JPH0250955U - - Google Patents

Info

Publication number
JPH0250955U
JPH0250955U JP13016888U JP13016888U JPH0250955U JP H0250955 U JPH0250955 U JP H0250955U JP 13016888 U JP13016888 U JP 13016888U JP 13016888 U JP13016888 U JP 13016888U JP H0250955 U JPH0250955 U JP H0250955U
Authority
JP
Japan
Prior art keywords
disk
arm
ion implantation
semiconductor substrate
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13016888U
Other languages
English (en)
Other versions
JPH0728694Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988130168U priority Critical patent/JPH0728694Y2/ja
Publication of JPH0250955U publication Critical patent/JPH0250955U/ja
Application granted granted Critical
Publication of JPH0728694Y2 publication Critical patent/JPH0728694Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【図面の簡単な説明】
第1図aは本考案の一実施例のアーム先端部の
断面図、第1図bは対向するデイスク搭載部の断
面図、第2図は、イオン注入装置のエンドステー
シヨン平面図である。 1……デイスク、5……吸込口、6……注入室
側デイスク、7……立替側デイスク、8……半導
体基板、9……アーム、10……アーム先端部、
10A……操作部、10B……吸込筒、11……
デイスク搭載台、12……排気ライン。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体基板を並べたデイスクを、アームによつ
    て交換する方式の半導体基板イオン注入装置にお
    いて、アーム先端に設け、デイスクをデイスク搭
    載台から取り外し、取りつけを行なう操作部が、
    デイスク対向面を除く全周縁を、排気ラインに連
    接する吸込筒内に収納してあることを特徴とする
    半導体基板イオン注入装置。
JP1988130168U 1988-10-03 1988-10-03 半導体基板イオン注入装置 Expired - Fee Related JPH0728694Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988130168U JPH0728694Y2 (ja) 1988-10-03 1988-10-03 半導体基板イオン注入装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988130168U JPH0728694Y2 (ja) 1988-10-03 1988-10-03 半導体基板イオン注入装置

Publications (2)

Publication Number Publication Date
JPH0250955U true JPH0250955U (ja) 1990-04-10
JPH0728694Y2 JPH0728694Y2 (ja) 1995-06-28

Family

ID=31385096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988130168U Expired - Fee Related JPH0728694Y2 (ja) 1988-10-03 1988-10-03 半導体基板イオン注入装置

Country Status (1)

Country Link
JP (1) JPH0728694Y2 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0163130U (ja) * 1987-10-16 1989-04-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0163130U (ja) * 1987-10-16 1989-04-24

Also Published As

Publication number Publication date
JPH0728694Y2 (ja) 1995-06-28

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Legal Events

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LAPS Cancellation because of no payment of annual fees