JPS62195Y2 - - Google Patents

Info

Publication number
JPS62195Y2
JPS62195Y2 JP1980047823U JP4782380U JPS62195Y2 JP S62195 Y2 JPS62195 Y2 JP S62195Y2 JP 1980047823 U JP1980047823 U JP 1980047823U JP 4782380 U JP4782380 U JP 4782380U JP S62195 Y2 JPS62195 Y2 JP S62195Y2
Authority
JP
Japan
Prior art keywords
substrate
solid
recess
package
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980047823U
Other languages
English (en)
Japanese (ja)
Other versions
JPS56149475U (da
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980047823U priority Critical patent/JPS62195Y2/ja
Publication of JPS56149475U publication Critical patent/JPS56149475U/ja
Application granted granted Critical
Publication of JPS62195Y2 publication Critical patent/JPS62195Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
JP1980047823U 1980-04-08 1980-04-08 Expired JPS62195Y2 (da)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980047823U JPS62195Y2 (da) 1980-04-08 1980-04-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980047823U JPS62195Y2 (da) 1980-04-08 1980-04-08

Publications (2)

Publication Number Publication Date
JPS56149475U JPS56149475U (da) 1981-11-10
JPS62195Y2 true JPS62195Y2 (da) 1987-01-07

Family

ID=29642820

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980047823U Expired JPS62195Y2 (da) 1980-04-08 1980-04-08

Country Status (1)

Country Link
JP (1) JPS62195Y2 (da)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2771807B2 (ja) * 1986-10-21 1998-07-02 ソニー株式会社 固体撮像装置
JPH073874B2 (ja) * 1987-07-22 1995-01-18 工業技術院長 半導体装置
CN100397127C (zh) * 1998-08-05 2008-06-25 精工爱普生株式会社 光模块及其制造方法

Also Published As

Publication number Publication date
JPS56149475U (da) 1981-11-10

Similar Documents

Publication Publication Date Title
US6175149B1 (en) Mounting multiple semiconductor dies in a package
JP3420057B2 (ja) 樹脂封止型半導体装置
US6297547B1 (en) Mounting multiple semiconductor dies in a package
US7473584B1 (en) Method for fabricating a fan-in leadframe semiconductor package
JP2002110898A (ja) 半導体装置
JPH06204442A (ja) 固体撮像装置およびその製造方法
JPH085566Y2 (ja) 固体撮像装置
JP2003163341A (ja) 固体撮像装置
JP2948595B2 (ja) Ｉｃカード用ｉｃモジュールおよびその製造方法
JPH10247701A (ja) 半導体装置およびその製造に用いるリードフレーム
CN105374787A (zh) 模制倒装芯片半导体封装体
JPS63274162A (ja) 半導体パッケ−ジ
JP3545171B2 (ja) 半導体装置
JPS62194Y2 (da)
JPH09172033A (ja) 半導体装置およびその製造方法
JPH0795580B2 (ja) 半導体装置
JP2743157B2 (ja) 樹脂封止型半導体装置
JPS6345842A (ja) プラスチツク・パツケ−ジ
JP2520612Y2 (ja) 樹脂封止型半導体装置
JP3349465B2 (ja) 半導体装置
JPH11307483A (ja) 半導体装置の製法および半導体装置
JP2851822B2 (ja) 電子部品
JPH0493051A (ja) 薄型モジュール
JPH04154157A (ja) 半導体装置の製造方法
JPH05190611A (ja) 半導体素子の実装方法及び半導体装置