JPH0517716B2 - - Google Patents

Info

Publication number: JPH0517716B2
Authority: JP; Japan
Prior art keywords: circuit conductor; printed wiring; wiring board; heat dissipation; film
Prior art date: 1987-09-19
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

JP23576387A

Other languages

English (en)

Japanese (ja)

Other versions

JPS6477987A (en

Inventor

Shin Kawakami

Satoru Haruyama

Hirotaka Okonogi

Katsutomo Nikaido

Norihito Mukai

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Nippon CMK Corp

Original Assignee

Nippon CMK Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1987-09-19

Filing date

1987-09-19

Publication date

1993-03-09

1987-09-19 Application filed by Nippon CMK Corp filed Critical Nippon CMK Corp

1987-09-19 Priority to JP23576387A priority Critical patent/JPS6477987A/ja

1988-03-29 Priority to US07/194,841 priority patent/US4859805A/en

1988-04-02 Priority to DE3850626T priority patent/DE3850626D1/de

1988-04-02 Priority to EP88105342A priority patent/EP0308576B1/en

1989-03-23 Publication of JPS6477987A publication Critical patent/JPS6477987A/ja

1993-03-09 Publication of JPH0517716B2 publication Critical patent/JPH0517716B2/ja

Status Granted legal-status Critical Current

Links

239000004020 conductor Substances 0.000 claims description 36
230000017525 heat dissipation Effects 0.000 claims description 28
238000000576 coating method Methods 0.000 claims description 13
239000011248 coating agent Substances 0.000 claims description 12
239000000758 substrate Substances 0.000 claims description 5
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 2
239000000919 ceramic Substances 0.000 claims description 2
229910052802 copper Inorganic materials 0.000 claims description 2
239000010949 copper Substances 0.000 claims description 2
229910010272 inorganic material Inorganic materials 0.000 claims description 2
239000011147 inorganic material Substances 0.000 claims description 2
239000002184 metal Substances 0.000 claims description 2
229910052751 metal Inorganic materials 0.000 claims description 2
229910052759 nickel Inorganic materials 0.000 claims description 2
230000000694 effects Effects 0.000 description 8
238000010438 heat treatment Methods 0.000 description 6
230000007257 malfunction Effects 0.000 description 3
230000003247 decreasing effect Effects 0.000 description 2
239000011889 copper foil Substances 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
238000005530 etching Methods 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1

Landscapes

Structure Of Printed Boards (AREA)

JP23576387A 1987-09-19 1987-09-19 Printed wiring board Granted JPS6477987A (en)

Priority Applications (4)

Application Number	Priority Date	Filing Date	Title
JP23576387A JPS6477987A (en)	1987-09-19	1987-09-19	Printed wiring board
US07/194,841 US4859805A (en)	1987-09-19	1988-03-29	Printed wiring board
DE3850626T DE3850626D1 (de)	1987-09-19	1988-04-02	Leiterplatte.
EP88105342A EP0308576B1 (en)	1987-09-19	1988-04-02	A printed wiring board

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP23576387A JPS6477987A (en)	1987-09-19	1987-09-19	Printed wiring board

Publications (2)

Publication Number	Publication Date
JPS6477987A JPS6477987A (en)	1989-03-23
JPH0517716B2 true JPH0517716B2 (it)	1993-03-09

Family

ID=16990874

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP23576387A Granted JPS6477987A (en)	1987-09-19	1987-09-19	Printed wiring board

Country Status (1)

Country	Link
JP (1)	JPS6477987A (it)

1987
- 1987-09-19 JP JP23576387A patent/JPS6477987A/ja active Granted

Also Published As

Publication number	Publication date
JPS6477987A (en)	1989-03-23

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Legal Events

Date	Code	Title	Description
2005-01-25	R250	Receipt of annual fees	Free format text: JAPANESE INTERMEDIATE CODE: R250
2006-03-09	LAPS	Cancellation because of no payment of annual fees