JPH0415858U - - Google Patents

Info

Publication number
JPH0415858U
JPH0415858U JP1990056749U JP5674990U JPH0415858U JP H0415858 U JPH0415858 U JP H0415858U JP 1990056749 U JP1990056749 U JP 1990056749U JP 5674990 U JP5674990 U JP 5674990U JP H0415858 U JPH0415858 U JP H0415858U
Authority
JP
Japan
Prior art keywords
semiconductor element
lead frame
element fixed
hybrid integrated
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990056749U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990056749U priority Critical patent/JPH0415858U/ja
Publication of JPH0415858U publication Critical patent/JPH0415858U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図ａ，ｂ及び第２図はａ，ｂは本考案の第
１及び第２の実施例を説明するための平面図及び
断面図、第３図ａ，ｂは従来の混成集積回路の平
面図及び断面図である。 １……リードフレーム、２……接着剤、３……
絶縁樹脂、４……配線パターン、５……マウント
樹脂、６Ａ，６Ｂ……半導体素子、７……ワイヤ
ー。

Claims (1)

    【実用新案登録請求の範囲】
  1. リードフレーム上に固着された半導体素子と、
    前記リードフレーム上に絶縁基板を介して固着さ
    れた半導体素子とを含むことを特徴とする混成集
    積回路。
JP1990056749U 1990-05-30 1990-05-30 Pending JPH0415858U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990056749U JPH0415858U (ja) 1990-05-30 1990-05-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990056749U JPH0415858U (ja) 1990-05-30 1990-05-30

Publications (1)

Publication Number Publication Date
JPH0415858U true JPH0415858U (ja) 1992-02-07

Family

ID=31580853

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990056749U Pending JPH0415858U (ja) 1990-05-30 1990-05-30

Country Status (1)

Country Link
JP (1) JPH0415858U (ja)

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