JPH0517717B2 - - Google Patents
Info
- Publication number
- JPH0517717B2 JPH0517717B2 JP23576487A JP23576487A JPH0517717B2 JP H0517717 B2 JPH0517717 B2 JP H0517717B2 JP 23576487 A JP23576487 A JP 23576487A JP 23576487 A JP23576487 A JP 23576487A JP H0517717 B2 JPH0517717 B2 JP H0517717B2
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- printed wiring
- wiring board
- circuit conductor
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004020 conductor Substances 0.000 claims description 36
- 230000017525 heat dissipation Effects 0.000 claims description 31
- 238000000576 coating method Methods 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910010272 inorganic material Inorganic materials 0.000 claims description 2
- 239000011147 inorganic material Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 6
- 230000007257 malfunction Effects 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23576487A JPS6480095A (en) | 1987-09-19 | 1987-09-19 | Printed wiring board |
| US07/194,841 US4859805A (en) | 1987-09-19 | 1988-03-29 | Printed wiring board |
| DE3850626T DE3850626D1 (de) | 1987-09-19 | 1988-04-02 | Leiterplatte. |
| EP88105342A EP0308576B1 (de) | 1987-09-19 | 1988-04-02 | Leiterplatte |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23576487A JPS6480095A (en) | 1987-09-19 | 1987-09-19 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6480095A JPS6480095A (en) | 1989-03-24 |
| JPH0517717B2 true JPH0517717B2 (de) | 1993-03-09 |
Family
ID=16990888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23576487A Granted JPS6480095A (en) | 1987-09-19 | 1987-09-19 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6480095A (de) |
-
1987
- 1987-09-19 JP JP23576487A patent/JPS6480095A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6480095A (en) | 1989-03-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |