JPH02142548U - - Google Patents

Info

Publication number
JPH02142548U
JPH02142548U JP5129089U JP5129089U JPH02142548U JP H02142548 U JPH02142548 U JP H02142548U JP 5129089 U JP5129089 U JP 5129089U JP 5129089 U JP5129089 U JP 5129089U JP H02142548 U JPH02142548 U JP H02142548U
Authority
JP
Japan
Prior art keywords
connecting lead
lead part
board connecting
semiconductor device
flat plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5129089U
Other languages
English (en)
Other versions
JPH0729644Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5129089U priority Critical patent/JPH0729644Y2/ja
Publication of JPH02142548U publication Critical patent/JPH02142548U/ja
Application granted granted Critical
Publication of JPH0729644Y2 publication Critical patent/JPH0729644Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Combinations Of Printed Boards (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す半導体装置の
タブ端子の平面図、第２図は同じくその側面図、
第３図は同じくそのタブ端子を利用した半導体装
置の断面図、第４図は従来の半導体装置のタブ端
子を示す平面図、第５図は同じくその側面図、第
６図は片持ちばりのばねの長さとばね機構に加わ
る力との関係を示す図である。 Ｆ……タブ端子、１……ばね機構、２……平板
部、３……上側基板接続用リード部４……下側基
板接続用リード部、１０……上側基板、１１……
下側基板。

Claims (1)

    【実用新案登録請求の範囲】
  1. パツケージを小型化するために上側基板および
    下側基板が二段重ねされた半導体装置において、
    前記パツケージの膨張、収縮時に上側基板および
    下側基板に加わる応力を吸収するばね機構を備え
    たタブ端子であつて、外部に熱を放熱する平板部
    と、前記下側基板に接続さればね機構を有する下
    側基板接続用リード部と、前記上側基板に接続さ
    れる上側基板接続用リード部とから構成され、前
    記上側基板接続用リード部が下側基板接続用リー
    ド部とは別に平板部の側端から延設されたことを
    特徴とする半導体装置。
JP5129089U 1989-04-28 1989-04-28 半導体装置 Expired - Fee Related JPH0729644Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5129089U JPH0729644Y2 (ja) 1989-04-28 1989-04-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5129089U JPH0729644Y2 (ja) 1989-04-28 1989-04-28 半導体装置

Publications (2)

Publication Number Publication Date
JPH02142548U true JPH02142548U (ja) 1990-12-04
JPH0729644Y2 JPH0729644Y2 (ja) 1995-07-05

Family

ID=31570596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5129089U Expired - Fee Related JPH0729644Y2 (ja) 1989-04-28 1989-04-28 半導体装置

Country Status (1)

Country Link
JP (1) JPH0729644Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006245362A (ja) * 2005-03-04 2006-09-14 Mitsubishi Electric Corp 半導体装置およびこれに用いられる電極端子
JP2011205732A (ja) * 2010-03-24 2011-10-13 Autonetworks Technologies Ltd 回路構成体および電気接続箱

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006245362A (ja) * 2005-03-04 2006-09-14 Mitsubishi Electric Corp 半導体装置およびこれに用いられる電極端子
JP2011205732A (ja) * 2010-03-24 2011-10-13 Autonetworks Technologies Ltd 回路構成体および電気接続箱

Also Published As

Publication number Publication date
JPH0729644Y2 (ja) 1995-07-05

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees