JPS6040163A - 電子部品の改良封入成形法 - Google Patents

電子部品の改良封入成形法

Info

Publication number
JPS6040163A
JPS6040163A JP15416284A JP15416284A JPS6040163A JP S6040163 A JPS6040163 A JP S6040163A JP 15416284 A JP15416284 A JP 15416284A JP 15416284 A JP15416284 A JP 15416284A JP S6040163 A JPS6040163 A JP S6040163A
Authority
JP
Japan
Prior art keywords
molding
polymer
melt
encapsulation
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15416284A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0535189B2 (fr
Inventor
ナンシー・シー・アイクマン
チヤールズ・イー・マクチエスニー
ゲーリー・イー・ウイリアムズ
ヒヤンナン・ユーン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Celanese Corp
Original Assignee
Celanese Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Celanese Corp filed Critical Celanese Corp
Publication of JPS6040163A publication Critical patent/JPS6040163A/ja
Publication of JPH0535189B2 publication Critical patent/JPH0535189B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Organic Insulating Materials (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP15416284A 1983-07-27 1984-07-26 電子部品の改良封入成形法 Granted JPS6040163A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US51787083A 1983-07-27 1983-07-27
US619608 1990-11-29
US517870 2000-03-02

Publications (2)

Publication Number Publication Date
JPS6040163A true JPS6040163A (ja) 1985-03-02
JPH0535189B2 JPH0535189B2 (fr) 1993-05-25

Family

ID=24061570

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15416284A Granted JPS6040163A (ja) 1983-07-27 1984-07-26 電子部品の改良封入成形法

Country Status (1)

Country Link
JP (1) JPS6040163A (fr)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62135516A (ja) * 1985-12-09 1987-06-18 Polyplastics Co 電気部品封止剤
JPS62203540A (ja) * 1986-03-03 1987-09-08 Polyplastics Co 電動機ロ−タ−
JPS63146958A (ja) * 1986-12-10 1988-06-18 Polyplastics Co 表面特性の良好な液晶性ポリエステル樹脂組成物
JPS63162753A (ja) * 1986-12-26 1988-07-06 Polyplastics Co ポリエステル樹脂組成物
JPS63199758A (ja) * 1987-01-16 1988-08-18 インペリアル　ケミカル　インダストリーズ　パブリック　リミティド　カンパニー サーモトロピックポリマー組成物
JPS63227041A (ja) * 1987-03-17 1988-09-21 Matsushita Electronics Corp 固体装置
JPH0192241A (ja) * 1987-10-02 1989-04-11 Polyplastics Co 液晶性ポリエステル樹脂成形品の表面処理法
JPH0192263A (ja) * 1987-10-02 1989-04-11 Kuraray Co Ltd 電子部品用封止剤
JPH01163257A (ja) * 1987-09-11 1989-06-27 Polyplastics Co 低応力封止材
JPH01190749A (ja) * 1988-01-26 1989-07-31 Toyobo Co Ltd 熱可塑性樹脂組成物
JPH02145642A (ja) * 1988-11-28 1990-06-05 Mitsubishi Kasei Corp 樹脂組成物

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602004021085D1 (de) * 2004-03-11 2009-06-25 Corning Inc Keramikzusammensetzung mit einem Silsesquioxanpolymer

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4067852A (en) * 1976-05-13 1978-01-10 Celanese Corporation Melt processable thermotropic wholly aromatic polyester containing polybenzoyl units
JPS5477691A (en) * 1977-10-20 1979-06-21 Celanese Corp Polyester composed of 66hydroxyy 22naphtoic acid and pphydroxy benzoic acid* which enable melt processing to be easy
JPS5522816A (en) * 1978-08-04 1980-02-18 Hitachi Ltd Resin sealed electronic parts
JPS5584321A (en) * 1978-12-19 1980-06-25 Sumitomo Chem Co Ltd Oxybenzoyl polyester component used under high frequency
JPS5717153A (en) * 1980-07-04 1982-01-28 Asahi Glass Co Ltd Sealing method of electronic parts
JPS5778455A (en) * 1980-07-16 1982-05-17 Ici Ltd Formed article containing polymer showing anisotropy in molten state and formation thereof
JPS57135830A (en) * 1981-02-13 1982-08-21 Sumitomo Chem Co Ltd Production of aromatic polyester
JPS5823445A (ja) * 1981-08-06 1983-02-12 Japan Steel Works Ltd:The 電子部品の封止方法
JPS5823446A (ja) * 1981-08-06 1983-02-12 Japan Steel Works Ltd:The 半導体の樹脂封止方法
JPS5827326A (ja) * 1981-08-11 1983-02-18 Japan Steel Works Ltd:The Ｉｃチツプの樹脂封止方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4067852A (en) * 1976-05-13 1978-01-10 Celanese Corporation Melt processable thermotropic wholly aromatic polyester containing polybenzoyl units
JPS5477691A (en) * 1977-10-20 1979-06-21 Celanese Corp Polyester composed of 66hydroxyy 22naphtoic acid and pphydroxy benzoic acid* which enable melt processing to be easy
JPS5522816A (en) * 1978-08-04 1980-02-18 Hitachi Ltd Resin sealed electronic parts
JPS5584321A (en) * 1978-12-19 1980-06-25 Sumitomo Chem Co Ltd Oxybenzoyl polyester component used under high frequency
JPS5717153A (en) * 1980-07-04 1982-01-28 Asahi Glass Co Ltd Sealing method of electronic parts
JPS5778455A (en) * 1980-07-16 1982-05-17 Ici Ltd Formed article containing polymer showing anisotropy in molten state and formation thereof
JPS57135830A (en) * 1981-02-13 1982-08-21 Sumitomo Chem Co Ltd Production of aromatic polyester
JPS5823445A (ja) * 1981-08-06 1983-02-12 Japan Steel Works Ltd:The 電子部品の封止方法
JPS5823446A (ja) * 1981-08-06 1983-02-12 Japan Steel Works Ltd:The 半導体の樹脂封止方法
JPS5827326A (ja) * 1981-08-11 1983-02-18 Japan Steel Works Ltd:The Ｉｃチツプの樹脂封止方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62135516A (ja) * 1985-12-09 1987-06-18 Polyplastics Co 電気部品封止剤
JPS62203540A (ja) * 1986-03-03 1987-09-08 Polyplastics Co 電動機ロ−タ−
JPS63146958A (ja) * 1986-12-10 1988-06-18 Polyplastics Co 表面特性の良好な液晶性ポリエステル樹脂組成物
JPS63162753A (ja) * 1986-12-26 1988-07-06 Polyplastics Co ポリエステル樹脂組成物
JPS63199758A (ja) * 1987-01-16 1988-08-18 インペリアル　ケミカル　インダストリーズ　パブリック　リミティド　カンパニー サーモトロピックポリマー組成物
JPS63227041A (ja) * 1987-03-17 1988-09-21 Matsushita Electronics Corp 固体装置
JPH01163257A (ja) * 1987-09-11 1989-06-27 Polyplastics Co 低応力封止材
JPH0192241A (ja) * 1987-10-02 1989-04-11 Polyplastics Co 液晶性ポリエステル樹脂成形品の表面処理法
JPH0192263A (ja) * 1987-10-02 1989-04-11 Kuraray Co Ltd 電子部品用封止剤
JPH01190749A (ja) * 1988-01-26 1989-07-31 Toyobo Co Ltd 熱可塑性樹脂組成物
JPH02145642A (ja) * 1988-11-28 1990-06-05 Mitsubishi Kasei Corp 樹脂組成物

Also Published As

Publication number Publication date
JPH0535189B2 (fr) 1993-05-25

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees