JPS625643U - - Google Patents

Info

Publication number
JPS625643U
JPS625643U JP1985097160U JP9716085U JPS625643U JP S625643 U JPS625643 U JP S625643U JP 1985097160 U JP1985097160 U JP 1985097160U JP 9716085 U JP9716085 U JP 9716085U JP S625643 U JPS625643 U JP S625643U
Authority
JP
Japan
Prior art keywords
resin
semiconductor element
lead
sealed
large number
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985097160U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985097160U priority Critical patent/JPS625643U/ja
Publication of JPS625643U publication Critical patent/JPS625643U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例を示す樹脂封止型半導
体装置の断面図、第２図は従来の樹脂封止型半導
体装置の断面図、第３図は第２図中のリードフレ
ームの要部平面図である。 １０……リードフレーム、１０ａ……リード部
、１２……樹脂板、１３……導電層、１４……半
導体素子、１５……ワイヤ、１６……樹脂。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体素子の設置予定部を取り囲むように配列
    された多数のリード部を有するリードフレームと
    、前記設置予定部に位置し前記多数のリード部の
    内方端部に固着された半導体素子搭載用の部材と
    、この部材に搭載され前記リード部と接続された
    半導体素子とを、樹脂で封止した樹脂封止型半導
    体装置において、 前記半導体搭載用の部材を、前記樹脂の熱膨張
    率と同一または近似した熱膨張率を有する樹脂材
    で形成された樹脂板と、この樹脂板の半導体素子
    搭載面に形成された導電層とで構成したことを特
    徴とする樹脂封止型半導体装置。
JP1985097160U 1985-06-26 1985-06-26 Pending JPS625643U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985097160U JPS625643U (ja) 1985-06-26 1985-06-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985097160U JPS625643U (ja) 1985-06-26 1985-06-26

Publications (1)

Publication Number Publication Date
JPS625643U true JPS625643U (ja) 1987-01-14

Family

ID=30963816

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985097160U Pending JPS625643U (ja) 1985-06-26 1985-06-26

Country Status (1)

Country Link
JP (1) JPS625643U (ja)

Similar Documents

Publication Publication Date Title
JPH0470752U (ja)
JPS625643U (ja)
JPS6234441U (ja)
JPS6448095U (ja)
JPS6163849U (ja)
JPS6232548U (ja)
JPS625644U (ja)
JPS61186236U (ja)
JPS61102048U (ja)
JPS6237935U (ja)
JPH03124653U (ja)
JPH0180940U (ja)
JPS63172139U (ja)
JPH02132954U (ja)
JPS6194358U (ja)
JPS6172857U (ja)
JPS61146960U (ja)
JPH01165652U (ja)
JPS6194357U (ja)
JPH0229540U (ja)
JPS61207027U (ja)
JPH01100451U (ja)
JPS6183046U (ja)
JPS6190248U (ja)
JPH0245677U (ja)