JPS6256659B2 - - Google Patents

Info

Publication number
JPS6256659B2
JPS6256659B2 JP56188626A JP18862681A JPS6256659B2 JP S6256659 B2 JPS6256659 B2 JP S6256659B2 JP 56188626 A JP56188626 A JP 56188626A JP 18862681 A JP18862681 A JP 18862681A JP S6256659 B2 JPS6256659 B2 JP S6256659B2
Authority
JP
Japan
Prior art keywords
wire
tool
clamper
cut
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56188626A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5889833A (ja
Inventor
Takeshi Hasegawa
Mitsuru Kyohara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP56188626A priority Critical patent/JPS5889833A/ja
Publication of JPS5889833A publication Critical patent/JPS5889833A/ja
Publication of JPS6256659B2 publication Critical patent/JPS6256659B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)
JP56188626A 1981-11-25 1981-11-25 ワイヤボンデイング方法 Granted JPS5889833A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56188626A JPS5889833A (ja) 1981-11-25 1981-11-25 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56188626A JPS5889833A (ja) 1981-11-25 1981-11-25 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS5889833A JPS5889833A (ja) 1983-05-28
JPS6256659B2 true JPS6256659B2 (it) 1987-11-26

Family

ID=16226976

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56188626A Granted JPS5889833A (ja) 1981-11-25 1981-11-25 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS5889833A (it)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6442830A (en) * 1987-08-11 1989-02-15 Marine Instr Co Ltd Wire bonding
JPH0244744A (ja) * 1988-08-05 1990-02-14 Marine Instr Co Ltd ワイヤボンディング方法
JPH0244743A (ja) * 1988-08-05 1990-02-14 Marine Instr Co Ltd ワイヤボンディング方法
JP5734236B2 (ja) * 2011-05-17 2015-06-17 株式会社新川 ワイヤボンディング装置及びボンディング方法
CN104813455B (zh) * 2012-11-16 2017-11-21 株式会社新川 引线接合装置以及半导体装置的制造方法

Also Published As

Publication number Publication date
JPS5889833A (ja) 1983-05-28

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