JPS5898939A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5898939A
JPS5898939A JP56198117A JP19811781A JPS5898939A JP S5898939 A JPS5898939 A JP S5898939A JP 56198117 A JP56198117 A JP 56198117A JP 19811781 A JP19811781 A JP 19811781A JP S5898939 A JPS5898939 A JP S5898939A
Authority
JP
Japan
Prior art keywords
film
silicon nitride
bonding pad
pad
phosphosilicate glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56198117A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0139215B2 (2
Inventor
Koji Nose
幸之 野世
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp, Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electronics Corp
Priority to JP56198117A priority Critical patent/JPS5898939A/ja
Publication of JPS5898939A publication Critical patent/JPS5898939A/ja
Publication of JPH0139215B2 publication Critical patent/JPH0139215B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/694—Inorganic materials composed of nitrides
    • H10P14/6943—Inorganic materials composed of nitrides containing silicon
    • H10P14/69433—Inorganic materials composed of nitrides containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Local Oxidation Of Silicon (AREA)
  • Wire Bonding (AREA)
JP56198117A 1981-12-08 1981-12-08 半導体装置 Granted JPS5898939A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56198117A JPS5898939A (ja) 1981-12-08 1981-12-08 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56198117A JPS5898939A (ja) 1981-12-08 1981-12-08 半導体装置

Publications (2)

Publication Number Publication Date
JPS5898939A true JPS5898939A (ja) 1983-06-13
JPH0139215B2 JPH0139215B2 (2) 1989-08-18

Family

ID=16385742

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56198117A Granted JPS5898939A (ja) 1981-12-08 1981-12-08 半導体装置

Country Status (1)

Country Link
JP (1) JPS5898939A (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5367125A (en) * 1989-01-20 1994-11-22 Dassault Electronique Aluminum based article having an insert with vitreous material hermetically sealed thereto
US5538527A (en) * 1989-01-20 1996-07-23 Dassault Electronique Method of sealing glass to aluminum, particularly for electrical feed-through connectors

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5796542A (en) * 1980-12-08 1982-06-15 Nec Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5796542A (en) * 1980-12-08 1982-06-15 Nec Corp Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5367125A (en) * 1989-01-20 1994-11-22 Dassault Electronique Aluminum based article having an insert with vitreous material hermetically sealed thereto
US5538527A (en) * 1989-01-20 1996-07-23 Dassault Electronique Method of sealing glass to aluminum, particularly for electrical feed-through connectors

Also Published As

Publication number Publication date
JPH0139215B2 (2) 1989-08-18

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