JP2018156096A5 - - Google Patents

Download PDF

Info

Publication number
JP2018156096A5
JP2018156096A5 JP2018098462A JP2018098462A JP2018156096A5 JP 2018156096 A5 JP2018156096 A5 JP 2018156096A5 JP 2018098462 A JP2018098462 A JP 2018098462A JP 2018098462 A JP2018098462 A JP 2018098462A JP 2018156096 A5 JP2018156096 A5 JP 2018156096A5
Authority
JP
Japan
Prior art keywords
substrate
liquid
holding member
exposure apparatus
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018098462A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018156096A (ja
Filing date
Publication date
Application filed filed Critical
Publication of JP2018156096A publication Critical patent/JP2018156096A/ja
Publication of JP2018156096A5 publication Critical patent/JP2018156096A5/ja
Pending legal-status Critical Current

Links

JP2018098462A 2004-02-04 2018-05-23 露光装置、露光方法及びデバイス製造方法 Pending JP2018156096A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004028092 2004-02-04
JP2004028092 2004-02-04

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2017048605A Division JP2017129875A (ja) 2004-02-04 2017-03-14 露光装置、露光方法及びデバイス製造方法

Publications (2)

Publication Number Publication Date
JP2018156096A JP2018156096A (ja) 2018-10-04
JP2018156096A5 true JP2018156096A5 (2) 2019-01-24

Family

ID=34835916

Family Applications (7)

Application Number Title Priority Date Filing Date
JP2010255402A Expired - Fee Related JP5158178B2 (ja) 2004-02-04 2010-11-15 露光装置、露光方法及びデバイス製造方法
JP2012083150A Expired - Fee Related JP5578191B2 (ja) 2004-02-04 2012-03-30 露光装置、露光方法及びデバイス製造方法
JP2013264071A Expired - Fee Related JP5835312B2 (ja) 2004-02-04 2013-12-20 露光装置、露光方法及びデバイス製造方法
JP2014243048A Expired - Fee Related JP5979206B2 (ja) 2004-02-04 2014-12-01 露光装置、露光方法及びデバイス製造方法
JP2016021643A Expired - Lifetime JP6187615B2 (ja) 2004-02-04 2016-02-08 露光装置、露光方法及びデバイス製造方法
JP2017048605A Ceased JP2017129875A (ja) 2004-02-04 2017-03-14 露光装置、露光方法及びデバイス製造方法
JP2018098462A Pending JP2018156096A (ja) 2004-02-04 2018-05-23 露光装置、露光方法及びデバイス製造方法

Family Applications Before (6)

Application Number Title Priority Date Filing Date
JP2010255402A Expired - Fee Related JP5158178B2 (ja) 2004-02-04 2010-11-15 露光装置、露光方法及びデバイス製造方法
JP2012083150A Expired - Fee Related JP5578191B2 (ja) 2004-02-04 2012-03-30 露光装置、露光方法及びデバイス製造方法
JP2013264071A Expired - Fee Related JP5835312B2 (ja) 2004-02-04 2013-12-20 露光装置、露光方法及びデバイス製造方法
JP2014243048A Expired - Fee Related JP5979206B2 (ja) 2004-02-04 2014-12-01 露光装置、露光方法及びデバイス製造方法
JP2016021643A Expired - Lifetime JP6187615B2 (ja) 2004-02-04 2016-02-08 露光装置、露光方法及びデバイス製造方法
JP2017048605A Ceased JP2017129875A (ja) 2004-02-04 2017-03-14 露光装置、露光方法及びデバイス製造方法

Country Status (6)

Country Link
US (5) US8208119B2 (2)
EP (6) EP1713115B1 (2)
JP (7) JP5158178B2 (2)
KR (8) KR101741343B1 (2)
TW (4) TW201415538A (2)
WO (1) WO2005076324A1 (2)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1938646B (zh) 2004-01-20 2010-12-15 卡尔蔡司Smt股份公司 曝光装置和用于投影透镜的测量装置
EP1713115B1 (en) 2004-02-04 2016-05-04 Nikon Corporation Exposure apparatus, exposure method, and device producing method
EP1737024A4 (en) * 2004-03-25 2008-10-15 Nikon Corp Exposure equipment, exposure method and device manufacturing method
US7486381B2 (en) * 2004-05-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7304715B2 (en) 2004-08-13 2007-12-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI436403B (zh) 2004-10-26 2014-05-01 尼康股份有限公司 A cleaning method, a substrate processing method, an exposure apparatus, and an element manufacturing method
EP1873816A4 (en) 2005-04-18 2010-11-24 Nikon Corp EXPOSURE DEVICE, EXPOSURE METHOD AND COMPONENTS MANUFACTURING METHOD
US7652746B2 (en) * 2005-06-21 2010-01-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR20080071552A (ko) 2005-12-06 2008-08-04 가부시키가이샤 니콘 노광 방법, 노광 장치 및 디바이스 제조 방법
US7746447B2 (en) * 2005-12-22 2010-06-29 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and method of calibrating a lithographic apparatus
US7649611B2 (en) 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8045134B2 (en) 2006-03-13 2011-10-25 Asml Netherlands B.V. Lithographic apparatus, control system and device manufacturing method
DE102006021797A1 (de) * 2006-05-09 2007-11-15 Carl Zeiss Smt Ag Optische Abbildungseinrichtung mit thermischer Dämpfung
US8068208B2 (en) * 2006-12-01 2011-11-29 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for improving immersion scanner overlay performance
US7791709B2 (en) 2006-12-08 2010-09-07 Asml Netherlands B.V. Substrate support and lithographic process
US20080137055A1 (en) * 2006-12-08 2008-06-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2008173744A (ja) * 2007-01-22 2008-07-31 Tokyo Electron Ltd 搬送システムの搬送位置合わせ方法
KR20100031694A (ko) 2007-05-28 2010-03-24 가부시키가이샤 니콘 노광 장치, 디바이스 제조 방법, 세정 장치, 및 클리닝 방법 그리고 노광 방법
US9025126B2 (en) * 2007-07-31 2015-05-05 Nikon Corporation Exposure apparatus adjusting method, exposure apparatus, and device fabricating method
JP5369443B2 (ja) * 2008-02-05 2013-12-18 株式会社ニコン ステージ装置、露光装置、露光方法、及びデバイス製造方法
EP2136250A1 (en) * 2008-06-18 2009-12-23 ASML Netherlands B.V. Lithographic apparatus and method
JP2010118527A (ja) * 2008-11-13 2010-05-27 Canon Inc 露光装置、およびデバイス製造方法
US8896806B2 (en) 2008-12-29 2014-11-25 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
NL2004808A (en) 2009-06-30 2011-01-12 Asml Netherlands Bv Fluid handling structure, lithographic apparatus and device manufacturing method.
JP2011192991A (ja) 2010-03-12 2011-09-29 Asml Netherlands Bv リソグラフィ装置および方法
NL2006913A (en) 2010-07-16 2012-01-17 Asml Netherlands Bv Lithographic apparatus and method.
KR101979893B1 (ko) 2012-05-29 2019-05-17 에이에스엠엘 네델란즈 비.브이. 대상물 홀더 및 리소그래피 장치
TWI582837B (zh) * 2012-06-11 2017-05-11 應用材料股份有限公司 在脈衝式雷射退火中使用紅外線干涉技術之熔化深度測定
JP5989525B2 (ja) * 2012-11-30 2016-09-07 東京エレクトロン株式会社 基板処理装置、基板処理装置の基板保持状態の把握方法および記憶媒体
NL2014915A (en) * 2014-07-01 2016-03-31 Asml Netherlands Bv A Lithographic Apparatus and a Method of Manufacturing a Lithographic Apparatus.
JP6702753B2 (ja) * 2016-02-17 2020-06-03 キヤノン株式会社 リソグラフィ装置、及び物品の製造方法
CN110268334B (zh) * 2017-02-03 2024-10-29 Asml荷兰有限公司 曝光设备
KR102601473B1 (ko) * 2017-10-26 2023-11-10 파티클 머슈어링 시스템즈, 인크. 입자 측정을 위한 시스템 및 방법
KR102511272B1 (ko) 2018-02-23 2023-03-16 삼성전자주식회사 노광 장치 및 이를 이용하는 반도체 장치의 제조 방법
CN112272966B (zh) * 2018-06-20 2024-02-02 信越化学工业株式会社 转移装置、使用方法和调整方法
CN110856489A (zh) * 2018-08-22 2020-03-03 燕化永乐(乐亭)生物科技有限公司 一种复配除草剂
JP7227834B2 (ja) * 2019-04-16 2023-02-22 キヤノン株式会社 基板処理装置及び物品の製造方法
DE102019215340A1 (de) * 2019-10-07 2021-04-08 Carl Zeiss Smt Gmbh Vorrichtung und Verfahren zum Abschirmen von thermisch zu isolierenden Komponenten in mikrolithographischen Projektionsbelichtungsanlagen
JP7447158B2 (ja) * 2020-02-12 2024-03-11 ギガフォトン株式会社 情報処理装置、情報処理方法、及び半導体製造システム
JP7536571B2 (ja) 2020-09-15 2024-08-20 キオクシア株式会社 位置計測装置及び計測方法
JP2024164941A (ja) 2023-05-16 2024-11-28 株式会社日立ハイテク 撮影装置、および、撮影方法
EP4607276A3 (en) * 2025-07-07 2026-03-11 ASML Netherlands B.V. Method for determining an aerial image position and a lithographic apparatus

Family Cites Families (127)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US561071A (en) * 1896-05-26 armstrong
DD127137B1 (de) 1976-08-17 1979-11-28 Elektromat Veb Vorrichtung zum kompensieren der waermeeinwirkung an justier- und belichtungseinrichtungen
US4509852A (en) * 1980-10-06 1985-04-09 Werner Tabarelli Apparatus for the photolithographic manufacture of integrated circuit elements
US4346164A (en) * 1980-10-06 1982-08-24 Werner Tabarelli Photolithographic method for the manufacture of integrated circuits
JPS57117238A (en) * 1981-01-14 1982-07-21 Nippon Kogaku Kk <Nikon> Exposing and baking device for manufacturing integrated circuit with illuminometer
JPS57153433A (en) * 1981-03-18 1982-09-22 Hitachi Ltd Manufacturing device for semiconductor
JPS57169244A (en) 1981-04-13 1982-10-18 Canon Inc Temperature controller for mask and wafer
GB2111745B (en) 1981-12-07 1985-06-19 Philips Electronic Associated Insulated-gate field-effect transistors
JPS58202448A (ja) 1982-05-21 1983-11-25 Hitachi Ltd 露光装置
JPS5919912A (ja) 1982-07-26 1984-02-01 Hitachi Ltd 液浸距離保持装置
DD221563A1 (de) 1983-09-14 1985-04-24 Mikroelektronik Zt Forsch Tech Immersionsobjektiv fuer die schrittweise projektionsabbildung einer maskenstruktur
JPS60158626A (ja) * 1984-01-30 1985-08-20 Canon Inc 半導体露光装置
DD224448A1 (de) 1984-03-01 1985-07-03 Zeiss Jena Veb Carl Einrichtung zur fotolithografischen strukturuebertragung
US4780617A (en) 1984-08-09 1988-10-25 Nippon Kogaku K.K. Method for successive alignment of chip patterns on a substrate
JPS6144429A (ja) 1984-08-09 1986-03-04 Nippon Kogaku Kk <Nikon> 位置合わせ方法、及び位置合せ装置
JPS6265326A (ja) 1985-09-18 1987-03-24 Hitachi Ltd 露光装置
JPH0782981B2 (ja) * 1986-02-07 1995-09-06 株式会社ニコン 投影露光方法及び装置
JPS63157419A (ja) 1986-12-22 1988-06-30 Toshiba Corp 微細パタ−ン転写装置
JPH01152639A (ja) 1987-12-10 1989-06-15 Canon Inc 吸着保持装置
EP0357423B1 (en) * 1988-09-02 1995-03-15 Canon Kabushiki Kaisha An exposure apparatus
JPH0276212A (ja) 1988-09-13 1990-03-15 Canon Inc 多重露光方法
DE68922061T2 (de) 1988-10-03 1995-08-31 Canon Kk Vorrichtung zum Regeln der Temperatur.
JPH033316A (ja) 1989-05-31 1991-01-09 Nec Kyushu Ltd 縮小投影型露光装置
JP2737010B2 (ja) * 1989-08-01 1998-04-08 キヤノン株式会社 露光装置
US5231291A (en) * 1989-08-01 1993-07-27 Canon Kabushiki Kaisha Wafer table and exposure apparatus with the same
JP2897355B2 (ja) * 1990-07-05 1999-05-31 株式会社ニコン アライメント方法,露光装置,並びに位置検出方法及び装置
JPH04305915A (ja) 1991-04-02 1992-10-28 Nikon Corp 密着型露光装置
JPH04305917A (ja) 1991-04-02 1992-10-28 Nikon Corp 密着型露光装置
JP3149472B2 (ja) * 1991-08-30 2001-03-26 株式会社ニコン 走査露光装置および物体の移動測定装置
US5243195A (en) * 1991-04-25 1993-09-07 Nikon Corporation Projection exposure apparatus having an off-axis alignment system and method of alignment therefor
JP3200874B2 (ja) 1991-07-10 2001-08-20 株式会社ニコン 投影露光装置
JPH0542804A (ja) 1991-08-09 1993-02-23 Sumitomo Wiring Syst Ltd タイヤ滑り止め装置
JPH0562877A (ja) 1991-09-02 1993-03-12 Yasuko Shinohara 光によるlsi製造縮小投影露光装置の光学系
JP3286994B2 (ja) 1991-11-06 2002-05-27 株式会社ニコン 露光方法、および露光装置
JP3291832B2 (ja) 1992-05-19 2002-06-17 株式会社ニコン 基板保持部材、および、露光装置
JPH065603A (ja) 1992-06-17 1994-01-14 Sony Corp 半導体装置
JP3246615B2 (ja) 1992-07-27 2002-01-15 株式会社ニコン 照明光学装置、露光装置、及び露光方法
JPH06188169A (ja) 1992-08-24 1994-07-08 Canon Inc 結像方法及び該方法を用いる露光装置及び該方法を用いるデバイス製造方法
JPH06124873A (ja) 1992-10-09 1994-05-06 Canon Inc 液浸式投影露光装置
JP2753930B2 (ja) * 1992-11-27 1998-05-20 キヤノン株式会社 液浸式投影露光装置
JP3412704B2 (ja) 1993-02-26 2003-06-03 株式会社ニコン 投影露光方法及び装置、並びに露光装置
US5738165A (en) * 1993-05-07 1998-04-14 Nikon Corporation Substrate holding apparatus
JPH07220990A (ja) 1994-01-28 1995-08-18 Hitachi Ltd パターン形成方法及びその露光装置
US5874820A (en) 1995-04-04 1999-02-23 Nikon Corporation Window frame-guided stage mechanism
US5528118A (en) 1994-04-01 1996-06-18 Nikon Precision, Inc. Guideless stage with isolated reaction stage
JP3555230B2 (ja) 1994-05-18 2004-08-18 株式会社ニコン 投影露光装置
US6721034B1 (en) * 1994-06-16 2004-04-13 Nikon Corporation Stage unit, drive table, and scanning exposure apparatus using the same
JP3484684B2 (ja) 1994-11-01 2004-01-06 株式会社ニコン ステージ装置及び走査型露光装置
US5623853A (en) 1994-10-19 1997-04-29 Nikon Precision Inc. Precision motion stage with single guide beam and follower stage
JPH08316125A (ja) 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
JPH08316124A (ja) * 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
JPH09232213A (ja) * 1996-02-26 1997-09-05 Nikon Corp 投影露光装置
JP3658846B2 (ja) 1996-03-27 2005-06-08 株式会社ニコン 投影露光装置
JP3661291B2 (ja) * 1996-08-01 2005-06-15 株式会社ニコン 露光装置
JP3695000B2 (ja) * 1996-08-08 2005-09-14 株式会社ニコン 露光方法及び露光装置
US5825043A (en) 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
JP4029182B2 (ja) 1996-11-28 2008-01-09 株式会社ニコン 露光方法
SG102627A1 (en) 1996-11-28 2004-03-26 Nikon Corp Lithographic device
JP4029183B2 (ja) 1996-11-28 2008-01-09 株式会社ニコン 投影露光装置及び投影露光方法
WO1998028665A1 (en) 1996-12-24 1998-07-02 Koninklijke Philips Electronics N.V. Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device
JPH10208994A (ja) 1997-01-16 1998-08-07 Nec Corp 露光方法及び露光装置
JP3747566B2 (ja) * 1997-04-23 2006-02-22 株式会社ニコン 液浸型露光装置
JP3817836B2 (ja) 1997-06-10 2006-09-06 株式会社ニコン 露光装置及びその製造方法並びに露光方法及びデバイス製造方法
JPH1116816A (ja) 1997-06-25 1999-01-22 Nikon Corp 投影露光装置、該装置を用いた露光方法、及び該装置を用いた回路デバイスの製造方法
JPH11135407A (ja) * 1997-10-28 1999-05-21 Nikon Corp 露光方法および装置
JP4210871B2 (ja) 1997-10-31 2009-01-21 株式会社ニコン 露光装置
US6020964A (en) 1997-12-02 2000-02-01 Asm Lithography B.V. Interferometer system and lithograph apparatus including an interferometer system
JPH11168056A (ja) * 1997-12-03 1999-06-22 Nikon Corp ウェハ保持装置
JPH11176727A (ja) 1997-12-11 1999-07-02 Nikon Corp 投影露光装置
AU1682899A (en) 1997-12-18 1999-07-05 Nikon Corporation Stage device and exposure apparatus
JP4264676B2 (ja) 1998-11-30 2009-05-20 株式会社ニコン 露光装置及び露光方法
US6897963B1 (en) * 1997-12-18 2005-05-24 Nikon Corporation Stage device and exposure apparatus
US6208407B1 (en) 1997-12-22 2001-03-27 Asm Lithography B.V. Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement
WO1999049504A1 (fr) * 1998-03-26 1999-09-30 Nikon Corporation Procede et systeme d'exposition par projection
JPH11307430A (ja) 1998-04-23 1999-11-05 Canon Inc 露光装置およびデバイス製造方法ならびに駆動装置
WO1999060616A1 (fr) * 1998-05-15 1999-11-25 Nikon Corporation Procede et dispositif d'exposition
EP1079223A4 (en) 1998-05-19 2002-11-27 Nikon Corp INSTRUMENT AND METHOD FOR MEASURING ABERATIONS, PROJECTION DEVICE INCLUDING THIS INSTRUMENT AND ITS MANUFACTURING METHOD
US6819414B1 (en) * 1998-05-19 2004-11-16 Nikon Corporation Aberration measuring apparatus, aberration measuring method, projection exposure apparatus having the same measuring apparatus, device manufacturing method using the same measuring method, and exposure method
JP2000058436A (ja) 1998-08-11 2000-02-25 Nikon Corp 投影露光装置及び露光方法
US7116401B2 (en) * 1999-03-08 2006-10-03 Asml Netherlands B.V. Lithographic projection apparatus using catoptrics in an optical sensor system, optical arrangement, method of measuring, and device manufacturing method
TW490596B (en) 1999-03-08 2002-06-11 Asm Lithography Bv Lithographic projection apparatus, method of manufacturing a device using the lithographic projection apparatus, device manufactured according to the method and method of calibrating the lithographic projection apparatus
TW513617B (en) 1999-04-21 2002-12-11 Asml Corp Lithographic projection apparatus and method of manufacturing a device using a lithographic projection apparatus
KR20010026371A (ko) 1999-09-06 2001-04-06 윤종용 웨이퍼 냉각 수단을 구비하는 노광장치 및 이를 이용한 노광방법
WO2001035168A1 (en) 1999-11-10 2001-05-17 Massachusetts Institute Of Technology Interference lithography utilizing phase-locked scanning beams
JP2001267239A (ja) * 2000-01-14 2001-09-28 Nikon Corp 露光方法及び装置、並びにデバイス製造方法
EP1124161A3 (en) 2000-02-10 2004-01-07 ASML Netherlands B.V. Lithographic projection apparatus having a temperature controlled heat shield
JP2001332490A (ja) 2000-03-14 2001-11-30 Nikon Corp 位置合わせ方法、露光方法、露光装置、及びデバイス製造方法
JP2002198303A (ja) 2000-12-27 2002-07-12 Nikon Corp 露光装置、光学特性計測方法、及びデバイス製造方法
US20020041377A1 (en) * 2000-04-25 2002-04-11 Nikon Corporation Aerial image measurement method and unit, optical properties measurement method and unit, adjustment method of projection optical system, exposure method and apparatus, making method of exposure apparatus, and device manufacturing method
JP2002014005A (ja) 2000-04-25 2002-01-18 Nikon Corp 空間像計測方法、結像特性計測方法、空間像計測装置及び露光装置
JP2002005586A (ja) 2000-06-23 2002-01-09 Canon Inc 物体温度調節用熱交換装置、該熱交換装置を使用して製造した投影レンズ及び該熱交換装置を使用した光学系を具備する装置
JP4692862B2 (ja) 2000-08-28 2011-06-01 株式会社ニコン 検査装置、該検査装置を備えた露光装置、およびマイクロデバイスの製造方法
JP2002231622A (ja) * 2000-11-29 2002-08-16 Nikon Corp ステージ装置及び露光装置
EP1231514A1 (en) * 2001-02-13 2002-08-14 Asm Lithography B.V. Measurement of wavefront aberrations in a lithographic projection apparatus
EP1364257A1 (en) 2001-02-27 2003-11-26 ASML US, Inc. Simultaneous imaging of two reticles
TW529172B (en) * 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
US20050088634A1 (en) * 2002-03-15 2005-04-28 Nikon Corporation Exposure system and device production process
TWI300953B (en) 2002-03-15 2008-09-11 Nikon Corp Exposure system and device manufacturing process
JP2005536775A (ja) 2002-08-23 2005-12-02 株式会社ニコン 投影光学系、フォトリソグラフィ方法および露光装置、並びに露光装置を用いた方法
SG121822A1 (en) * 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
SG121819A1 (en) * 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP1420298B1 (en) 2002-11-12 2013-02-20 ASML Netherlands B.V. Lithographic apparatus
CN101382738B (zh) * 2002-11-12 2011-01-12 Asml荷兰有限公司 光刻投射装置
KR100585476B1 (ko) 2002-11-12 2006-06-07 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 디바이스 제조방법
DE10257766A1 (de) * 2002-12-10 2004-07-15 Carl Zeiss Smt Ag Verfahren zur Einstellung einer gewünschten optischen Eigenschaft eines Projektionsobjektivs sowie mikrolithografische Projektionsbelichtungsanlage
ATE424026T1 (de) 2002-12-13 2009-03-15 Koninkl Philips Electronics Nv Flüssigkeitsentfernung in einem verfahren und einer einrichtung zum bestrahlen von flecken auf einer schicht
EP1732075A3 (en) 2002-12-19 2007-02-21 Koninklijke Philips Electronics N.V. Method and device for irradiating spots on a layer
CN100437358C (zh) * 2003-05-15 2008-11-26 株式会社尼康 曝光装置及器件制造方法
US6867844B2 (en) * 2003-06-19 2005-03-15 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
SG109000A1 (en) * 2003-07-16 2005-02-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP1498781B1 (en) * 2003-07-16 2019-04-17 ASML Netherlands B.V. Immersion lithographic apparatus and device manufacturing method
WO2005029559A1 (ja) 2003-09-19 2005-03-31 Nikon Corporation 露光装置及びデバイス製造方法
TWI598934B (zh) * 2003-10-09 2017-09-11 尼康股份有限公司 Exposure apparatus, exposure method, and device manufacturing method
DE602004030365D1 (de) 2003-10-22 2011-01-13 Nippon Kogaku Kk Belichtungsvorrichtung, belichtungsverfahren und verfahren zur bauelementeherstellung
EP2717295B1 (en) * 2003-12-03 2018-07-18 Nikon Corporation Exposure apparatus, exposure method, and method for producing a device
JP4371822B2 (ja) * 2004-01-06 2009-11-25 キヤノン株式会社 露光装置
JP4429023B2 (ja) * 2004-01-07 2010-03-10 キヤノン株式会社 露光装置及びデバイス製造方法
CN1938646B (zh) 2004-01-20 2010-12-15 卡尔蔡司Smt股份公司 曝光装置和用于投影透镜的测量装置
EP1713115B1 (en) 2004-02-04 2016-05-04 Nikon Corporation Exposure apparatus, exposure method, and device producing method
WO2005122218A1 (ja) * 2004-06-09 2005-12-22 Nikon Corporation 露光装置及びデバイス製造方法
JP5130609B2 (ja) 2004-06-10 2013-01-30 株式会社ニコン 露光装置及び露光方法、並びにデバイス製造方法
JP4515335B2 (ja) 2004-06-10 2010-07-28 株式会社ニコン 露光装置、ノズル部材、及びデバイス製造方法
US7304715B2 (en) * 2004-08-13 2007-12-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7701550B2 (en) * 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20080106718A1 (en) 2004-12-02 2008-05-08 Nikon Corporation Exposure Apparatus and Device Manufacturing Method
WO2006062065A1 (ja) * 2004-12-06 2006-06-15 Nikon Corporation メンテナンス方法、メンテナンス機器、露光装置、及びデバイス製造方法
US20070132976A1 (en) * 2005-03-31 2007-06-14 Nikon Corporation Exposure apparatus, exposure method, and method for producing device

Similar Documents

Publication Publication Date Title
JP2018156096A5 (2)
JP2017027088A5 (2)
JP2012080137A5 (2)
JP2015212827A5 (2)
JP2012164992A5 (2)
JP2012142592A5 (ja) 露光装置、ステージの制御方法
JP2012134552A5 (ja) ノズル部材、露光装置、デバイス製造方法、及び露光方法。
JP2012138624A5 (ja) 液浸リソグラフィ装置、及び洗浄方法
JP2011023764A5 (ja) 流路形成部材、露光装置、露光方法、及びデバイス製造方法
JP2010177693A5 (2)
JP2010199615A5 (ja) 露光方法及び露光装置
JP2008244488A5 (2)
JP2011049607A5 (2)
JP2014017526A5 (ja) リソグラフィ装置およびデバイス製造方法
JP2011223036A5 (ja) 露光装置及びデバイス製造方法
JP2016092208A5 (2)
JP2010109391A5 (2)
JP2015163463A5 (2)
JP2012129557A5 (ja) 露光方法及び露光装置、並びに液体供給方法
TWI581886B (zh) 微結構加工裝置
JP2015528132A5 (2)
JP2020198428A (ja) はみ出し制御のための枠硬化方法
JP2015062256A5 (2)
JP2015053409A5 (2)
TW201622823A (zh) 用於塗佈基板的方法及塗佈裝置