JPS6327061U - - Google Patents

Info

Publication number
JPS6327061U
JPS6327061U JP1986120136U JP12013686U JPS6327061U JP S6327061 U JPS6327061 U JP S6327061U JP 1986120136 U JP1986120136 U JP 1986120136U JP 12013686 U JP12013686 U JP 12013686U JP S6327061 U JPS6327061 U JP S6327061U
Authority
JP
Japan
Prior art keywords
conductivity type
type region
metal layer
electrode
electrode metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986120136U
Other languages
English (en)
Other versions
JPH0526770Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986120136U priority Critical patent/JPH0526770Y2/ja
Publication of JPS6327061U publication Critical patent/JPS6327061U/ja
Application granted granted Critical
Publication of JPH0526770Y2 publication Critical patent/JPH0526770Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view

Landscapes

  • Thyristors (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は、この考案の一実施例である半導体装
置を示し、同図ａは、その平面図、同図ｂは、同
図ａのＸ―Ｘ線に沿う断面図、第２図は、従来の
半導体装置の構成図、第３図ａないしｄは、上記
従来の半導体装置の製造方法を示す工程図、第４
図および第５図は、従来の半導体装置の問題点を
説明するための説明図である。 １……シリコン半導体基板、２……ＰＥ層、３
……ＮＢ層、４……ＰＢ層、５……ＮＥ層、６…
…絶縁膜、７……カソード電極金属層、７ａ……
オーバーラツプ部、１３……溝、１４……ガラス
層、１９，２０……接合端部。

Claims (1)

    【実用新案登録請求の範囲】
  1. シリコン半導体基板の一方の主面に互いに反対
    導電型の第１導電型領域および第２導電型領域を
    露出させ、第１導電型領域上には、その導電型領
    域の露出範囲内に第１電極金属層が形成され、第
    ２導電型領域上には、第２電極金属層が形成され
    、この第２電極金属層は、第１導電型領域の表面
    の一部をエツチング除去した後に形成されたガラ
    ス層の表面に、オーバーラツプするように、接合
    端部をまたぐ第１導電型領域の一部分上に延在す
    る部分を有し、第１導電型領域上に形成された第
    １電極金属層、および前記第１導電領域の一部分
    上に延在する第２電極金属層の部分からそれぞれ
    ワイヤボンデイングによつて電極リード線が引き
    出される構造を備えたことを特徴とする半導体装
    置。
JP1986120136U 1986-08-05 1986-08-05 Expired - Lifetime JPH0526770Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986120136U JPH0526770Y2 (ja) 1986-08-05 1986-08-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986120136U JPH0526770Y2 (ja) 1986-08-05 1986-08-05

Publications (2)

Publication Number Publication Date
JPS6327061U true JPS6327061U (ja) 1988-02-22
JPH0526770Y2 JPH0526770Y2 (ja) 1993-07-07

Family

ID=31008172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986120136U Expired - Lifetime JPH0526770Y2 (ja) 1986-08-05 1986-08-05

Country Status (1)

Country Link
JP (1) JPH0526770Y2 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5468162A (en) * 1977-11-11 1979-06-01 Hitachi Ltd Semiconductor device
JPS5866654U (ja) * 1981-10-29 1983-05-06 日本電気株式会社 ガラスパツシベ−シヨン型半導体装置
JPS5895865A (ja) * 1981-12-02 1983-06-07 Hitachi Ltd ゲ−トタ−ンオフサイリスタ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5468162A (en) * 1977-11-11 1979-06-01 Hitachi Ltd Semiconductor device
JPS5866654U (ja) * 1981-10-29 1983-05-06 日本電気株式会社 ガラスパツシベ−シヨン型半導体装置
JPS5895865A (ja) * 1981-12-02 1983-06-07 Hitachi Ltd ゲ−トタ−ンオフサイリスタ

Also Published As

Publication number Publication date
JPH0526770Y2 (ja) 1993-07-07

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