JPS6040163A - 電子部品の改良封入成形法 - Google Patents
電子部品の改良封入成形法Info
- Publication number
- JPS6040163A JPS6040163A JP15416284A JP15416284A JPS6040163A JP S6040163 A JPS6040163 A JP S6040163A JP 15416284 A JP15416284 A JP 15416284A JP 15416284 A JP15416284 A JP 15416284A JP S6040163 A JPS6040163 A JP S6040163A
- Authority
- JP
- Japan
- Prior art keywords
- molding
- polymer
- melt
- encapsulation
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US51787083A | 1983-07-27 | 1983-07-27 | |
| US619608 | 1990-11-29 | ||
| US517870 | 2000-03-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6040163A true JPS6040163A (ja) | 1985-03-02 |
| JPH0535189B2 JPH0535189B2 (de) | 1993-05-25 |
Family
ID=24061570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15416284A Granted JPS6040163A (ja) | 1983-07-27 | 1984-07-26 | 電子部品の改良封入成形法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6040163A (de) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62135516A (ja) * | 1985-12-09 | 1987-06-18 | Polyplastics Co | 電気部品封止剤 |
| JPS62203540A (ja) * | 1986-03-03 | 1987-09-08 | Polyplastics Co | 電動機ロ−タ− |
| JPS63146958A (ja) * | 1986-12-10 | 1988-06-18 | Polyplastics Co | 表面特性の良好な液晶性ポリエステル樹脂組成物 |
| JPS63162753A (ja) * | 1986-12-26 | 1988-07-06 | Polyplastics Co | ポリエステル樹脂組成物 |
| JPS63199758A (ja) * | 1987-01-16 | 1988-08-18 | インペリアル ケミカル インダストリーズ パブリック リミティド カンパニー | サーモトロピックポリマー組成物 |
| JPS63227041A (ja) * | 1987-03-17 | 1988-09-21 | Matsushita Electronics Corp | 固体装置 |
| JPH0192241A (ja) * | 1987-10-02 | 1989-04-11 | Polyplastics Co | 液晶性ポリエステル樹脂成形品の表面処理法 |
| JPH0192263A (ja) * | 1987-10-02 | 1989-04-11 | Kuraray Co Ltd | 電子部品用封止剤 |
| JPH01163257A (ja) * | 1987-09-11 | 1989-06-27 | Polyplastics Co | 低応力封止材 |
| JPH01190749A (ja) * | 1988-01-26 | 1989-07-31 | Toyobo Co Ltd | 熱可塑性樹脂組成物 |
| JPH02145642A (ja) * | 1988-11-28 | 1990-06-05 | Mitsubishi Kasei Corp | 樹脂組成物 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE602004021085D1 (de) * | 2004-03-11 | 2009-06-25 | Corning Inc | Keramikzusammensetzung mit einem Silsesquioxanpolymer |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4067852A (en) * | 1976-05-13 | 1978-01-10 | Celanese Corporation | Melt processable thermotropic wholly aromatic polyester containing polybenzoyl units |
| JPS5477691A (en) * | 1977-10-20 | 1979-06-21 | Celanese Corp | Polyester composed of 66hydroxyy 22naphtoic acid and pphydroxy benzoic acid* which enable melt processing to be easy |
| JPS5522816A (en) * | 1978-08-04 | 1980-02-18 | Hitachi Ltd | Resin sealed electronic parts |
| JPS5584321A (en) * | 1978-12-19 | 1980-06-25 | Sumitomo Chem Co Ltd | Oxybenzoyl polyester component used under high frequency |
| JPS5717153A (en) * | 1980-07-04 | 1982-01-28 | Asahi Glass Co Ltd | Sealing method of electronic parts |
| JPS5778455A (en) * | 1980-07-16 | 1982-05-17 | Ici Ltd | Formed article containing polymer showing anisotropy in molten state and formation thereof |
| JPS57135830A (en) * | 1981-02-13 | 1982-08-21 | Sumitomo Chem Co Ltd | Production of aromatic polyester |
| JPS5823445A (ja) * | 1981-08-06 | 1983-02-12 | Japan Steel Works Ltd:The | 電子部品の封止方法 |
| JPS5823446A (ja) * | 1981-08-06 | 1983-02-12 | Japan Steel Works Ltd:The | 半導体の樹脂封止方法 |
| JPS5827326A (ja) * | 1981-08-11 | 1983-02-18 | Japan Steel Works Ltd:The | Ｉｃチツプの樹脂封止方法 |
-
1984
- 1984-07-26 JP JP15416284A patent/JPS6040163A/ja active Granted
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4067852A (en) * | 1976-05-13 | 1978-01-10 | Celanese Corporation | Melt processable thermotropic wholly aromatic polyester containing polybenzoyl units |
| JPS5477691A (en) * | 1977-10-20 | 1979-06-21 | Celanese Corp | Polyester composed of 66hydroxyy 22naphtoic acid and pphydroxy benzoic acid* which enable melt processing to be easy |
| JPS5522816A (en) * | 1978-08-04 | 1980-02-18 | Hitachi Ltd | Resin sealed electronic parts |
| JPS5584321A (en) * | 1978-12-19 | 1980-06-25 | Sumitomo Chem Co Ltd | Oxybenzoyl polyester component used under high frequency |
| JPS5717153A (en) * | 1980-07-04 | 1982-01-28 | Asahi Glass Co Ltd | Sealing method of electronic parts |
| JPS5778455A (en) * | 1980-07-16 | 1982-05-17 | Ici Ltd | Formed article containing polymer showing anisotropy in molten state and formation thereof |
| JPS57135830A (en) * | 1981-02-13 | 1982-08-21 | Sumitomo Chem Co Ltd | Production of aromatic polyester |
| JPS5823445A (ja) * | 1981-08-06 | 1983-02-12 | Japan Steel Works Ltd:The | 電子部品の封止方法 |
| JPS5823446A (ja) * | 1981-08-06 | 1983-02-12 | Japan Steel Works Ltd:The | 半導体の樹脂封止方法 |
| JPS5827326A (ja) * | 1981-08-11 | 1983-02-18 | Japan Steel Works Ltd:The | Ｉｃチツプの樹脂封止方法 |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62135516A (ja) * | 1985-12-09 | 1987-06-18 | Polyplastics Co | 電気部品封止剤 |
| JPS62203540A (ja) * | 1986-03-03 | 1987-09-08 | Polyplastics Co | 電動機ロ−タ− |
| JPS63146958A (ja) * | 1986-12-10 | 1988-06-18 | Polyplastics Co | 表面特性の良好な液晶性ポリエステル樹脂組成物 |
| JPS63162753A (ja) * | 1986-12-26 | 1988-07-06 | Polyplastics Co | ポリエステル樹脂組成物 |
| JPS63199758A (ja) * | 1987-01-16 | 1988-08-18 | インペリアル ケミカル インダストリーズ パブリック リミティド カンパニー | サーモトロピックポリマー組成物 |
| JPS63227041A (ja) * | 1987-03-17 | 1988-09-21 | Matsushita Electronics Corp | 固体装置 |
| JPH01163257A (ja) * | 1987-09-11 | 1989-06-27 | Polyplastics Co | 低応力封止材 |
| JPH0192241A (ja) * | 1987-10-02 | 1989-04-11 | Polyplastics Co | 液晶性ポリエステル樹脂成形品の表面処理法 |
| JPH0192263A (ja) * | 1987-10-02 | 1989-04-11 | Kuraray Co Ltd | 電子部品用封止剤 |
| JPH01190749A (ja) * | 1988-01-26 | 1989-07-31 | Toyobo Co Ltd | 熱可塑性樹脂組成物 |
| JPH02145642A (ja) * | 1988-11-28 | 1990-06-05 | Mitsubishi Kasei Corp | 樹脂組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0535189B2 (de) | 1993-05-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |