JPS6133444U - 樹脂封止ｉｃ - Google Patents

樹脂封止ｉｃ

Info

Publication number
JPS6133444U
JPS6133444U JP1984114836U JP11483684U JPS6133444U JP S6133444 U JPS6133444 U JP S6133444U JP 1984114836 U JP1984114836 U JP 1984114836U JP 11483684 U JP11483684 U JP 11483684U JP S6133444 U JPS6133444 U JP S6133444U
Authority
JP
Japan
Prior art keywords
resin
chip
lead frame
view
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984114836U
Other languages
English (en)
Other versions
JPH0135477Y2 (ja
Inventor
博之 深澤
衡 坪根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP1984114836U priority Critical patent/JPS6133444U/ja
Publication of JPS6133444U publication Critical patent/JPS6133444U/ja
Application granted granted Critical
Publication of JPH0135477Y2 publication Critical patent/JPH0135477Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図はこの考案の樹脂封止ＩＣの一実施例を示し、ａ
は断面図、ｂはａのｂ−ｂ線平面図、第２図は上記一実
施例のリードフレームアイランド部を取出して示す斜視
図、第３図は従来のフラントＩＣを示し、ａは平面図、
ｂは断面図、第４図は従来のフラットＩＣの他の狗を示
す断面図、第５図はフラットＩＣをプリント基板に搭載
する際の様子を示す斜視図、第６図ａ， ｂはパッケー
ジ全体を加熱してフラットＩＣを実装する方法を説明す
るための断面図、第７図ａ，ｂ，ｃはモールド樹脂に亀
裂が入った状態を示す図、第８図はこの考案の他の実施
例を示す断面図、第９図は他の実施例におけるアイラン
ド部を取出して示す斜視図である。 ２１・・・リードフレームのアイランド部、２３・・・
金属突起、２４・・・ＩＣチップ、２５・・・リードフ
レームの外部導出リード、２６・・・金属細線、２７・
・・モールド樹脂、２９・・・金属突起。

Claims (1)

    【実用新案登録請求の範囲】
  1. リードフレームのアイランド部上にＩＣチップを搭載し
    、芸のチップ表面の電極をリードフレームの外部導出リ
    ード比配線し、その配線部および前記ＩＣチップ部をモ
    ールド樹脂で封止してなる樹脂封止ＩＣにおいて、前記
    アイランド部の裏面に、先端が前記モールド樹脂部の表
    面に露出する金属突起を設けたことを特徴とする樹脂封
    止ＩＣ０
JP1984114836U 1984-07-30 1984-07-30 樹脂封止ｉｃ Granted JPS6133444U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984114836U JPS6133444U (ja) 1984-07-30 1984-07-30 樹脂封止ｉｃ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984114836U JPS6133444U (ja) 1984-07-30 1984-07-30 樹脂封止ｉｃ

Publications (2)

Publication Number Publication Date
JPS6133444U true JPS6133444U (ja) 1986-02-28
JPH0135477Y2 JPH0135477Y2 (ja) 1989-10-30

Family

ID=30673834

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984114836U Granted JPS6133444U (ja) 1984-07-30 1984-07-30 樹脂封止ｉｃ

Country Status (1)

Country Link
JP (1) JPS6133444U (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS555701A (en) * 1978-06-28 1980-01-16 Akihiko Shigemizu Concrete crusher
JPS6066839A (ja) * 1983-09-24 1985-04-17 Nec Corp 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS555701A (en) * 1978-06-28 1980-01-16 Akihiko Shigemizu Concrete crusher
JPS6066839A (ja) * 1983-09-24 1985-04-17 Nec Corp 半導体装置

Also Published As

Publication number Publication date
JPH0135477Y2 (ja) 1989-10-30

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