JPH0192143U - - Google Patents

Info

Publication number
JPH0192143U
JPH0192143U JP1987189105U JP18910587U JPH0192143U JP H0192143 U JPH0192143 U JP H0192143U JP 1987189105 U JP1987189105 U JP 1987189105U JP 18910587 U JP18910587 U JP 18910587U JP H0192143 U JPH0192143 U JP H0192143U
Authority
JP
Japan
Prior art keywords
semiconductor chip
bonded
chip
semiconductor
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987189105U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987189105U priority Critical patent/JPH0192143U/ja
Publication of JPH0192143U publication Critical patent/JPH0192143U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H10W72/248—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例の断面図、第２図は本
考案の他の実施例の断面図、第３図ａ，ｂはそれ
ぞれ従来例の断面図である。 図において、１は半導体チツプ、２は回路基板
、３は入出力信号線、４は電極、６はボンデイン
グワイヤ、７，２２は半田バンプ、１０は金属基
板、２０は冷却板、２１は半田層をそれぞれ示す
。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体チツプ１を、回路基板２にフリツプチツ
    プボンデイングした半導体装置であつて、 金属よりなる冷却板２０の下面が、半田層２１
    、或いは多数の半田バンプ２２を介して、該半導
    体チツプ１の底面に密着されてなることを特徴と
    する半導体チツプの実装構造。
JP1987189105U 1987-12-10 1987-12-10 Pending JPH0192143U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987189105U JPH0192143U (ja) 1987-12-10 1987-12-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987189105U JPH0192143U (ja) 1987-12-10 1987-12-10

Publications (1)

Publication Number Publication Date
JPH0192143U true JPH0192143U (ja) 1989-06-16

Family

ID=31480160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987189105U Pending JPH0192143U (ja) 1987-12-10 1987-12-10

Country Status (1)

Country Link
JP (1) JPH0192143U (ja)

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