JPS62126841U - - Google Patents
Info
- Publication number
- JPS62126841U JPS62126841U JP1257586U JP1257586U JPS62126841U JP S62126841 U JPS62126841 U JP S62126841U JP 1257586 U JP1257586 U JP 1257586U JP 1257586 U JP1257586 U JP 1257586U JP S62126841 U JPS62126841 U JP S62126841U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- chip
- insulating film
- wiring pattern
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Semiconductor Integrated Circuits (AREA)
Description
第１図は本考案の半導体装置の要部断面図、第
２図は第１図のＩＣチツプ側からみた要部の俯敢
図、第３図は第１図とは異なる実施例を示した半
導体装置の要部断面図である。 １，１ａ…シリコン基板、２，２ａ…絶縁膜、
３，３ａ…電源線、４…接地線、５…コンタクト
孔、６…バンプ、７…ＩＣチツプ、８…凹部。
２図は第１図のＩＣチツプ側からみた要部の俯敢
図、第３図は第１図とは異なる実施例を示した半
導体装置の要部断面図である。 １，１ａ…シリコン基板、２，２ａ…絶縁膜、
３，３ａ…電源線、４…接地線、５…コンタクト
孔、６…バンプ、７…ＩＣチツプ、８…凹部。
Claims (1)
- シリコン基板の主面を被覆する絶縁膜上に形成
した配線パターンとＩＣチツプに設けたバンプと
をボンデイングしてなる半導体装置であつて、前
記配線パターンのうち電源線と接地線のいずれか
一方を、前記絶縁膜に開けたコンタクト孔を通し
て、前記基板に接続することにより形成されたコ
ンデンサ部の上方に、前記ＩＣチツプを配したこ
とを特徴とする高密度実装半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1257586U JPS62126841U (ja) | 1986-01-31 | 1986-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1257586U JPS62126841U (ja) | 1986-01-31 | 1986-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62126841U true JPS62126841U (ja) | 1987-08-12 |
Family
ID=30800832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1257586U Pending JPS62126841U (ja) | 1986-01-31 | 1986-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62126841U (ja) |
-
1986
- 1986-01-31 JP JP1257586U patent/JPS62126841U/ja active Pending