JPH0456864B2 - - Google Patents

Info

Publication number: JPH0456864B2
Authority: JP; Japan
Prior art keywords: imide; heat; resin composition; melamine; resin
Prior art date: 1984-08-10
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP16745184A

Other languages

English (en)

Japanese (ja)

Other versions

JPS6144946A (ja

Inventor

Juichi Osada

Taisuke Okada

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Resonac Corp

Original Assignee

Hitachi Chemical Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1984-08-10

Filing date

1984-08-10

Publication date

1992-09-09

1984-08-10 Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd

1984-08-10 Priority to JP16745184A priority Critical patent/JPS6144946A/ja

1986-03-04 Publication of JPS6144946A publication Critical patent/JPS6144946A/ja

1992-09-09 Publication of JPH0456864B2 publication Critical patent/JPH0456864B2/ja

Status Granted legal-status Critical Current

Links

229920000877 Melamine resin Polymers 0.000 claims description 13
JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 13
LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 9
229920001225 polyester resin Polymers 0.000 claims description 4
239000004645 polyester resin Substances 0.000 claims description 4
239000011342 resin composition Substances 0.000 description 19
YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
229920003055 poly(ester-imide) Polymers 0.000 description 15
229920005989 resin Polymers 0.000 description 15
239000011347 resin Substances 0.000 description 15
239000002253 acid Substances 0.000 description 14
239000002966 varnish Substances 0.000 description 13
229920006015 heat resistant resin Polymers 0.000 description 12
QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 9
LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
229930003836 cresol Natural products 0.000 description 9
150000003949 imides Chemical class 0.000 description 7
KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 6
WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 6
238000004519 manufacturing process Methods 0.000 description 6
239000002904 solvent Substances 0.000 description 5
SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 5
239000004962 Polyamide-imide Substances 0.000 description 4
YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 4
238000006243 chemical reaction Methods 0.000 description 4
239000005011 phenolic resin Substances 0.000 description 4
229920002312 polyamide-imide Polymers 0.000 description 4
WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 4
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
150000001298 alcohols Chemical class 0.000 description 3
150000004985 diamines Chemical class 0.000 description 3
ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 3
238000005886 esterification reaction Methods 0.000 description 3
150000002148 esters Chemical class 0.000 description 3
238000001879 gelation Methods 0.000 description 3
239000007788 liquid Substances 0.000 description 3
239000000203 mixture Substances 0.000 description 3
229920000728 polyester Polymers 0.000 description 3
238000010992 reflux Methods 0.000 description 3
KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
-1 aliphatic diamines Chemical class 0.000 description 2
150000004984 aromatic diamines Chemical class 0.000 description 2
230000015572 biosynthetic process Effects 0.000 description 2
WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
238000007796 conventional method Methods 0.000 description 2
230000007423 decrease Effects 0.000 description 2
230000006866 deterioration Effects 0.000 description 2
239000012975 dibutyltin dilaurate Substances 0.000 description 2
125000005442 diisocyanate group Chemical group 0.000 description 2
230000032050 esterification Effects 0.000 description 2
238000010438 heat treatment Methods 0.000 description 2
NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
229920001568 phenolic resin Polymers 0.000 description 2
230000035939 shock Effects 0.000 description 2
238000003786 synthesis reaction Methods 0.000 description 2
VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 2
WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
LCANECIWPMDASZ-UHFFFAOYSA-N 2-isocyanatoethanol Chemical compound OCCN=C=O LCANECIWPMDASZ-UHFFFAOYSA-N 0.000 description 1
UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
MUXOBHXGJLMRAB-UHFFFAOYSA-N Dimethyl succinate Chemical compound COC(=O)CCC(=O)OC MUXOBHXGJLMRAB-UHFFFAOYSA-N 0.000 description 1
SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
239000004642 Polyimide Substances 0.000 description 1
ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
XDODWINGEHBYRT-UHFFFAOYSA-N [2-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCCCC1CO XDODWINGEHBYRT-UHFFFAOYSA-N 0.000 description 1
229920003180 amino resin Polymers 0.000 description 1
150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
239000003054 catalyst Substances 0.000 description 1
230000000052 comparative effect Effects 0.000 description 1
239000004020 conductor Substances 0.000 description 1
229910052802 copper Inorganic materials 0.000 description 1
239000010949 copper Substances 0.000 description 1
239000006184 cosolvent Substances 0.000 description 1
JXCHMDATRWUOAP-UHFFFAOYSA-N diisocyanatomethylbenzene Chemical compound O=C=NC(N=C=O)C1=CC=CC=C1 JXCHMDATRWUOAP-UHFFFAOYSA-N 0.000 description 1
VNGOYPQMJFJDLV-UHFFFAOYSA-N dimethyl benzene-1,3-dicarboxylate Chemical compound COC(=O)C1=CC=CC(C(=O)OC)=C1 VNGOYPQMJFJDLV-UHFFFAOYSA-N 0.000 description 1
238000004821 distillation Methods 0.000 description 1
230000000694 effects Effects 0.000 description 1
238000011156 evaluation Methods 0.000 description 1
235000011187 glycerol Nutrition 0.000 description 1
229940046892 lead acetate Drugs 0.000 description 1
229940018564 m-phenylenediamine Drugs 0.000 description 1
239000000463 material Substances 0.000 description 1
229910052751 metal Inorganic materials 0.000 description 1
239000002184 metal Substances 0.000 description 1
238000002156 mixing Methods 0.000 description 1
SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
150000007524 organic acids Chemical class 0.000 description 1
125000000962 organic group Chemical group 0.000 description 1
239000003973 paint Substances 0.000 description 1
WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
239000002798 polar solvent Substances 0.000 description 1
229920002492 poly(sulfone) Polymers 0.000 description 1
229920006122 polyamide resin Polymers 0.000 description 1
229920001721 polyimide Polymers 0.000 description 1
229920001228 polyisocyanate Polymers 0.000 description 1
239000005056 polyisocyanate Substances 0.000 description 1
125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
150000003839 salts Chemical class 0.000 description 1
238000001308 synthesis method Methods 0.000 description 1
150000003609 titanium compounds Chemical class 0.000 description 1
238000005809 transesterification reaction Methods 0.000 description 1
239000008096 xylene Substances 0.000 description 1
125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1

Landscapes

Organic Insulating Materials (AREA)
Compositions Of Macromolecular Compounds (AREA)
Polyesters Or Polycarbonates (AREA)
Paints Or Removers (AREA)

JP16745184A 1984-08-10 1984-08-10 耐熱性樹脂組成物 Granted JPS6144946A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP16745184A JPS6144946A (ja)	1984-08-10	1984-08-10	耐熱性樹脂組成物

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP16745184A JPS6144946A (ja)	1984-08-10	1984-08-10	耐熱性樹脂組成物

Publications (2)

Publication Number	Publication Date
JPS6144946A JPS6144946A (ja)	1986-03-04
JPH0456864B2 true JPH0456864B2 (pt)	1992-09-09

Family

ID=15849935

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP16745184A Granted JPS6144946A (ja)	1984-08-10	1984-08-10	耐熱性樹脂組成物

Country Status (1)

Country	Link
JP (1)	JPS6144946A (pt)

1984
- 1984-08-10 JP JP16745184A patent/JPS6144946A/ja active Granted

Also Published As

Publication number	Publication date
JPS6144946A (ja)	1986-03-04

Publication	Publication Date	Title
JPS5836018B2 (ja)	1983-08-06	耐熱性樹脂の製造法
JPH0456864B2 (pt)	1992-09-09
JPS5812900B2 (ja)	1983-03-10	水溶性ポリエステル−イミド樹脂
JP2570207B2 (ja)	1997-01-08	エナメル線
JPS61136550A (ja)	1986-06-24	耐熱性樹脂組成物
JP4399912B2 (ja)	2010-01-20	電気絶縁用樹脂組成物及びこれを用いた絶縁電線
JPH02142853A (ja)	1990-05-31	はんだ付け性を有する樹脂組成物およびこれを用いた絶縁電線
JPH0430423B2 (pt)	1992-05-21
JPH11116895A (ja)	1999-04-27	缶用塗料樹脂組成物
JPH0786134B2 (ja)	1995-09-20	耐熱性樹脂の製造法およびこの耐熱性樹脂を用いた耐熱性樹脂組成物
JPS62197449A (ja)	1987-09-01	耐熱性樹脂組成物
JPS5962662A (ja)	1984-04-10	耐熱性樹脂組成物
JP2000129207A (ja)	2000-05-09	塗料用樹脂組成物
JPH07166054A (ja)	1995-06-27	樹脂組成物およびこれを用いた絶縁電線
JPS5927921A (ja)	1984-02-14	耐熱性樹脂の製造法
JPH05331367A (ja)	1993-12-14	樹脂組成物及びこれを用いた絶縁電線
JPS63189456A (ja)	1988-08-05	はんだ付け性を有する樹脂組成物
JPH0413371B2 (pt)	1992-03-09
JPH06279675A (ja)	1994-10-04	樹脂組成物および絶縁電線
JP4117525B2 (ja)	2008-07-16	電気絶縁用樹脂組成物及びエナメル線
JPS63186764A (ja)	1988-08-02	耐熱性樹脂組成物
JPH0333121A (ja)	1991-02-13	樹脂組成物およびこれを用いた絶縁電線
JPS58174441A (ja)	1983-10-13	耐熱性樹脂組成物
JPH0827244A (ja)	1996-01-30	電気絶縁用樹脂組成物およびエナメル線
JPH05186683A (ja)	1993-07-27	はんだ付け性を有する樹脂組成物及びこれを用いた絶縁電線