JPS6120693A - ボンデイングワイヤ− - Google Patents

ボンデイングワイヤ−

Info

Publication number
JPS6120693A
JPS6120693A JP59139108A JP13910884A JPS6120693A JP S6120693 A JPS6120693 A JP S6120693A JP 59139108 A JP59139108 A JP 59139108A JP 13910884 A JP13910884 A JP 13910884A JP S6120693 A JPS6120693 A JP S6120693A
Authority
JP
Japan
Prior art keywords
wire
ball
conductivity
bonding wire
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59139108A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0520493B2 (cs
Inventor
Shigemi Yamane
山根　茂美
Koichiro Atsumi
幸一郎 渥美
Tetsuo Ando
安藤　鉄男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59139108A priority Critical patent/JPS6120693A/ja
Publication of JPS6120693A publication Critical patent/JPS6120693A/ja
Publication of JPH0520493B2 publication Critical patent/JPH0520493B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/302—Cu as the principal constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP59139108A 1984-07-06 1984-07-06 ボンデイングワイヤ− Granted JPS6120693A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59139108A JPS6120693A (ja) 1984-07-06 1984-07-06 ボンデイングワイヤ−

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59139108A JPS6120693A (ja) 1984-07-06 1984-07-06 ボンデイングワイヤ−

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP6095481A Division JP2501303B2 (ja) 1994-04-11 1994-04-11 半導体装置

Publications (2)

Publication Number Publication Date
JPS6120693A true JPS6120693A (ja) 1986-01-29
JPH0520493B2 JPH0520493B2 (cs) 1993-03-19

Family

ID=15237669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59139108A Granted JPS6120693A (ja) 1984-07-06 1984-07-06 ボンデイングワイヤ−

Country Status (1)

Country Link
JP (1) JPS6120693A (cs)

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6199645A (ja) * 1984-10-20 1986-05-17 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS6199646A (ja) * 1984-10-20 1986-05-17 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS6280241A (ja) * 1985-10-01 1987-04-13 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS6320844A (ja) * 1986-07-15 1988-01-28 Toshiba Corp 半導体装置
JPS6321841A (ja) * 1986-07-16 1988-01-29 Toshiba Corp 半導体装置
JPS6329938A (ja) * 1986-07-23 1988-02-08 Toshiba Corp 半導体装置
JPS6364211A (ja) * 1986-09-05 1988-03-22 古河電気工業株式会社 銅細線とその製造方法
JPS63310932A (ja) * 1987-06-11 1988-12-19 Kurasawa Kogaku Kogyo Kk 銅合金
JPS643903A (en) * 1987-06-25 1989-01-09 Furukawa Electric Co Ltd Thin copper wire for electronic devices and manufacture thereof
US7347056B2 (en) 2004-07-09 2008-03-25 Honda Motor Co., Ltd. Vehicle air-conditioning system
JP2008085319A (ja) * 2006-08-31 2008-04-10 Nippon Steel Materials Co Ltd 半導体装置用銅合金ボンディングワイヤ
JP2008085320A (ja) * 2006-08-31 2008-04-10 Nippon Steel Materials Co Ltd 半導体装置用銅合金ボンディングワイヤ
JP2008169422A (ja) * 2007-01-10 2008-07-24 Sumitomo Electric Ind Ltd 銅合金およびその製造方法ならびに銅合金を用いた電線・ケーブル
CN101850481A (zh) * 2010-06-22 2010-10-06 哈尔滨工业大学 一种用于紫铜厚大构件熔化焊的铜合金焊丝及其制备方法
JP2011003745A (ja) * 2009-06-18 2011-01-06 Sumitomo Metal Mining Co Ltd Ｃｕボンディングワイヤ
US8004094B2 (en) 2006-08-31 2011-08-23 Nippon Steel Materials Co., Ltd. Copper alloy bonding wire for semiconductor device
US8119951B2 (en) 2000-05-17 2012-02-21 Hobart Brothers Company Weld wire with enhanced slag removal
KR20120031005A (ko) 2009-06-24 2012-03-29 신닛테츠 마테리알즈 가부시키가이샤 반도체용 구리 합금 본딩 와이어
CN102560184A (zh) * 2012-01-17 2012-07-11 宁波敖达金属新材料有限公司 无铅易切削高导电率的钙铜材料
CN103137237A (zh) * 2011-12-01 2013-06-05 贺利氏材料科技公司 用于微电子装置中接合的具有痕量加入物的3n铜线
CN103137235A (zh) * 2011-12-01 2013-06-05 贺利氏材料科技公司 用于微电子装置中接合的二次合金1n铜线
JPWO2011129256A1 (ja) * 2010-04-14 2013-07-18 タツタ電線株式会社 ボンディングワイヤ
US8653668B2 (en) 2010-02-03 2014-02-18 Nippon Steel & Sumikin Materials Co., Ltd. Copper bonding wire for semiconductor device and bonding structure thereof
JP5937770B1 (ja) * 2015-05-26 2016-06-22 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
TWI550639B (zh) * 2015-05-26 2016-09-21 日鐵住金新材料股份有限公司 Connecting wires for semiconductor devices
JP2016225610A (ja) * 2015-05-26 2016-12-28 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
US20170040281A1 (en) * 2014-04-21 2017-02-09 Nippon Steel & Sumikin Materials Co., Ltd. Bonding wire for semiconductor device
CN106514044A (zh) * 2016-11-30 2017-03-22 安徽华众焊业有限公司 铜基钎焊膏
JP2018064050A (ja) * 2016-10-14 2018-04-19 田中電子工業株式会社 ボールボンディング用銅合金線
US10414002B2 (en) 2015-06-15 2019-09-17 Nippon Micrometal Corporation Bonding wire for semiconductor device
US10468370B2 (en) 2015-07-23 2019-11-05 Nippon Micrometal Corporation Bonding wire for semiconductor device
KR20190126459A (ko) * 2016-06-20 2019-11-11 닛데쓰마이크로메탈가부시키가이샤 반도체 장치용 구리 합금 본딩 와이어
KR20200070424A (ko) * 2017-12-28 2020-06-17 닛데쓰마이크로메탈가부시키가이샤 반도체 장치용 본딩 와이어
US10950571B2 (en) 2017-02-22 2021-03-16 Nippon Steel Chemical & Material Co., Ltd. Bonding wire for semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109402445B (zh) * 2018-11-09 2021-01-15 上海理工大学 一种抗氧化铜基合金键合引线及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59139663A (ja) * 1983-01-31 1984-08-10 Mitsubishi Metal Corp 半導体装置のワイヤ・ボンデイング用Ｃｕ合金細線
JPS59139662A (ja) * 1983-01-31 1984-08-10 Mitsubishi Metal Corp 半導体装置のワイヤ・ボンデイング用Ｃｕ合金細線
JPS60124960A (ja) * 1983-12-09 1985-07-04 Sumitomo Electric Ind Ltd 半導体素子結線用線
JPS60236253A (ja) * 1984-05-10 1985-11-25 Furukawa Electric Co Ltd:The 半導体用ボンデイング細線

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59139663A (ja) * 1983-01-31 1984-08-10 Mitsubishi Metal Corp 半導体装置のワイヤ・ボンデイング用Ｃｕ合金細線
JPS59139662A (ja) * 1983-01-31 1984-08-10 Mitsubishi Metal Corp 半導体装置のワイヤ・ボンデイング用Ｃｕ合金細線
JPS60124960A (ja) * 1983-12-09 1985-07-04 Sumitomo Electric Ind Ltd 半導体素子結線用線
JPS60236253A (ja) * 1984-05-10 1985-11-25 Furukawa Electric Co Ltd:The 半導体用ボンデイング細線

Cited By (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6199646A (ja) * 1984-10-20 1986-05-17 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS6199645A (ja) * 1984-10-20 1986-05-17 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS6280241A (ja) * 1985-10-01 1987-04-13 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS6320844A (ja) * 1986-07-15 1988-01-28 Toshiba Corp 半導体装置
JPS6321841A (ja) * 1986-07-16 1988-01-29 Toshiba Corp 半導体装置
JPS6329938A (ja) * 1986-07-23 1988-02-08 Toshiba Corp 半導体装置
JPS6364211A (ja) * 1986-09-05 1988-03-22 古河電気工業株式会社 銅細線とその製造方法
JPS63310932A (ja) * 1987-06-11 1988-12-19 Kurasawa Kogaku Kogyo Kk 銅合金
JPS643903A (en) * 1987-06-25 1989-01-09 Furukawa Electric Co Ltd Thin copper wire for electronic devices and manufacture thereof
US8119951B2 (en) 2000-05-17 2012-02-21 Hobart Brothers Company Weld wire with enhanced slag removal
US8158907B2 (en) 2000-05-17 2012-04-17 Hobart Brothers Company Weld wire with enhanced slag removal
US7347056B2 (en) 2004-07-09 2008-03-25 Honda Motor Co., Ltd. Vehicle air-conditioning system
JP2008085319A (ja) * 2006-08-31 2008-04-10 Nippon Steel Materials Co Ltd 半導体装置用銅合金ボンディングワイヤ
US8004094B2 (en) 2006-08-31 2011-08-23 Nippon Steel Materials Co., Ltd. Copper alloy bonding wire for semiconductor device
JP2008085320A (ja) * 2006-08-31 2008-04-10 Nippon Steel Materials Co Ltd 半導体装置用銅合金ボンディングワイヤ
US8610291B2 (en) 2006-08-31 2013-12-17 Nippon Steel & Sumikin Materials Co., Ltd. Copper alloy bonding wire for semiconductor device
JP2008169422A (ja) * 2007-01-10 2008-07-24 Sumitomo Electric Ind Ltd 銅合金およびその製造方法ならびに銅合金を用いた電線・ケーブル
JP2011003745A (ja) * 2009-06-18 2011-01-06 Sumitomo Metal Mining Co Ltd Ｃｕボンディングワイヤ
US9427830B2 (en) 2009-06-24 2016-08-30 Nippon Steel & Sumikin Materials Co., Ltd. Copper alloy bonding wire for semiconductor
KR20120031005A (ko) 2009-06-24 2012-03-29 신닛테츠 마테리알즈 가부시키가이샤 반도체용 구리 합금 본딩 와이어
US8653668B2 (en) 2010-02-03 2014-02-18 Nippon Steel & Sumikin Materials Co., Ltd. Copper bonding wire for semiconductor device and bonding structure thereof
JPWO2011129256A1 (ja) * 2010-04-14 2013-07-18 タツタ電線株式会社 ボンディングワイヤ
CN101850481A (zh) * 2010-06-22 2010-10-06 哈尔滨工业大学 一种用于紫铜厚大构件熔化焊的铜合金焊丝及其制备方法
US20130142568A1 (en) * 2011-12-01 2013-06-06 Heraeus Materials Technology Gmbh & Co. Kg 3n copper wires with trace additions for bonding in microelectronics devices
CN103137237A (zh) * 2011-12-01 2013-06-05 贺利氏材料科技公司 用于微电子装置中接合的具有痕量加入物的3n铜线
CN103137235A (zh) * 2011-12-01 2013-06-05 贺利氏材料科技公司 用于微电子装置中接合的二次合金1n铜线
CN102560184A (zh) * 2012-01-17 2012-07-11 宁波敖达金属新材料有限公司 无铅易切削高导电率的钙铜材料
JP2017163169A (ja) * 2014-04-21 2017-09-14 新日鉄住金マテリアルズ株式会社 半導体装置用ボンディングワイヤ
US10950570B2 (en) * 2014-04-21 2021-03-16 Nippon Steel Chemical & Material Co., Ltd. Bonding wire for semiconductor device
JP2020031238A (ja) * 2014-04-21 2020-02-27 日鉄ケミカル＆マテリアル株式会社 半導体装置用ボンディングワイヤ
US20170040281A1 (en) * 2014-04-21 2017-02-09 Nippon Steel & Sumikin Materials Co., Ltd. Bonding wire for semiconductor device
TWI550639B (zh) * 2015-05-26 2016-09-21 日鐵住金新材料股份有限公司 Connecting wires for semiconductor devices
JP2016225610A (ja) * 2015-05-26 2016-12-28 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
JP5937770B1 (ja) * 2015-05-26 2016-06-22 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
US10672733B2 (en) 2015-05-26 2020-06-02 Nippon Micrometal Corporation Cu alloy core bonding wire with Pd coating for semiconductor device
TWI628671B (zh) * 2015-05-26 2018-07-01 日鐵住金新材料股份有限公司 半導體裝置用接合導線
JP2018137487A (ja) * 2015-05-26 2018-08-30 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
US10236272B2 (en) 2015-05-26 2019-03-19 Nippon Micrometal Corporation Cu alloy core bonding wire with Pd coating for semiconductor device
US10497663B2 (en) 2015-05-26 2019-12-03 Nippon Micrometal Corporation Cu alloy core bonding wire with Pd coating for semiconductor device
US10414002B2 (en) 2015-06-15 2019-09-17 Nippon Micrometal Corporation Bonding wire for semiconductor device
US10610976B2 (en) 2015-06-15 2020-04-07 Nippon Micrometal Corporation Bonding wire for semiconductor device
US10737356B2 (en) 2015-06-15 2020-08-11 Nippon Micrometal Corporation Bonding wire for semiconductor device
US10468370B2 (en) 2015-07-23 2019-11-05 Nippon Micrometal Corporation Bonding wire for semiconductor device
KR20190126459A (ko) * 2016-06-20 2019-11-11 닛데쓰마이크로메탈가부시키가이샤 반도체 장치용 구리 합금 본딩 와이어
US12300658B2 (en) 2016-06-20 2025-05-13 Nippon Micrometal Corporation Copper alloy bonding wire for semiconductor devices
JP2018064050A (ja) * 2016-10-14 2018-04-19 田中電子工業株式会社 ボールボンディング用銅合金線
KR20180041553A (ko) * 2016-10-14 2018-04-24 타나카 덴시 코오교오 카부시키가이샤 볼 본딩용 구리 합금선
CN106514044A (zh) * 2016-11-30 2017-03-22 安徽华众焊业有限公司 铜基钎焊膏
US10950571B2 (en) 2017-02-22 2021-03-16 Nippon Steel Chemical & Material Co., Ltd. Bonding wire for semiconductor device
DE112018000061B4 (de) 2017-02-22 2021-12-09 Nippon Micrometal Corporation Bonddraht für Halbleiterbauelement
US11373934B2 (en) 2017-12-28 2022-06-28 Nippon Micrometal Corporation Bonding wire for semiconductor device
KR20200070424A (ko) * 2017-12-28 2020-06-17 닛데쓰마이크로메탈가부시키가이샤 반도체 장치용 본딩 와이어

Also Published As

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