JPS6375876U - - Google Patents

Info

Publication number
JPS6375876U
JPS6375876U JP17051886U JP17051886U JPS6375876U JP S6375876 U JPS6375876 U JP S6375876U JP 17051886 U JP17051886 U JP 17051886U JP 17051886 U JP17051886 U JP 17051886U JP S6375876 U JPS6375876 U JP S6375876U
Authority
JP
Japan
Prior art keywords
integrated circuit
pads
circuit device
insulating substrate
bumps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17051886U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17051886U priority Critical patent/JPS6375876U/ja
Publication of JPS6375876U publication Critical patent/JPS6375876U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)

Description

【図面の簡単な説明】
第1図は、この発明の一実施例による、MMI
C評価ジグを示す上面斜視図、第2図は、第1図
における、MMIC装着部の要部拡大詳細図、第
3図は、従来のMMIC評価ジグを示す上面斜視
図である。 1…MMIC、3…絶縁基板、4…高周波信号
線路、5…バイアス線路、6…接地線路、10…
バンプ、11…バイアスパツド、12…入力パツ
ド、13…出力パツド、14…接地パツド。

Claims (1)

    【実用新案登録請求の範囲】
  1. 集積回路装置特性評価用絶縁基板上に、該集積
    回路のパツド対応位置に、それぞれ該パツド圧着
    接続用のバンプを対応配設したことを特徴とする
    集積回路装置の評価ジグ。
JP17051886U 1986-11-06 1986-11-06 Pending JPS6375876U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17051886U JPS6375876U (ja) 1986-11-06 1986-11-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17051886U JPS6375876U (ja) 1986-11-06 1986-11-06

Publications (1)

Publication Number Publication Date
JPS6375876U true JPS6375876U (ja) 1988-05-20

Family

ID=31105322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17051886U Pending JPS6375876U (ja) 1986-11-06 1986-11-06

Country Status (1)

Country Link
JP (1) JPS6375876U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0481668A (ja) * 1990-07-25 1992-03-16 Taiyo Kogyo Kk プリント基板の検査装置およびピッチ変換基板
WO2000004394A1 (en) * 1998-07-16 2000-01-27 Advantest Corporation Socket for device measurement, and method of measuring device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0481668A (ja) * 1990-07-25 1992-03-16 Taiyo Kogyo Kk プリント基板の検査装置およびピッチ変換基板
WO2000004394A1 (en) * 1998-07-16 2000-01-27 Advantest Corporation Socket for device measurement, and method of measuring device

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