2019-05-01 3M Innovative Properties Company Compositions durcissables contenant un réseau chromonique, articles, et procédés
JP2019094367A (ja) * 2017-11-17 2019-06-20 丸善石油化学株式会社 オニウム塩を用いたビニルエーテルポリマーの製造方法
CN108047187B (zh) * 2017-11-22 2021-12-10 河南科技大学 一种氧杂蒽酮的制备方法
WO2020170295A1 (fr) * 2019-02-18 2020-08-27 丸善石油化学株式会社 Procédé de production de polymère d'éther vinylique à l'aide d'un sel d'onium
WO2021075401A1 (fr) * 2019-10-18 2021-04-22 日東電工株式会社 Feuille adhésive et stratifié intermédiaire
JP7706230B2 (ja) * 2019-10-18 2025-07-11 日東電工株式会社 粘着シートおよび中間積層体
US11852972B2 (en) 2020-10-30 2023-12-26 Rohm And Haas Electronic Materials Llc Photoresist compositions and pattern formation methods
US20240176239A1 (en) * 2021-03-23 2024-05-30 Toray Industries, Inc. Negative photosensitive resin composition, negative photosensitive resin composition film, cured product, preparation method of cured product, hollow structure, and electronic component
CN114773315B (zh) * 2022-04-28 2023-09-19 韦尔通科技股份有限公司 一种碘鎓盐化合物及其制备方法和应用以及阳离子uv固化胶黏剂
CN115010575B (zh) * 2022-06-15 2023-06-06 温州大学 2-三氟甲基萘衍生物的合成方法
JP7800342B2 (ja) * 2022-08-08 2026-01-16 信越化学工業株式会社 レジスト組成物及びパターン形成方法

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Also Published As

Publication number Publication date
EP1481973A4 (fr) 2005-11-09
CN100475803C (zh) 2009-04-08
KR20040095253A (ko) 2004-11-12
EP1481973A1 (fr) 2004-12-01
DE60230679D1 (de) 2009-02-12
KR100933343B1 (ko) 2009-12-22
ATE419241T1 (de) 2009-01-15
ATE483703T1 (de) 2010-10-15
TWI248930B (en) 2006-02-11
US7833691B2 (en) 2010-11-16
US20050233253A1 (en) 2005-10-20
CN1854133B (zh) 2010-11-10
JP2006089476A (ja) 2006-04-06
TWI249077B (en) 2006-02-11
US7318991B2 (en) 2008-01-15
KR20090018728A (ko) 2009-02-20
WO2003074509A1 (fr) 2003-09-12
CN1854133A (zh) 2006-11-01
JP4341406B2 (ja) 2009-10-07
EP1953149B1 (fr) 2010-10-06
KR100893607B1 (ko) 2009-04-20
EP1481973B1 (fr) 2008-12-31
JPWO2003074509A1 (ja) 2005-06-30
EP1953149A2 (fr) 2008-08-06
AU2002343973A1 (en) 2003-09-16
DE60237933D1 (de) 2010-11-18
JP4345730B2 (ja) 2009-10-14
CN1622943A (zh) 2005-06-01
TW200530752A (en) 2005-09-16
US20080161520A1 (en) 2008-07-03
EP1953149A3 (fr) 2008-08-20

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