|
US6143631A
(en)
*
|
1998-05-04 |
2000-11-07 |
Micron Technology, Inc. |
Method for controlling the morphology of deposited silicon on a silicon dioxide substrate and semiconductor devices incorporating such deposited silicon
|
|
US6974766B1
(en)
|
1998-10-01 |
2005-12-13 |
Applied Materials, Inc. |
In situ deposition of a low κ dielectric layer, barrier layer, etch stop, and anti-reflective coating for damascene application
|
|
JP4029420B2
(ja)
*
|
1999-07-15 |
2008-01-09 |
独立行政法人科学技術振興機構 |
ミリ波・遠赤外光検出器
|
|
US6620723B1
(en)
|
2000-06-27 |
2003-09-16 |
Applied Materials, Inc. |
Formation of boride barrier layers using chemisorption techniques
|
|
US6936538B2
(en)
*
|
2001-07-16 |
2005-08-30 |
Applied Materials, Inc. |
Method and apparatus for depositing tungsten after surface treatment to improve film characteristics
|
|
US7101795B1
(en)
|
2000-06-28 |
2006-09-05 |
Applied Materials, Inc. |
Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer
|
|
US6551929B1
(en)
|
2000-06-28 |
2003-04-22 |
Applied Materials, Inc. |
Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques
|
|
US7405158B2
(en)
|
2000-06-28 |
2008-07-29 |
Applied Materials, Inc. |
Methods for depositing tungsten layers employing atomic layer deposition techniques
|
|
FR2812763B1
(fr)
*
|
2000-08-04 |
2002-10-31 |
St Microelectronics Sa |
Formation de boites quantiques
|
|
CN1262508C
(zh)
*
|
2000-08-28 |
2006-07-05 |
应用材料有限公司 |
玻璃衬底的预多晶硅被覆
|
|
US20020036780A1
(en)
*
|
2000-09-27 |
2002-03-28 |
Hiroaki Nakamura |
Image processing apparatus
|
|
US7026219B2
(en)
|
2001-02-12 |
2006-04-11 |
Asm America, Inc. |
Integration of high k gate dielectric
|
|
KR101027485B1
(ko)
|
2001-02-12 |
2011-04-06 |
에이에스엠 아메리카, 인코포레이티드 |
반도체 박막 증착을 위한 개선된 공정
|
|
US6830976B2
(en)
*
|
2001-03-02 |
2004-12-14 |
Amberwave Systems Corproation |
Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits
|
|
US6750119B2
(en)
*
|
2001-04-20 |
2004-06-15 |
International Business Machines Corporation |
Epitaxial and polycrystalline growth of Si1-x-yGexCy and Si1-yCy alloy layers on Si by UHV-CVD
|
|
US6596643B2
(en)
*
|
2001-05-07 |
2003-07-22 |
Applied Materials, Inc. |
CVD TiSiN barrier for copper integration
|
|
US7060582B2
(en)
*
|
2001-06-05 |
2006-06-13 |
Sony Corporation |
Adjusting the germanium concentration of a semiconductor layer for equal thermal expansion for a hetero-junction bipolar transistor device
|
|
US6849545B2
(en)
|
2001-06-20 |
2005-02-01 |
Applied Materials, Inc. |
System and method to form a composite film stack utilizing sequential deposition techniques
|
|
US20090004850A1
(en)
|
2001-07-25 |
2009-01-01 |
Seshadri Ganguli |
Process for forming cobalt and cobalt silicide materials in tungsten contact applications
|
|
JP2005504885A
(ja)
|
2001-07-25 |
2005-02-17 |
アプライド マテリアルズ インコーポレイテッド |
新規なスパッタ堆積方法を使用したバリア形成
|
|
US20030029715A1
(en)
|
2001-07-25 |
2003-02-13 |
Applied Materials, Inc. |
An Apparatus For Annealing Substrates In Physical Vapor Deposition Systems
|
|
US9051641B2
(en)
|
2001-07-25 |
2015-06-09 |
Applied Materials, Inc. |
Cobalt deposition on barrier surfaces
|
|
US8110489B2
(en)
|
2001-07-25 |
2012-02-07 |
Applied Materials, Inc. |
Process for forming cobalt-containing materials
|
|
JP2003077845A
(ja)
*
|
2001-09-05 |
2003-03-14 |
Hitachi Kokusai Electric Inc |
半導体装置の製造方法および基板処理装置
|
|
US7049226B2
(en)
|
2001-09-26 |
2006-05-23 |
Applied Materials, Inc. |
Integration of ALD tantalum nitride for copper metallization
|
|
US6936906B2
(en)
|
2001-09-26 |
2005-08-30 |
Applied Materials, Inc. |
Integration of barrier layer and seed layer
|
|
US6916398B2
(en)
|
2001-10-26 |
2005-07-12 |
Applied Materials, Inc. |
Gas delivery apparatus and method for atomic layer deposition
|
|
US7081271B2
(en)
|
2001-12-07 |
2006-07-25 |
Applied Materials, Inc. |
Cyclical deposition of refractory metal silicon nitride
|
|
US20030124818A1
(en)
*
|
2001-12-28 |
2003-07-03 |
Applied Materials, Inc. |
Method and apparatus for forming silicon containing films
|
|
US6998014B2
(en)
|
2002-01-26 |
2006-02-14 |
Applied Materials, Inc. |
Apparatus and method for plasma assisted deposition
|
|
US6911391B2
(en)
|
2002-01-26 |
2005-06-28 |
Applied Materials, Inc. |
Integration of titanium and titanium nitride layers
|
|
JP2003224204A
(ja)
*
|
2002-01-29 |
2003-08-08 |
Mitsubishi Electric Corp |
キャパシタを有する半導体装置
|
|
US6833161B2
(en)
|
2002-02-26 |
2004-12-21 |
Applied Materials, Inc. |
Cyclical deposition of tungsten nitride for metal oxide gate electrode
|
|
US6972267B2
(en)
*
|
2002-03-04 |
2005-12-06 |
Applied Materials, Inc. |
Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor
|
|
US6825134B2
(en)
*
|
2002-03-26 |
2004-11-30 |
Applied Materials, Inc. |
Deposition of film layers by alternately pulsing a precursor and high frequency power in a continuous gas flow
|
|
JP3719998B2
(ja)
*
|
2002-04-01 |
2005-11-24 |
松下電器産業株式会社 |
半導体装置の製造方法
|
|
US7439191B2
(en)
|
2002-04-05 |
2008-10-21 |
Applied Materials, Inc. |
Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications
|
|
US6846516B2
(en)
|
2002-04-08 |
2005-01-25 |
Applied Materials, Inc. |
Multiple precursor cyclical deposition system
|
|
US6720027B2
(en)
*
|
2002-04-08 |
2004-04-13 |
Applied Materials, Inc. |
Cyclical deposition of a variable content titanium silicon nitride layer
|
|
US7279432B2
(en)
*
|
2002-04-16 |
2007-10-09 |
Applied Materials, Inc. |
System and method for forming an integrated barrier layer
|
|
KR100448714B1
(ko)
*
|
2002-04-24 |
2004-09-13 |
삼성전자주식회사 |
다층 나노라미네이트 구조를 갖는 반도체 장치의 절연막및 그의 형성방법
|
|
US7041335B2
(en)
*
|
2002-06-04 |
2006-05-09 |
Applied Materials, Inc. |
Titanium tantalum nitride silicide layer
|
|
US7601225B2
(en)
|
2002-06-17 |
2009-10-13 |
Asm International N.V. |
System for controlling the sublimation of reactants
|
|
US6838125B2
(en)
*
|
2002-07-10 |
2005-01-04 |
Applied Materials, Inc. |
Method of film deposition using activated precursor gases
|
|
WO2004009861A2
(en)
*
|
2002-07-19 |
2004-01-29 |
Asm America, Inc. |
Method to form ultra high quality silicon-containing compound layers
|
|
US7294582B2
(en)
*
|
2002-07-19 |
2007-11-13 |
Asm International, N.V. |
Low temperature silicon compound deposition
|
|
US6915592B2
(en)
|
2002-07-29 |
2005-07-12 |
Applied Materials, Inc. |
Method and apparatus for generating gas to a processing chamber
|
|
US6740568B2
(en)
*
|
2002-07-29 |
2004-05-25 |
Infineon Technologies Ag |
Method to enhance epitaxial regrowth in amorphous silicon contacts
|
|
US7399500B2
(en)
*
|
2002-08-07 |
2008-07-15 |
Schott Ag |
Rapid process for the production of multilayer barrier layers
|
|
US7186630B2
(en)
|
2002-08-14 |
2007-03-06 |
Asm America, Inc. |
Deposition of amorphous silicon-containing films
|
|
JP4358492B2
(ja)
*
|
2002-09-25 |
2009-11-04 |
レール・リキード−ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード |
熱化学気相成長法によるシリコン窒化物膜またはシリコンオキシ窒化物膜の製造方法
|
|
US6821563B2
(en)
|
2002-10-02 |
2004-11-23 |
Applied Materials, Inc. |
Gas distribution system for cyclical layer deposition
|
|
US6905737B2
(en)
|
2002-10-11 |
2005-06-14 |
Applied Materials, Inc. |
Method of delivering activated species for rapid cyclical deposition
|
|
US6833322B2
(en)
*
|
2002-10-17 |
2004-12-21 |
Applied Materials, Inc. |
Apparatuses and methods for depositing an oxide film
|
|
US7540920B2
(en)
|
2002-10-18 |
2009-06-02 |
Applied Materials, Inc. |
Silicon-containing layer deposition with silicon compounds
|
|
JP4065516B2
(ja)
*
|
2002-10-21 |
2008-03-26 |
キヤノン株式会社 |
情報処理装置及び情報処理方法
|
|
US7092287B2
(en)
*
|
2002-12-18 |
2006-08-15 |
Asm International N.V. |
Method of fabricating silicon nitride nanodots
|
|
CN100358110C
(zh)
*
|
2002-12-20 |
2007-12-26 |
皇家飞利浦电子股份有限公司 |
半导体器件的制造方法
|
|
US7262133B2
(en)
*
|
2003-01-07 |
2007-08-28 |
Applied Materials, Inc. |
Enhancement of copper line reliability using thin ALD tan film to cap the copper line
|
|
US7244683B2
(en)
*
|
2003-01-07 |
2007-07-17 |
Applied Materials, Inc. |
Integration of ALD/CVD barriers with porous low k materials
|
|
US7422961B2
(en)
*
|
2003-03-14 |
2008-09-09 |
Advanced Micro Devices, Inc. |
Method of forming isolation regions for integrated circuits
|
|
US6998305B2
(en)
*
|
2003-01-24 |
2006-02-14 |
Asm America, Inc. |
Enhanced selectivity for epitaxial deposition
|
|
WO2004081986A2
(en)
*
|
2003-03-12 |
2004-09-23 |
Asm America Inc. |
Method to planarize and reduce defect density of silicon germanium
|
|
US7238595B2
(en)
*
|
2003-03-13 |
2007-07-03 |
Asm America, Inc. |
Epitaxial semiconductor deposition methods and structures
|
|
US7682947B2
(en)
*
|
2003-03-13 |
2010-03-23 |
Asm America, Inc. |
Epitaxial semiconductor deposition methods and structures
|
|
EP1604395A2
(de)
*
|
2003-03-13 |
2005-12-14 |
ASM America, Inc. |
Epitaxialhalbleiterablagerungsverfahren und -strukturen
|
|
US7517768B2
(en)
*
|
2003-03-31 |
2009-04-14 |
Intel Corporation |
Method for fabricating a heterojunction bipolar transistor
|
|
JP4714422B2
(ja)
|
2003-04-05 |
2011-06-29 |
ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. |
ゲルマニウムを含有するフィルムを堆積させる方法、及び蒸気送達装置
|
|
JP4954448B2
(ja)
|
2003-04-05 |
2012-06-13 |
ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. |
有機金属化合物
|
|
JP4689969B2
(ja)
*
|
2003-04-05 |
2011-06-01 |
ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. |
Iva族およびvia族化合物の調製
|
|
US7005160B2
(en)
*
|
2003-04-24 |
2006-02-28 |
Asm America, Inc. |
Methods for depositing polycrystalline films with engineered grain structures
|
|
EP1482069A1
(de)
*
|
2003-05-28 |
2004-12-01 |
Interuniversitair Microelektronica Centrum Vzw |
Verfahren zur Herstellung einer zur Mikrobearbeitung geeigneten polykristallinen Silizium-Germanium-Schicht
|
|
US6909186B2
(en)
*
|
2003-05-01 |
2005-06-21 |
International Business Machines Corporation |
High performance FET devices and methods therefor
|
|
US7074630B2
(en)
*
|
2003-05-20 |
2006-07-11 |
United Microelectronics Corp. |
Method of forming light emitter layer
|
|
US20040241948A1
(en)
*
|
2003-05-29 |
2004-12-02 |
Chun-Feng Nieh |
Method of fabricating stacked gate dielectric layer
|
|
JP4158607B2
(ja)
*
|
2003-06-09 |
2008-10-01 |
株式会社Sumco |
半導体基板の製造方法
|
|
US7153772B2
(en)
*
|
2003-06-12 |
2006-12-26 |
Asm International N.V. |
Methods of forming silicide films in semiconductor devices
|
|
US7122408B2
(en)
|
2003-06-16 |
2006-10-17 |
Micron Technology, Inc. |
Photodiode with ultra-shallow junction for high quantum efficiency CMOS image sensor and method of formation
|
|
US7211508B2
(en)
|
2003-06-18 |
2007-05-01 |
Applied Materials, Inc. |
Atomic layer deposition of tantalum based barrier materials
|
|
US7282738B2
(en)
*
|
2003-07-18 |
2007-10-16 |
Corning Incorporated |
Fabrication of crystalline materials over substrates
|
|
JP2007505477A
(ja)
*
|
2003-07-23 |
2007-03-08 |
エーエスエム アメリカ インコーポレイテッド |
シリコン−オン−インシュレーター構造及びバルク基板に対するSiGeの堆積
|
|
KR20060039915A
(ko)
*
|
2003-07-30 |
2006-05-09 |
에이에스엠 아메리카, 인코포레이티드 |
완화된 실리콘 게르마늄 층의 에피택셜 성장
|
|
WO2005017963A2
(en)
*
|
2003-08-04 |
2005-02-24 |
Asm America, Inc. |
Surface preparation prior to deposition on germanium
|
|
WO2005020928A2
(en)
|
2003-08-29 |
2005-03-10 |
The Regents Of The University Of California |
Agents and methods for enhancing bone formation by oxysterols in combination with bone morphogenic proteins
|
|
DE10341806B4
(de)
*
|
2003-09-10 |
2008-11-06 |
Texas Instruments Deutschland Gmbh |
Verfahren zur Herstellung einer epitaktischen Silizium-Germanium Basisschicht eines heterobipolaren pnp Transistors
|
|
US7175966B2
(en)
*
|
2003-09-19 |
2007-02-13 |
International Business Machines Corporation |
Water and aqueous base soluble antireflective coating/hardmask materials
|
|
US20050064629A1
(en)
*
|
2003-09-22 |
2005-03-24 |
Chen-Hua Yu |
Tungsten-copper interconnect and method for fabricating the same
|
|
US7166528B2
(en)
|
2003-10-10 |
2007-01-23 |
Applied Materials, Inc. |
Methods of selective deposition of heavily doped epitaxial SiGe
|
|
US7132338B2
(en)
|
2003-10-10 |
2006-11-07 |
Applied Materials, Inc. |
Methods to fabricate MOSFET devices using selective deposition process
|
|
US8501594B2
(en)
|
2003-10-10 |
2013-08-06 |
Applied Materials, Inc. |
Methods for forming silicon germanium layers
|
|
JP4655578B2
(ja)
*
|
2003-10-20 |
2011-03-23 |
東京エレクトロン株式会社 |
成膜装置及び成膜方法
|
|
US6987055B2
(en)
*
|
2004-01-09 |
2006-01-17 |
Micron Technology, Inc. |
Methods for deposition of semiconductor material
|
|
US7078302B2
(en)
|
2004-02-23 |
2006-07-18 |
Applied Materials, Inc. |
Gate electrode dopant activation method for semiconductor manufacturing including a laser anneal
|
|
JP4982355B2
(ja)
|
2004-02-27 |
2012-07-25 |
エーエスエム アメリカ インコーポレイテッド |
ゲルマニウム膜の形成方法
|
|
US7098150B2
(en)
*
|
2004-03-05 |
2006-08-29 |
Air Liquide America L.P. |
Method for novel deposition of high-k MSiON dielectric films
|
|
FR2868203B1
(fr)
*
|
2004-03-29 |
2006-06-09 |
St Microelectronics Sa |
Procede de fabrication d'un transistor bipolaire a base extrinseque monocristalline
|
|
JP4874527B2
(ja)
*
|
2004-04-01 |
2012-02-15 |
トヨタ自動車株式会社 |
炭化珪素半導体基板及びその製造方法
|
|
US7084040B2
(en)
*
|
2004-04-23 |
2006-08-01 |
Northrop Grumman Corp. |
Method for growth of group III-V semiconductor material on a dielectric
|
|
KR20070006852A
(ko)
*
|
2004-04-23 |
2007-01-11 |
에이에스엠 아메리카, 인코포레이티드 |
인-시츄 도핑된 에피택셜 막
|
|
US7202142B2
(en)
*
|
2004-05-03 |
2007-04-10 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Method for producing low defect density strained -Si channel MOSFETS
|
|
US20050252449A1
(en)
|
2004-05-12 |
2005-11-17 |
Nguyen Son T |
Control of gas flow and delivery to suppress the formation of particles in an MOCVD/ALD system
|
|
EP1747302B1
(de)
*
|
2004-05-20 |
2012-12-26 |
Akzo Nobel N.V. |
Bubbler zur konstanten dampfzufuhr einer festen chemikalie
|
|
US8323754B2
(en)
|
2004-05-21 |
2012-12-04 |
Applied Materials, Inc. |
Stabilization of high-k dielectric materials
|
|
US7396743B2
(en)
|
2004-06-10 |
2008-07-08 |
Singh Kaushal K |
Low temperature epitaxial growth of silicon-containing films using UV radiation
|
|
KR101176668B1
(ko)
*
|
2004-06-10 |
2012-08-23 |
어플라이드 머티어리얼스, 인코포레이티드 |
Uv 방사를 이용한 실리콘-함유 막들의 저온 에피택셜 성장
|
|
US7285503B2
(en)
*
|
2004-06-21 |
2007-10-23 |
Applied Materials, Inc. |
Hermetic cap layers formed on low-k films by plasma enhanced chemical vapor deposition
|
|
JP3945519B2
(ja)
*
|
2004-06-21 |
2007-07-18 |
東京エレクトロン株式会社 |
被処理体の熱処理装置、熱処理方法及び記憶媒体
|
|
MX2007000998A
(es)
|
2004-07-30 |
2007-07-11 |
Rinat Neuroscience Corp |
Anticuerpos dirigidos peptido beta-amiloide y procedimientos que usan los mismos.
|
|
ATE526433T1
(de)
*
|
2004-08-04 |
2011-10-15 |
Oerlikon Solar Ag |
Haftschicht für dünnschichttransistor
|
|
DE102004056170A1
(de)
*
|
2004-08-06 |
2006-03-16 |
Aixtron Ag |
Vorrichtung und Verfahren zur chemischen Gasphasenabscheidung mit hohem Durchsatz
|
|
US7629270B2
(en)
*
|
2004-08-27 |
2009-12-08 |
Asm America, Inc. |
Remote plasma activated nitridation
|
|
US7253084B2
(en)
|
2004-09-03 |
2007-08-07 |
Asm America, Inc. |
Deposition from liquid sources
|
|
US20060051975A1
(en)
*
|
2004-09-07 |
2006-03-09 |
Ashutosh Misra |
Novel deposition of SiON dielectric films
|
|
JP4428175B2
(ja)
*
|
2004-09-14 |
2010-03-10 |
株式会社Sumco |
気相エピタキシャル成長装置および半導体ウェーハの製造方法
|
|
US7309660B2
(en)
*
|
2004-09-16 |
2007-12-18 |
International Business Machines Corporation |
Buffer layer for selective SiGe growth for uniform nucleation
|
|
US7966969B2
(en)
*
|
2004-09-22 |
2011-06-28 |
Asm International N.V. |
Deposition of TiN films in a batch reactor
|
|
US7071125B2
(en)
*
|
2004-09-22 |
2006-07-04 |
Intel Corporation |
Precursors for film formation
|
|
US7314513B1
(en)
*
|
2004-09-24 |
2008-01-01 |
Kovio, Inc. |
Methods of forming a doped semiconductor thin film, doped semiconductor thin film structures, doped silane compositions, and methods of making such compositions
|
|
TW200619416A
(en)
*
|
2004-09-30 |
2006-06-16 |
Aviza Tech Inc |
Method and apparatus for low temperature dielectric deposition using monomolecular precursors
|
|
JP5047486B2
(ja)
*
|
2004-10-13 |
2012-10-10 |
アイメック |
半導体デバイスの製造方法
|
|
WO2006044268A1
(en)
*
|
2004-10-13 |
2006-04-27 |
Dow Global Technologies Inc. |
Catalysed diesel soot filter and process for its use
|
|
US7674726B2
(en)
*
|
2004-10-15 |
2010-03-09 |
Asm International N.V. |
Parts for deposition reactors
|
|
US7427571B2
(en)
*
|
2004-10-15 |
2008-09-23 |
Asm International, N.V. |
Reactor design for reduced particulate generation
|
|
US20060084283A1
(en)
*
|
2004-10-20 |
2006-04-20 |
Paranjpe Ajit P |
Low temperature sin deposition methods
|
|
JP4945072B2
(ja)
*
|
2004-11-09 |
2012-06-06 |
株式会社東芝 |
半導体装置及びその製造方法
|
|
US7560352B2
(en)
*
|
2004-12-01 |
2009-07-14 |
Applied Materials, Inc. |
Selective deposition
|
|
US7682940B2
(en)
*
|
2004-12-01 |
2010-03-23 |
Applied Materials, Inc. |
Use of Cl2 and/or HCl during silicon epitaxial film formation
|
|
US7312128B2
(en)
|
2004-12-01 |
2007-12-25 |
Applied Materials, Inc. |
Selective epitaxy process with alternating gas supply
|
|
US7429402B2
(en)
*
|
2004-12-10 |
2008-09-30 |
Applied Materials, Inc. |
Ruthenium as an underlayer for tungsten film deposition
|
|
JP2006176811A
(ja)
*
|
2004-12-21 |
2006-07-06 |
Rikogaku Shinkokai |
結晶性SiC膜の製造方法
|
|
KR100579860B1
(ko)
*
|
2004-12-23 |
2006-05-12 |
동부일렉트로닉스 주식회사 |
원자층 증착법(ald) 및 ⅲ족 중금속을 이용한 반도체소자의 p형 폴리실리콘막 형성 방법
|
|
US9640649B2
(en)
*
|
2004-12-30 |
2017-05-02 |
Infineon Technologies Americas Corp. |
III-nitride power semiconductor with a field relaxation feature
|
|
US7704896B2
(en)
*
|
2005-01-21 |
2010-04-27 |
Asm International, N.V. |
Atomic layer deposition of thin films on germanium
|
|
US7235492B2
(en)
|
2005-01-31 |
2007-06-26 |
Applied Materials, Inc. |
Low temperature etchant for treatment of silicon-containing surfaces
|
|
US7816236B2
(en)
*
|
2005-02-04 |
2010-10-19 |
Asm America Inc. |
Selective deposition of silicon-containing films
|
|
JP2008532317A
(ja)
|
2005-02-28 |
2008-08-14 |
シリコン・ジェネシス・コーポレーション |
レイヤ転送プロセス用の基板強化方法および結果のデバイス
|
|
US7629267B2
(en)
*
|
2005-03-07 |
2009-12-08 |
Asm International N.V. |
High stress nitride film and method for formation thereof
|
|
UY29504A1
(es)
|
2005-04-29 |
2006-10-31 |
Rinat Neuroscience Corp |
Anticuerpos dirigidos contra el péptido amiloide beta y métodos que utilizan los mismos.
|
|
US7875556B2
(en)
*
|
2005-05-16 |
2011-01-25 |
Air Products And Chemicals, Inc. |
Precursors for CVD silicon carbo-nitride and silicon nitride films
|
|
US7473655B2
(en)
*
|
2005-06-17 |
2009-01-06 |
Applied Materials, Inc. |
Method for silicon based dielectric chemical vapor deposition
|
|
US20060286774A1
(en)
*
|
2005-06-21 |
2006-12-21 |
Applied Materials. Inc. |
Method for forming silicon-containing materials during a photoexcitation deposition process
|
|
US7651955B2
(en)
|
2005-06-21 |
2010-01-26 |
Applied Materials, Inc. |
Method for forming silicon-containing materials during a photoexcitation deposition process
|
|
US7648927B2
(en)
|
2005-06-21 |
2010-01-19 |
Applied Materials, Inc. |
Method for forming silicon-containing materials during a photoexcitation deposition process
|
|
WO2007000186A1
(en)
*
|
2005-06-29 |
2007-01-04 |
L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude |
Deposition method of ternary films
|
|
WO2007008653A2
(en)
*
|
2005-07-08 |
2007-01-18 |
Aviza Technology, Inc. |
Method for depositing silicon-containing films
|
|
US20070010072A1
(en)
*
|
2005-07-09 |
2007-01-11 |
Aviza Technology, Inc. |
Uniform batch film deposition process and films so produced
|
|
US7195934B2
(en)
|
2005-07-11 |
2007-03-27 |
Applied Materials, Inc. |
Method and system for deposition tuning in an epitaxial film growth apparatus
|
|
US7674687B2
(en)
*
|
2005-07-27 |
2010-03-09 |
Silicon Genesis Corporation |
Method and structure for fabricating multiple tiled regions onto a plate using a controlled cleaving process
|
|
US7166520B1
(en)
*
|
2005-08-08 |
2007-01-23 |
Silicon Genesis Corporation |
Thin handle substrate method and structure for fabricating devices using one or more films provided by a layer transfer process
|
|
US20070029043A1
(en)
*
|
2005-08-08 |
2007-02-08 |
Silicon Genesis Corporation |
Pre-made cleavable substrate method and structure of fabricating devices using one or more films provided by a layer transfer process
|
|
US7427554B2
(en)
*
|
2005-08-12 |
2008-09-23 |
Silicon Genesis Corporation |
Manufacturing strained silicon substrates using a backing material
|
|
US20070054048A1
(en)
*
|
2005-09-07 |
2007-03-08 |
Suvi Haukka |
Extended deposition range by hot spots
|
|
WO2007035660A1
(en)
*
|
2005-09-20 |
2007-03-29 |
Applied Materials, Inc. |
Method to form a device on a soi substrate
|
|
US20070065578A1
(en)
*
|
2005-09-21 |
2007-03-22 |
Applied Materials, Inc. |
Treatment processes for a batch ALD reactor
|
|
DE102005047221B4
(de)
*
|
2005-10-01 |
2015-08-06 |
APSOL GmbH |
Halbleiterschichtstruktur, Bauelement mit einer solchen Halbleiterschichtstruktur, Halbleiterschichtstruktur-Scheiben und Verfahren zu deren Herstellung
|
|
EP1943669A4
(de)
*
|
2005-10-05 |
2012-06-13 |
Kovio Inc |
Lineare und vernetzte hochmolekulare polysilane, polygermane und copolymere davon, diese enthaltende zusammensetzungen und verfahren zur herstellung und verwendung derartiger verbindungen und zusammensetzungen
|
|
US7294581B2
(en)
*
|
2005-10-17 |
2007-11-13 |
Applied Materials, Inc. |
Method for fabricating silicon nitride spacer structures
|
|
US20070096091A1
(en)
*
|
2005-11-03 |
2007-05-03 |
Chih-Chun Wang |
Layer structure and removing method thereof and mehod of testing semiconductor machine
|
|
KR101019293B1
(ko)
|
2005-11-04 |
2011-03-07 |
어플라이드 머티어리얼스, 인코포레이티드 |
플라즈마-강화 원자층 증착 장치 및 방법
|
|
US7651919B2
(en)
*
|
2005-11-04 |
2010-01-26 |
Atmel Corporation |
Bandgap and recombination engineered emitter layers for SiGe HBT performance optimization
|
|
US7439558B2
(en)
|
2005-11-04 |
2008-10-21 |
Atmel Corporation |
Method and system for controlled oxygen incorporation in compound semiconductor films for device performance enhancement
|
|
US7300849B2
(en)
*
|
2005-11-04 |
2007-11-27 |
Atmel Corporation |
Bandgap engineered mono-crystalline silicon cap layers for SiGe HBT performance enhancement
|
|
US8530934B2
(en)
|
2005-11-07 |
2013-09-10 |
Atmel Corporation |
Integrated circuit structures containing a strain-compensated compound semiconductor layer and methods and systems related thereto
|
|
US7465669B2
(en)
*
|
2005-11-12 |
2008-12-16 |
Applied Materials, Inc. |
Method of fabricating a silicon nitride stack
|
|
US7416995B2
(en)
*
|
2005-11-12 |
2008-08-26 |
Applied Materials, Inc. |
Method for fabricating controlled stress silicon nitride films
|
|
US20070116888A1
(en)
*
|
2005-11-18 |
2007-05-24 |
Tokyo Electron Limited |
Method and system for performing different deposition processes within a single chamber
|
|
JP4792956B2
(ja)
*
|
2005-12-13 |
2011-10-12 |
セイコーエプソン株式会社 |
半導体基板の製造方法及び半導体装置の製造方法
|
|
JP4792957B2
(ja)
*
|
2005-12-14 |
2011-10-12 |
セイコーエプソン株式会社 |
半導体基板の製造方法及び半導体装置の製造方法
|
|
WO2007075369A1
(en)
*
|
2005-12-16 |
2007-07-05 |
Asm International N.V. |
Low temperature doped silicon layer formation
|
|
US7553516B2
(en)
*
|
2005-12-16 |
2009-06-30 |
Asm International N.V. |
System and method of reducing particle contamination of semiconductor substrates
|
|
US20070154637A1
(en)
*
|
2005-12-19 |
2007-07-05 |
Rohm And Haas Electronic Materials Llc |
Organometallic composition
|
|
US7312154B2
(en)
*
|
2005-12-20 |
2007-12-25 |
Corning Incorporated |
Method of polishing a semiconductor-on-insulator structure
|
|
JP2009521801A
(ja)
*
|
2005-12-22 |
2009-06-04 |
エーエスエム アメリカ インコーポレイテッド |
ドープされた半導体物質のエピタキシャル堆積
|
|
US20070148890A1
(en)
*
|
2005-12-27 |
2007-06-28 |
Enicks Darwin G |
Oxygen enhanced metastable silicon germanium film layer
|
|
TW200737309A
(en)
*
|
2005-12-28 |
2007-10-01 |
Hitachi Int Electric Inc |
Fabrication method of semiconductor device and substrate processing device
|
|
JP2009522812A
(ja)
*
|
2006-01-09 |
2009-06-11 |
インターナショナル レクティファイアー コーポレイション |
電界緩和機能を有するiii族窒化物電力半導体
|
|
US20070178678A1
(en)
*
|
2006-01-28 |
2007-08-02 |
Varian Semiconductor Equipment Associates, Inc. |
Methods of implanting ions and ion sources used for same
|
|
KR100745372B1
(ko)
*
|
2006-02-06 |
2007-08-02 |
삼성전자주식회사 |
반도체 제조설비의 개스플로우량 감시장치 및 그 방법
|
|
CA2643732C
(en)
|
2006-02-27 |
2012-08-21 |
The Regents Of The University Of California |
Oxysterol compounds and the hedgehog pathway
|
|
US7964514B2
(en)
*
|
2006-03-02 |
2011-06-21 |
Applied Materials, Inc. |
Multiple nitrogen plasma treatments for thin SiON dielectrics
|
|
US7863157B2
(en)
|
2006-03-17 |
2011-01-04 |
Silicon Genesis Corporation |
Method and structure for fabricating solar cells using a layer transfer process
|
|
US7901968B2
(en)
*
|
2006-03-23 |
2011-03-08 |
Asm America, Inc. |
Heteroepitaxial deposition over an oxidized surface
|
|
US7598153B2
(en)
*
|
2006-03-31 |
2009-10-06 |
Silicon Genesis Corporation |
Method and structure for fabricating bonded substrate structures using thermal processing to remove oxygen species
|
|
EP2002484A4
(de)
|
2006-04-05 |
2016-06-08 |
Silicon Genesis Corp |
Verfahren und struktur für die herstellung von solarzellen mittels schichtübertragungsverfahren
|
|
US7674337B2
(en)
|
2006-04-07 |
2010-03-09 |
Applied Materials, Inc. |
Gas manifolds for use during epitaxial film formation
|
|
CN101460654A
(zh)
*
|
2006-05-01 |
2009-06-17 |
应用材料股份有限公司 |
使用含碳的硅薄膜形成超浅接合区的方法
|
|
DE102006020825A1
(de)
*
|
2006-05-04 |
2007-11-08 |
Siltronic Ag |
Verfahren zur Herstellung einer Schichtenstruktur
|
|
US7798096B2
(en)
|
2006-05-05 |
2010-09-21 |
Applied Materials, Inc. |
Plasma, UV and ion/neutral assisted ALD or CVD in a batch tool
|
|
EP2018642A4
(de)
*
|
2006-05-12 |
2009-05-27 |
Advanced Tech Materials |
Niedrigtemperaturabscheidung von speicherstoffen
|
|
US7875312B2
(en)
|
2006-05-23 |
2011-01-25 |
Air Products And Chemicals, Inc. |
Process for producing silicon oxide films for organoaminosilane precursors
|
|
US8530361B2
(en)
|
2006-05-23 |
2013-09-10 |
Air Products And Chemicals, Inc. |
Process for producing silicon and oxide films from organoaminosilane precursors
|
|
US8278176B2
(en)
|
2006-06-07 |
2012-10-02 |
Asm America, Inc. |
Selective epitaxial formation of semiconductor films
|
|
US7691757B2
(en)
|
2006-06-22 |
2010-04-06 |
Asm International N.V. |
Deposition of complex nitride films
|
|
US7648853B2
(en)
|
2006-07-11 |
2010-01-19 |
Asm America, Inc. |
Dual channel heterostructure
|
|
US7547621B2
(en)
*
|
2006-07-25 |
2009-06-16 |
Applied Materials, Inc. |
LPCVD gate hard mask
|
|
US8153513B2
(en)
*
|
2006-07-25 |
2012-04-10 |
Silicon Genesis Corporation |
Method and system for continuous large-area scanning implantation process
|
|
CN101496153A
(zh)
*
|
2006-07-31 |
2009-07-29 |
应用材料股份有限公司 |
形成含碳外延硅层的方法
|
|
WO2008033186A1
(en)
|
2006-07-31 |
2008-03-20 |
Applied Materials, Inc. |
Methods of controlling morphology during epitaxial layer formation
|
|
KR100753546B1
(ko)
*
|
2006-08-22 |
2007-08-30 |
삼성전자주식회사 |
트랜지스터의 게이트 및 그 형성 방법.
|
|
US7521379B2
(en)
*
|
2006-10-09 |
2009-04-21 |
Applied Materials, Inc. |
Deposition and densification process for titanium nitride barrier layers
|
|
EP2076558B8
(de)
*
|
2006-10-24 |
2018-08-01 |
Dow Silicones Corporation |
Neopentasilan enthaltende zusammensetzung und herstellungsverfahren dafür
|
|
US7550758B2
(en)
|
2006-10-31 |
2009-06-23 |
Atmel Corporation |
Method for providing a nanoscale, high electron mobility transistor (HEMT) on insulator
|
|
CN101495672B
(zh)
|
2006-11-02 |
2011-12-07 |
高级技术材料公司 |
对于金属薄膜的cvd/ald有用的锑及锗复合物
|
|
US7642150B2
(en)
*
|
2006-11-08 |
2010-01-05 |
Varian Semiconductor Equipment Associates, Inc. |
Techniques for forming shallow junctions
|
|
US7837790B2
(en)
*
|
2006-12-01 |
2010-11-23 |
Applied Materials, Inc. |
Formation and treatment of epitaxial layer containing silicon and carbon
|
|
US7741200B2
(en)
*
|
2006-12-01 |
2010-06-22 |
Applied Materials, Inc. |
Formation and treatment of epitaxial layer containing silicon and carbon
|
|
US20080132039A1
(en)
*
|
2006-12-01 |
2008-06-05 |
Yonah Cho |
Formation and treatment of epitaxial layer containing silicon and carbon
|
|
US7897495B2
(en)
*
|
2006-12-12 |
2011-03-01 |
Applied Materials, Inc. |
Formation of epitaxial layer containing silicon and carbon
|
|
US20080138955A1
(en)
*
|
2006-12-12 |
2008-06-12 |
Zhiyuan Ye |
Formation of epitaxial layer containing silicon
|
|
US7960236B2
(en)
*
|
2006-12-12 |
2011-06-14 |
Applied Materials, Inc. |
Phosphorus containing Si epitaxial layers in N-type source/drain junctions
|
|
US8394196B2
(en)
*
|
2006-12-12 |
2013-03-12 |
Applied Materials, Inc. |
Formation of in-situ phosphorus doped epitaxial layer containing silicon and carbon
|
|
US8110412B2
(en)
*
|
2006-12-22 |
2012-02-07 |
Spansion Llc |
Integrated circuit wafer system with control strategy
|
|
US20080173239A1
(en)
*
|
2007-01-24 |
2008-07-24 |
Yuri Makarov |
Method, system, and apparatus for the growth of SiC and related or similar material, by chemical vapor deposition, using precursors in modified cold-wall reactor
|
|
US7901508B2
(en)
*
|
2007-01-24 |
2011-03-08 |
Widetronix, Inc. |
Method, system, and apparatus for the growth of SiC and related or similar material, by chemical vapor deposition, using precursors in modified cold-wall reactor
|
|
US9064960B2
(en)
*
|
2007-01-31 |
2015-06-23 |
Applied Materials, Inc. |
Selective epitaxy process control
|
|
ITMI20070271A1
(it)
*
|
2007-02-14 |
2008-08-15 |
St Microelectronics Srl |
Processo peer fabbricare un dispositivo tft con regioni di source e dain aventi un profilo di drogante graduale
|
|
JP2008218661A
(ja)
*
|
2007-03-02 |
2008-09-18 |
Fujitsu Ltd |
電界効果型半導体装置及びその製造方法
|
|
US8367548B2
(en)
*
|
2007-03-16 |
2013-02-05 |
Asm America, Inc. |
Stable silicide films and methods for making the same
|
|
EP1973150A1
(de)
*
|
2007-03-20 |
2008-09-24 |
S.O.I. Tec Silicon on Insulator Technologies S.A. |
(110)-ausgerichtetes Siliziumsubstrat und gebondetes Substratpaar mit diesem (110)-ausgerichteten Siliziumsubstrat sowie entsprechende Herstellungsverfahren dafür
|
|
US7456061B2
(en)
*
|
2007-03-30 |
2008-11-25 |
Agere Systems Inc. |
Method to reduce boron penetration in a SiGe bipolar device
|
|
US20080246101A1
(en)
*
|
2007-04-05 |
2008-10-09 |
Applied Materials Inc. |
Method of poly-silicon grain structure formation
|
|
JP4854591B2
(ja)
*
|
2007-05-14 |
2012-01-18 |
株式会社日立国際電気 |
半導体装置の製造方法及び基板処理装置
|
|
US7629256B2
(en)
|
2007-05-14 |
2009-12-08 |
Asm International N.V. |
In situ silicon and titanium nitride deposition
|
|
ES2331824B1
(es)
*
|
2007-06-18 |
2010-10-22 |
Consejo Superior De Investigaciones Cientificas (Csic) |
Microcabidades opticas y esponjas fotonicas, procedimiento de producc ion y sus aplicaciones en la fabricacion de dispositivos fotonicos.
|
|
US8017182B2
(en)
*
|
2007-06-21 |
2011-09-13 |
Asm International N.V. |
Method for depositing thin films by mixed pulsed CVD and ALD
|
|
US7638170B2
(en)
|
2007-06-21 |
2009-12-29 |
Asm International N.V. |
Low resistivity metal carbonitride thin film deposition by atomic layer deposition
|
|
US8102694B2
(en)
*
|
2007-06-25 |
2012-01-24 |
Sandisk 3D Llc |
Nonvolatile memory device containing carbon or nitrogen doped diode
|
|
US8072791B2
(en)
*
|
2007-06-25 |
2011-12-06 |
Sandisk 3D Llc |
Method of making nonvolatile memory device containing carbon or nitrogen doped diode
|
|
EP2168161B1
(de)
*
|
2007-06-25 |
2015-09-23 |
Sandisk 3D LLC |
Nichtflüchtige speicheranordnung mit einer kohlenstoff- oder stickstoffdotierten diode und herstellungsverfahren dafür
|
|
KR100812089B1
(ko)
*
|
2007-06-26 |
2008-03-07 |
주식회사 동부하이텍 |
플래시 메모리 소자의 제조 방법
|
|
JP5164465B2
(ja)
*
|
2007-07-27 |
2013-03-21 |
株式会社アルバック |
樹脂基板
|
|
US7799376B2
(en)
*
|
2007-07-27 |
2010-09-21 |
Dalsa Semiconductor Inc. |
Method of controlling film stress in MEMS devices
|
|
US7851307B2
(en)
|
2007-08-17 |
2010-12-14 |
Micron Technology, Inc. |
Method of forming complex oxide nanodots for a charge trap
|
|
US7759199B2
(en)
|
2007-09-19 |
2010-07-20 |
Asm America, Inc. |
Stressor for engineered strain on channel
|
|
US7972898B2
(en)
*
|
2007-09-26 |
2011-07-05 |
Eastman Kodak Company |
Process for making doped zinc oxide
|
|
US20090206275A1
(en)
*
|
2007-10-03 |
2009-08-20 |
Silcon Genesis Corporation |
Accelerator particle beam apparatus and method for low contaminate processing
|
|
US7776698B2
(en)
|
2007-10-05 |
2010-08-17 |
Applied Materials, Inc. |
Selective formation of silicon carbon epitaxial layer
|
|
US7867923B2
(en)
*
|
2007-10-22 |
2011-01-11 |
Applied Materials, Inc. |
High quality silicon oxide films by remote plasma CVD from disilane precursors
|
|
US7939447B2
(en)
*
|
2007-10-26 |
2011-05-10 |
Asm America, Inc. |
Inhibitors for selective deposition of silicon containing films
|
|
US7772097B2
(en)
*
|
2007-11-05 |
2010-08-10 |
Asm America, Inc. |
Methods of selectively depositing silicon-containing films
|
|
US8282735B2
(en)
|
2007-11-27 |
2012-10-09 |
Asm Genitech Korea Ltd. |
Atomic layer deposition apparatus
|
|
CN101951915A
(zh)
|
2007-12-03 |
2011-01-19 |
加利福尼亚大学董事会 |
用于刺猬蛋白信号、骨诱导、抗脂肪形成和wnt信号的激活的氧固醇
|
|
US7655543B2
(en)
*
|
2007-12-21 |
2010-02-02 |
Asm America, Inc. |
Separate injection of reactive species in selective formation of films
|
|
US7989360B2
(en)
*
|
2008-01-07 |
2011-08-02 |
Micron Technology, Inc. |
Semiconductor processing methods, and methods for forming silicon dioxide
|
|
US8347814B2
(en)
*
|
2008-01-22 |
2013-01-08 |
Raytheon Canada Limited |
Method and apparatus for coating a curved surface
|
|
US8318252B2
(en)
*
|
2008-01-28 |
2012-11-27 |
Air Products And Chemicals, Inc. |
Antimony precursors for GST films in ALD/CVD processes
|
|
US20090203197A1
(en)
*
|
2008-02-08 |
2009-08-13 |
Hiroji Hanawa |
Novel method for conformal plasma immersed ion implantation assisted by atomic layer deposition
|
|
US8003957B2
(en)
*
|
2008-02-11 |
2011-08-23 |
Varian Semiconductor Equipment Associates, Inc. |
Ethane implantation with a dilution gas
|
|
US20090200494A1
(en)
*
|
2008-02-11 |
2009-08-13 |
Varian Semiconductor Equipment Associates, Inc. |
Techniques for cold implantation of carbon-containing species
|
|
US20090258151A1
(en)
*
|
2008-04-10 |
2009-10-15 |
Raytheon Company |
Method and Apparatus for Coating Curved Surfaces
|
|
US7720342B2
(en)
*
|
2008-04-15 |
2010-05-18 |
Hewlett-Packard Development Company, L.P. |
Optical device with a graded bandgap structure and methods of making and using the same
|
|
US7947552B2
(en)
*
|
2008-04-21 |
2011-05-24 |
Infineon Technologies Ag |
Process for the simultaneous deposition of crystalline and amorphous layers with doping
|
|
KR101580575B1
(ko)
|
2008-04-25 |
2015-12-28 |
에이에스엠 인터내셔널 엔.브이. |
텔루르와 셀렌 박막의 원자층 증착을 위한 전구체의 합성과 그 용도
|
|
US20090267118A1
(en)
*
|
2008-04-29 |
2009-10-29 |
International Business Machines Corporation |
Method for forming carbon silicon alloy (csa) and structures thereof
|
|
US8398776B2
(en)
*
|
2008-05-12 |
2013-03-19 |
Raytheon Canada Limited |
Method and apparatus for supporting workpieces in a coating apparatus
|
|
WO2009148878A2
(en)
*
|
2008-05-29 |
2009-12-10 |
Ndsu Research Foundation |
Method of forming functionalized silanes
|
|
US7943527B2
(en)
*
|
2008-05-30 |
2011-05-17 |
The Board Of Trustees Of The University Of Illinois |
Surface preparation for thin film growth by enhanced nucleation
|
|
US8246748B2
(en)
*
|
2008-07-09 |
2012-08-21 |
Raytheon Canada Limited |
Method and apparatus for coating surfaces
|
|
US8343583B2
(en)
|
2008-07-10 |
2013-01-01 |
Asm International N.V. |
Method for vaporizing non-gaseous precursor in a fluidized bed
|
|
JP5336956B2
(ja)
*
|
2008-07-31 |
2013-11-06 |
株式会社日立国際電気 |
半導体装置の製造方法及び基板処理装置
|
|
US8491967B2
(en)
|
2008-09-08 |
2013-07-23 |
Applied Materials, Inc. |
In-situ chamber treatment and deposition process
|
|
US20100062149A1
(en)
|
2008-09-08 |
2010-03-11 |
Applied Materials, Inc. |
Method for tuning a deposition rate during an atomic layer deposition process
|
|
US8252112B2
(en)
*
|
2008-09-12 |
2012-08-28 |
Ovshinsky Innovation, Llc |
High speed thin film deposition via pre-selected intermediate
|
|
US10378106B2
(en)
|
2008-11-14 |
2019-08-13 |
Asm Ip Holding B.V. |
Method of forming insulation film by modified PEALD
|
|
US8012876B2
(en)
*
|
2008-12-02 |
2011-09-06 |
Asm International N.V. |
Delivery of vapor precursor from solid source
|
|
US7833906B2
(en)
|
2008-12-11 |
2010-11-16 |
Asm International N.V. |
Titanium silicon nitride deposition
|
|
DE102008063402B4
(de)
*
|
2008-12-31 |
2013-10-17 |
Advanced Micro Devices, Inc. |
Verringerung der Schwellwertspannungsfluktuation in Transistoren mit einer Kanalhalbleiterlegierung durch Verringern der Abscheideungleichmäßigkeiten
|
|
US7749917B1
(en)
*
|
2008-12-31 |
2010-07-06 |
Applied Materials, Inc. |
Dry cleaning of silicon surface for solar cell applications
|
|
US20100178758A1
(en)
*
|
2009-01-15 |
2010-07-15 |
Macronix International Co., Ltd. |
Methods for fabricating dielectric layer and non-volatile memory
|
|
JP2012516572A
(ja)
*
|
2009-01-30 |
2012-07-19 |
エイエムジー・アイデアルキャスト・ソーラー・コーポレーション |
シード層及びシード層の製造方法
|
|
US9394608B2
(en)
|
2009-04-06 |
2016-07-19 |
Asm America, Inc. |
Semiconductor processing reactor and components thereof
|
|
US8486191B2
(en)
|
2009-04-07 |
2013-07-16 |
Asm America, Inc. |
Substrate reactor with adjustable injectors for mixing gases within reaction chamber
|
|
DE102009002758A1
(de)
*
|
2009-04-30 |
2010-11-11 |
Evonik Degussa Gmbh |
Bandgap Tailoring von Solarzellen aus Flüssigsilan mittels Germanium-Zugabe
|
|
US20100279479A1
(en)
*
|
2009-05-01 |
2010-11-04 |
Varian Semiconductor Equipment Associates, Inc. |
Formation Of Raised Source/Drain On A Strained Thin Film Implanted With Cold And/Or Molecular Carbon
|
|
DE102009032854B4
(de)
*
|
2009-07-13 |
2015-07-23 |
Texas Instruments Deutschland Gmbh |
Verfahren zur Herstellung von Bipolartransistorstrukturen in einem Halbleiterprozess
|
|
JP2011023718A
(ja)
*
|
2009-07-15 |
2011-02-03 |
Asm Japan Kk |
PEALDによってSi−N結合を有するストレス調節された誘電体膜を形成する方法
|
|
US20110020623A1
(en)
*
|
2009-07-22 |
2011-01-27 |
Raytheon Company |
Method and Apparatus for Repairing an Optical Component Substrate Through Coating
|
|
US8802201B2
(en)
|
2009-08-14 |
2014-08-12 |
Asm America, Inc. |
Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species
|
|
US8421162B2
(en)
|
2009-09-30 |
2013-04-16 |
Suvolta, Inc. |
Advanced transistors with punch through suppression
|
|
US8273617B2
(en)
|
2009-09-30 |
2012-09-25 |
Suvolta, Inc. |
Electronic devices and systems, and methods for making and using the same
|
|
CN102687243B
(zh)
|
2009-10-26 |
2016-05-11 |
Asm国际公司 |
用于含va族元素的薄膜ald的前体的合成和使用
|
|
US8367528B2
(en)
|
2009-11-17 |
2013-02-05 |
Asm America, Inc. |
Cyclical epitaxial deposition and etch
|
|
US8975429B2
(en)
|
2010-01-28 |
2015-03-10 |
Ndsu Research Foundation |
Method of producing cyclohexasilane compounds
|
|
US20120142172A1
(en)
*
|
2010-03-25 |
2012-06-07 |
Keith Fox |
Pecvd deposition of smooth polysilicon films
|
|
US8709551B2
(en)
*
|
2010-03-25 |
2014-04-29 |
Novellus Systems, Inc. |
Smooth silicon-containing films
|
|
US20130157466A1
(en)
*
|
2010-03-25 |
2013-06-20 |
Keith Fox |
Silicon nitride films for semiconductor device applications
|
|
US8741394B2
(en)
*
|
2010-03-25 |
2014-06-03 |
Novellus Systems, Inc. |
In-situ deposition of film stacks
|
|
US9028924B2
(en)
|
2010-03-25 |
2015-05-12 |
Novellus Systems, Inc. |
In-situ deposition of film stacks
|
|
US8530286B2
(en)
|
2010-04-12 |
2013-09-10 |
Suvolta, Inc. |
Low power semiconductor transistor structure and method of fabrication thereof
|
|
US9611544B2
(en)
|
2010-04-15 |
2017-04-04 |
Novellus Systems, Inc. |
Plasma activated conformal dielectric film deposition
|
|
US8956983B2
(en)
|
2010-04-15 |
2015-02-17 |
Novellus Systems, Inc. |
Conformal doping via plasma activated atomic layer deposition and conformal film deposition
|
|
US9892917B2
(en)
|
2010-04-15 |
2018-02-13 |
Lam Research Corporation |
Plasma assisted atomic layer deposition of multi-layer films for patterning applications
|
|
US9997357B2
(en)
|
2010-04-15 |
2018-06-12 |
Lam Research Corporation |
Capped ALD films for doping fin-shaped channel regions of 3-D IC transistors
|
|
US9257274B2
(en)
|
2010-04-15 |
2016-02-09 |
Lam Research Corporation |
Gapfill of variable aspect ratio features with a composite PEALD and PECVD method
|
|
US9390909B2
(en)
|
2013-11-07 |
2016-07-12 |
Novellus Systems, Inc. |
Soft landing nanolaminates for advanced patterning
|
|
US8728956B2
(en)
|
2010-04-15 |
2014-05-20 |
Novellus Systems, Inc. |
Plasma activated conformal film deposition
|
|
US9373500B2
(en)
|
2014-02-21 |
2016-06-21 |
Lam Research Corporation |
Plasma assisted atomic layer deposition titanium oxide for conformal encapsulation and gapfill applications
|
|
US8637411B2
(en)
|
2010-04-15 |
2014-01-28 |
Novellus Systems, Inc. |
Plasma activated conformal dielectric film deposition
|
|
US9076646B2
(en)
|
2010-04-15 |
2015-07-07 |
Lam Research Corporation |
Plasma enhanced atomic layer deposition with pulsed plasma exposure
|
|
JP5692763B2
(ja)
*
|
2010-05-20 |
2015-04-01 |
東京エレクトロン株式会社 |
シリコン膜の形成方法およびその形成装置
|
|
US8912353B2
(en)
|
2010-06-02 |
2014-12-16 |
Air Products And Chemicals, Inc. |
Organoaminosilane precursors and methods for depositing films comprising same
|
|
US8569128B2
(en)
|
2010-06-21 |
2013-10-29 |
Suvolta, Inc. |
Semiconductor structure and method of fabrication thereof with mixed metal types
|
|
US8759872B2
(en)
|
2010-06-22 |
2014-06-24 |
Suvolta, Inc. |
Transistor with threshold voltage set notch and method of fabrication thereof
|
|
JP2013531899A
(ja)
|
2010-07-02 |
2013-08-08 |
マシスン トライ−ガス インコーポレイテッド |
Si−含有材料および置換的にドーピングされた結晶性si−含有材料の選択エピタキシー
|
|
US8466045B2
(en)
*
|
2010-07-02 |
2013-06-18 |
Tokyo Electron Limited |
Method of forming strained epitaxial carbon-doped silicon films
|
|
US8263988B2
(en)
|
2010-07-16 |
2012-09-11 |
Micron Technology, Inc. |
Solid state lighting devices with reduced crystal lattice dislocations and associated methods of manufacturing
|
|
US9017486B2
(en)
*
|
2010-09-09 |
2015-04-28 |
International Business Machines Corporation |
Deposition chamber cleaning method including stressed cleaning layer
|
|
KR20180104171A
(ko)
*
|
2010-09-15 |
2018-09-19 |
프랙스에어 테크놀로지, 인코포레이티드 |
이온 소스의 수명 연장 방법
|
|
US8524612B2
(en)
|
2010-09-23 |
2013-09-03 |
Novellus Systems, Inc. |
Plasma-activated deposition of conformal films
|
|
US9685320B2
(en)
|
2010-09-23 |
2017-06-20 |
Lam Research Corporation |
Methods for depositing silicon oxide
|
|
US8377783B2
(en)
|
2010-09-30 |
2013-02-19 |
Suvolta, Inc. |
Method for reducing punch-through in a transistor device
|
|
KR101790206B1
(ko)
|
2010-10-05 |
2017-10-25 |
실코텍 코포레이션 |
내마모성 코팅, 물건 및 방법
|
|
JP5544343B2
(ja)
*
|
2010-10-29 |
2014-07-09 |
東京エレクトロン株式会社 |
成膜装置
|
|
SG190729A1
(en)
*
|
2010-11-30 |
2013-07-31 |
Advanced Tech Materials |
Ion implanter system including remote dopant source, and method comprising same
|
|
US8404551B2
(en)
|
2010-12-03 |
2013-03-26 |
Suvolta, Inc. |
Source/drain extension control for advanced transistors
|
|
US8901537B2
(en)
|
2010-12-21 |
2014-12-02 |
Intel Corporation |
Transistors with high concentration of boron doped germanium
|
|
US9484432B2
(en)
|
2010-12-21 |
2016-11-01 |
Intel Corporation |
Contact resistance reduction employing germanium overlayer pre-contact metalization
|
|
EP2474643B1
(de)
|
2011-01-11 |
2016-01-06 |
Imec |
Methode für die direkte Abscheidung von Germaniumschichten
|
|
DE102011009963A1
(de)
*
|
2011-02-01 |
2012-08-02 |
Linde Aktiengesellschaft |
Verfahren zum Lichtbogenfügen und Schutzgasmischung
|
|
DE102011009964A1
(de)
*
|
2011-02-01 |
2012-08-02 |
Linde Aktiengesellschaft |
Verfahren zum Weich-, Hart- und Hochtemperaturlöten
|
|
US8461875B1
(en)
|
2011-02-18 |
2013-06-11 |
Suvolta, Inc. |
Digital circuits having improved transistors, and methods therefor
|
|
US8525271B2
(en)
|
2011-03-03 |
2013-09-03 |
Suvolta, Inc. |
Semiconductor structure with improved channel stack and method for fabrication thereof
|
|
US8400219B2
(en)
|
2011-03-24 |
2013-03-19 |
Suvolta, Inc. |
Analog circuits having improved transistors, and methods therefor
|
|
US8748270B1
(en)
|
2011-03-30 |
2014-06-10 |
Suvolta, Inc. |
Process for manufacturing an improved analog transistor
|
|
US8647993B2
(en)
|
2011-04-11 |
2014-02-11 |
Novellus Systems, Inc. |
Methods for UV-assisted conformal film deposition
|
|
US8796048B1
(en)
|
2011-05-11 |
2014-08-05 |
Suvolta, Inc. |
Monitoring and measurement of thin film layers
|
|
US8999861B1
(en)
|
2011-05-11 |
2015-04-07 |
Suvolta, Inc. |
Semiconductor structure with substitutional boron and method for fabrication thereof
|
|
US8811068B1
(en)
|
2011-05-13 |
2014-08-19 |
Suvolta, Inc. |
Integrated circuit devices and methods
|
|
US8569156B1
(en)
|
2011-05-16 |
2013-10-29 |
Suvolta, Inc. |
Reducing or eliminating pre-amorphization in transistor manufacture
|
|
US8809170B2
(en)
|
2011-05-19 |
2014-08-19 |
Asm America Inc. |
High throughput cyclical epitaxial deposition and etch process
|
|
US8771807B2
(en)
|
2011-05-24 |
2014-07-08 |
Air Products And Chemicals, Inc. |
Organoaminosilane precursors and methods for making and using same
|
|
US8735987B1
(en)
|
2011-06-06 |
2014-05-27 |
Suvolta, Inc. |
CMOS gate stack structures and processes
|
|
US9312155B2
(en)
|
2011-06-06 |
2016-04-12 |
Asm Japan K.K. |
High-throughput semiconductor-processing apparatus equipped with multiple dual-chamber modules
|
|
US10043934B2
(en)
*
|
2011-06-08 |
2018-08-07 |
International Business Machines Corporation |
Silicon-containing heterojunction photovoltaic element and device
|
|
US9793148B2
(en)
|
2011-06-22 |
2017-10-17 |
Asm Japan K.K. |
Method for positioning wafers in multiple wafer transport
|
|
US8995204B2
(en)
|
2011-06-23 |
2015-03-31 |
Suvolta, Inc. |
Circuit devices and methods having adjustable transistor body bias
|
|
US10364496B2
(en)
|
2011-06-27 |
2019-07-30 |
Asm Ip Holding B.V. |
Dual section module having shared and unshared mass flow controllers
|
|
US10854498B2
(en)
|
2011-07-15 |
2020-12-01 |
Asm Ip Holding B.V. |
Wafer-supporting device and method for producing same
|
|
US20130023129A1
(en)
|
2011-07-20 |
2013-01-24 |
Asm America, Inc. |
Pressure transmitter for a semiconductor processing environment
|
|
US8629016B1
(en)
|
2011-07-26 |
2014-01-14 |
Suvolta, Inc. |
Multiple transistor types formed in a common epitaxial layer by differential out-diffusion from a doped underlayer
|
|
KR101891373B1
(ko)
|
2011-08-05 |
2018-08-24 |
엠아이이 후지쯔 세미컨덕터 리미티드 |
핀 구조물을 갖는 반도체 디바이스 및 그 제조 방법
|
|
US8748986B1
(en)
|
2011-08-05 |
2014-06-10 |
Suvolta, Inc. |
Electronic device with controlled threshold voltage
|
|
US8778811B2
(en)
*
|
2011-08-18 |
2014-07-15 |
Intermolecular, Inc. |
Low temperature migration enhanced Si-Ge epitaxy with plasma assisted surface activation
|
|
US8614128B1
(en)
|
2011-08-23 |
2013-12-24 |
Suvolta, Inc. |
CMOS structures and processes based on selective thinning
|
|
US8645878B1
(en)
|
2011-08-23 |
2014-02-04 |
Suvolta, Inc. |
Porting a circuit design from a first semiconductor process to a second semiconductor process
|
|
US8713511B1
(en)
|
2011-09-16 |
2014-04-29 |
Suvolta, Inc. |
Tools and methods for yield-aware semiconductor manufacturing process target generation
|
|
US8841742B2
(en)
|
2011-09-27 |
2014-09-23 |
Soitec |
Low temperature layer transfer process using donor structure with material in recesses in transfer layer, semiconductor structures fabricated using such methods
|
|
JP5741382B2
(ja)
|
2011-09-30 |
2015-07-01 |
東京エレクトロン株式会社 |
薄膜の形成方法及び成膜装置
|
|
US9236466B1
(en)
|
2011-10-07 |
2016-01-12 |
Mie Fujitsu Semiconductor Limited |
Analog circuits having improved insulated gate transistors, and methods therefor
|
|
US9017481B1
(en)
|
2011-10-28 |
2015-04-28 |
Asm America, Inc. |
Process feed management for semiconductor substrate processing
|
|
US8895327B1
(en)
|
2011-12-09 |
2014-11-25 |
Suvolta, Inc. |
Tipless transistors, short-tip transistors, and methods and circuits therefor
|
|
US8819603B1
(en)
|
2011-12-15 |
2014-08-26 |
Suvolta, Inc. |
Memory circuits and methods of making and designing the same
|
|
US8883600B1
(en)
|
2011-12-22 |
2014-11-11 |
Suvolta, Inc. |
Transistor having reduced junction leakage and methods of forming thereof
|
|
US8599623B1
(en)
|
2011-12-23 |
2013-12-03 |
Suvolta, Inc. |
Circuits and methods for measuring circuit elements in an integrated circuit device
|
|
US8592328B2
(en)
|
2012-01-20 |
2013-11-26 |
Novellus Systems, Inc. |
Method for depositing a chlorine-free conformal sin film
|
|
US8877619B1
(en)
|
2012-01-23 |
2014-11-04 |
Suvolta, Inc. |
Process for manufacture of integrated circuits with different channel doping transistor architectures and devices therefrom
|
|
US8970289B1
(en)
|
2012-01-23 |
2015-03-03 |
Suvolta, Inc. |
Circuits and devices for generating bi-directional body bias voltages, and methods therefor
|
|
US9093550B1
(en)
|
2012-01-31 |
2015-07-28 |
Mie Fujitsu Semiconductor Limited |
Integrated circuits having a plurality of high-K metal gate FETs with various combinations of channel foundation structure and gate stack structure and methods of making same
|
|
US8728955B2
(en)
|
2012-02-14 |
2014-05-20 |
Novellus Systems, Inc. |
Method of plasma activated deposition of a conformal film on a substrate surface
|
|
US9406567B1
(en)
|
2012-02-28 |
2016-08-02 |
Mie Fujitsu Semiconductor Limited |
Method for fabricating multiple transistor devices on a substrate with varying threshold voltages
|
|
US9127345B2
(en)
|
2012-03-06 |
2015-09-08 |
Asm America, Inc. |
Methods for depositing an epitaxial silicon germanium layer having a germanium to silicon ratio greater than 1:1 using silylgermane and a diluent
|
|
US8863064B1
(en)
|
2012-03-23 |
2014-10-14 |
Suvolta, Inc. |
SRAM cell layout structure and devices therefrom
|
|
US8946830B2
(en)
|
2012-04-04 |
2015-02-03 |
Asm Ip Holdings B.V. |
Metal oxide protective layer for a semiconductor device
|
|
KR102025441B1
(ko)
|
2012-04-06 |
2019-09-25 |
노벨러스 시스템즈, 인코포레이티드 |
증착 후 소프트 어닐링
|
|
CA2872751A1
(en)
|
2012-05-07 |
2013-11-14 |
The Regents Of The University Of California |
Oxysterol analogue oxy133 induces osteogenesis and hedgehog signaling and inhibits adipogenesis
|
|
US9117668B2
(en)
|
2012-05-23 |
2015-08-25 |
Novellus Systems, Inc. |
PECVD deposition of smooth silicon films
|
|
US8889529B2
(en)
*
|
2012-05-24 |
2014-11-18 |
International Business Machines Corporation |
Heterojunction bipolar transistors with thin epitaxial contacts
|
|
US9064924B2
(en)
*
|
2012-05-24 |
2015-06-23 |
International Business Machines Corporation |
Heterojunction bipolar transistors with intrinsic interlayers
|
|
US9299698B2
(en)
|
2012-06-27 |
2016-03-29 |
Mie Fujitsu Semiconductor Limited |
Semiconductor structure with multiple transistors having various threshold voltages
|
|
US9064694B2
(en)
*
|
2012-07-12 |
2015-06-23 |
Tokyo Electron Limited |
Nitridation of atomic layer deposited high-k dielectrics using trisilylamine
|
|
US9388491B2
(en)
|
2012-07-23 |
2016-07-12 |
Novellus Systems, Inc. |
Method for deposition of conformal films with catalysis assisted low temperature CVD
|
|
US9558931B2
(en)
|
2012-07-27 |
2017-01-31 |
Asm Ip Holding B.V. |
System and method for gas-phase sulfur passivation of a semiconductor surface
|
|
US9659799B2
(en)
|
2012-08-28 |
2017-05-23 |
Asm Ip Holding B.V. |
Systems and methods for dynamic semiconductor process scheduling
|
|
US8637955B1
(en)
|
2012-08-31 |
2014-01-28 |
Suvolta, Inc. |
Semiconductor structure with reduced junction leakage and method of fabrication thereof
|
|
US9171715B2
(en)
|
2012-09-05 |
2015-10-27 |
Asm Ip Holding B.V. |
Atomic layer deposition of GeO2
|
|
US9021985B2
(en)
|
2012-09-12 |
2015-05-05 |
Asm Ip Holdings B.V. |
Process gas management for an inductively-coupled plasma deposition reactor
|
|
US9112057B1
(en)
|
2012-09-18 |
2015-08-18 |
Mie Fujitsu Semiconductor Limited |
Semiconductor devices with dopant migration suppression and method of fabrication thereof
|
|
US9041126B2
(en)
|
2012-09-21 |
2015-05-26 |
Mie Fujitsu Semiconductor Limited |
Deeply depleted MOS transistors having a screening layer and methods thereof
|
|
US9324811B2
(en)
|
2012-09-26 |
2016-04-26 |
Asm Ip Holding B.V. |
Structures and devices including a tensile-stressed silicon arsenic layer and methods of forming same
|
|
US8946035B2
(en)
|
2012-09-27 |
2015-02-03 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Replacement channels for semiconductor devices and methods for forming the same using dopant concentration boost
|
|
WO2014057748A1
(ja)
|
2012-10-12 |
2014-04-17 |
住友電気工業株式会社 |
Iii族窒化物複合基板およびその製造方法、ならびにiii族窒化物半導体デバイスの製造方法
|
|
US10714315B2
(en)
|
2012-10-12 |
2020-07-14 |
Asm Ip Holdings B.V. |
Semiconductor reaction chamber showerhead
|
|
US9355839B2
(en)
|
2012-10-23 |
2016-05-31 |
Lam Research Corporation |
Sub-saturated atomic layer deposition and conformal film deposition
|
|
WO2014071049A2
(en)
|
2012-10-31 |
2014-05-08 |
Suvolta, Inc. |
Dram-type device with low variation transistor peripheral circuits, and related methods
|
|
JP2014093345A
(ja)
*
|
2012-11-01 |
2014-05-19 |
Japan Advanced Institute Of Science & Technology Hokuriku |
複数の基板上へシリコン膜を一括して形成する方法
|
|
US8816754B1
(en)
|
2012-11-02 |
2014-08-26 |
Suvolta, Inc. |
Body bias circuits and methods
|
|
SG2013083241A
(en)
|
2012-11-08 |
2014-06-27 |
Novellus Systems Inc |
Conformal film deposition for gapfill
|
|
SG2013083654A
(en)
|
2012-11-08 |
2014-06-27 |
Novellus Systems Inc |
Methods for depositing films on sensitive substrates
|
|
US9093997B1
(en)
|
2012-11-15 |
2015-07-28 |
Mie Fujitsu Semiconductor Limited |
Slew based process and bias monitors and related methods
|
|
US9512519B2
(en)
|
2012-12-03 |
2016-12-06 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Atomic layer deposition apparatus and method
|
|
US9070477B1
(en)
|
2012-12-12 |
2015-06-30 |
Mie Fujitsu Semiconductor Limited |
Bit interleaved low voltage static random access memory (SRAM) and related methods
|
|
US9112484B1
(en)
|
2012-12-20 |
2015-08-18 |
Mie Fujitsu Semiconductor Limited |
Integrated circuit process and bias monitors and related methods
|
|
US9640416B2
(en)
|
2012-12-26 |
2017-05-02 |
Asm Ip Holding B.V. |
Single-and dual-chamber module-attachable wafer-handling chamber
|
|
CN103107095A
(zh)
*
|
2013-01-25 |
2013-05-15 |
京东方科技集团股份有限公司 |
薄膜晶体管及其制作方法、阵列基板、显示装置
|
|
US9018108B2
(en)
|
2013-01-25 |
2015-04-28 |
Applied Materials, Inc. |
Low shrinkage dielectric films
|
|
US20160376700A1
(en)
|
2013-02-01 |
2016-12-29 |
Asm Ip Holding B.V. |
System for treatment of deposition reactor
|
|
US9268885B1
(en)
|
2013-02-28 |
2016-02-23 |
Mie Fujitsu Semiconductor Limited |
Integrated circuit device methods and models with predicted device metric variations
|
|
US8994415B1
(en)
|
2013-03-01 |
2015-03-31 |
Suvolta, Inc. |
Multiple VDD clock buffer
|
|
US9484191B2
(en)
|
2013-03-08 |
2016-11-01 |
Asm Ip Holding B.V. |
Pulsed remote plasma method and system
|
|
US9589770B2
(en)
|
2013-03-08 |
2017-03-07 |
Asm Ip Holding B.V. |
Method and systems for in-situ formation of intermediate reactive species
|
|
US8988153B1
(en)
|
2013-03-09 |
2015-03-24 |
Suvolta, Inc. |
Ring oscillator with NMOS or PMOS variation insensitivity
|
|
US9299801B1
(en)
|
2013-03-14 |
2016-03-29 |
Mie Fujitsu Semiconductor Limited |
Method for fabricating a transistor device with a tuned dopant profile
|
|
US9449967B1
(en)
|
2013-03-15 |
2016-09-20 |
Fujitsu Semiconductor Limited |
Transistor array structure
|
|
US9112495B1
(en)
|
2013-03-15 |
2015-08-18 |
Mie Fujitsu Semiconductor Limited |
Integrated circuit device body bias circuits and methods
|
|
US9214630B2
(en)
|
2013-04-11 |
2015-12-15 |
Air Products And Chemicals, Inc. |
Method of making a multicomponent film
|
|
JP2016517888A
(ja)
|
2013-05-02 |
2016-06-20 |
ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア |
骨選択的骨形成のオキシステロール骨標的薬剤
|
|
US9478571B1
(en)
|
2013-05-24 |
2016-10-25 |
Mie Fujitsu Semiconductor Limited |
Buried channel deeply depleted channel transistor
|
|
US8895415B1
(en)
|
2013-05-31 |
2014-11-25 |
Novellus Systems, Inc. |
Tensile stressed doped amorphous silicon
|
|
EP2978868A4
(de)
*
|
2013-07-12 |
2017-01-04 |
Hewlett-Packard Development Company L.P. |
Amorphe dünnmetallschicht
|
|
US8993054B2
(en)
|
2013-07-12 |
2015-03-31 |
Asm Ip Holding B.V. |
Method and system to reduce outgassing in a reaction chamber
|
|
US9018111B2
(en)
|
2013-07-22 |
2015-04-28 |
Asm Ip Holding B.V. |
Semiconductor reaction chamber with plasma capabilities
|
|
US9793115B2
(en)
|
2013-08-14 |
2017-10-17 |
Asm Ip Holding B.V. |
Structures and devices including germanium-tin films and methods of forming same
|
|
US8976575B1
(en)
|
2013-08-29 |
2015-03-10 |
Suvolta, Inc. |
SRAM performance monitor
|
|
KR102326396B1
(ko)
|
2013-09-27 |
2021-11-12 |
레르 리키드 쏘시에떼 아노님 뿌르 레드 에렉스뿔라따시옹 데 프로세데 조르즈 클로드 |
아민 치환된 트리실릴아민 및 트리디실릴아민 화합물
|
|
US9240412B2
(en)
|
2013-09-27 |
2016-01-19 |
Asm Ip Holding B.V. |
Semiconductor structure and device and methods of forming same using selective epitaxial process
|
|
US9556516B2
(en)
|
2013-10-09 |
2017-01-31 |
ASM IP Holding B.V |
Method for forming Ti-containing film by PEALD using TDMAT or TDEAT
|
|
US10179947B2
(en)
|
2013-11-26 |
2019-01-15 |
Asm Ip Holding B.V. |
Method for forming conformal nitrided, oxidized, or carbonized dielectric film by atomic layer deposition
|
|
US20150171321A1
(en)
|
2013-12-13 |
2015-06-18 |
Micron Technology, Inc. |
Methods of forming metal on inhomogeneous surfaces and structures incorporating metal on inhomogeneous surfaces
|
|
US9218963B2
(en)
|
2013-12-19 |
2015-12-22 |
Asm Ip Holding B.V. |
Cyclical deposition of germanium
|
|
US9214334B2
(en)
|
2014-02-18 |
2015-12-15 |
Lam Research Corporation |
High growth rate process for conformal aluminum nitride
|
|
KR102195139B1
(ko)
|
2014-02-20 |
2020-12-24 |
삼성전자주식회사 |
반도체 장치의 제조 방법
|
|
US10683571B2
(en)
|
2014-02-25 |
2020-06-16 |
Asm Ip Holding B.V. |
Gas supply manifold and method of supplying gases to chamber using same
|
|
US9447498B2
(en)
|
2014-03-18 |
2016-09-20 |
Asm Ip Holding B.V. |
Method for performing uniform processing in gas system-sharing multiple reaction chambers
|
|
US10167557B2
(en)
|
2014-03-18 |
2019-01-01 |
Asm Ip Holding B.V. |
Gas distribution system, reactor including the system, and methods of using the same
|
|
US11015245B2
(en)
|
2014-03-19 |
2021-05-25 |
Asm Ip Holding B.V. |
Gas-phase reactor and system having exhaust plenum and components thereof
|
|
US9404587B2
(en)
|
2014-04-24 |
2016-08-02 |
ASM IP Holding B.V |
Lockout tagout for semiconductor vacuum valve
|
|
JP2014166957A
(ja)
*
|
2014-04-24 |
2014-09-11 |
Sumitomo Electric Ind Ltd |
炭化珪素半導体およびその製造方法と製造装置
|
|
US9710006B2
(en)
|
2014-07-25 |
2017-07-18 |
Mie Fujitsu Semiconductor Limited |
Power up body bias circuits and methods
|
|
US10858737B2
(en)
|
2014-07-28 |
2020-12-08 |
Asm Ip Holding B.V. |
Showerhead assembly and components thereof
|
|
WO2016018284A1
(en)
|
2014-07-30 |
2016-02-04 |
Hewlett-Packard Development Company, L.P. |
Amorphous metal alloy electrodes in non-volatile device applications
|
|
US9543180B2
(en)
|
2014-08-01 |
2017-01-10 |
Asm Ip Holding B.V. |
Apparatus and method for transporting wafers between wafer carrier and process tool under vacuum
|
|
US20170226640A1
(en)
*
|
2014-08-01 |
2017-08-10 |
3M Innovative Properties Company |
Substrate with amorphous, covalently-bonded layer and method of making the same
|
|
US9319013B2
(en)
|
2014-08-19 |
2016-04-19 |
Mie Fujitsu Semiconductor Limited |
Operational amplifier input offset correction with transistor threshold voltage adjustment
|
|
US9478438B2
(en)
|
2014-08-20 |
2016-10-25 |
Lam Research Corporation |
Method and apparatus to deposit pure titanium thin film at low temperature using titanium tetraiodide precursor
|
|
US9478411B2
(en)
|
2014-08-20 |
2016-10-25 |
Lam Research Corporation |
Method to tune TiOx stoichiometry using atomic layer deposited Ti film to minimize contact resistance for TiOx/Ti based MIS contact scheme for CMOS
|
|
US9890456B2
(en)
|
2014-08-21 |
2018-02-13 |
Asm Ip Holding B.V. |
Method and system for in situ formation of gas-phase compounds
|
|
US9657845B2
(en)
|
2014-10-07 |
2017-05-23 |
Asm Ip Holding B.V. |
Variable conductance gas distribution apparatus and method
|
|
US10941490B2
(en)
|
2014-10-07 |
2021-03-09 |
Asm Ip Holding B.V. |
Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same
|
|
KR102300403B1
(ko)
|
2014-11-19 |
2021-09-09 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법
|
|
CN105609406B
(zh)
*
|
2014-11-19 |
2018-09-28 |
株式会社日立国际电气 |
半导体器件的制造方法、衬底处理装置、气体供给系统
|
|
US9564312B2
(en)
|
2014-11-24 |
2017-02-07 |
Lam Research Corporation |
Selective inhibition in atomic layer deposition of silicon-containing films
|
|
US9390925B1
(en)
|
2014-12-17 |
2016-07-12 |
GlobalFoundries, Inc. |
Silicon—germanium (SiGe) fin formation
|
|
KR102263121B1
(ko)
|
2014-12-22 |
2021-06-09 |
에이에스엠 아이피 홀딩 비.브이. |
반도체 소자 및 그 제조 방법
|
|
US9478415B2
(en)
|
2015-02-13 |
2016-10-25 |
Asm Ip Holding B.V. |
Method for forming film having low resistance and shallow junction depth
|
|
US10529542B2
(en)
|
2015-03-11 |
2020-01-07 |
Asm Ip Holdings B.V. |
Cross-flow reactor and method
|
|
US10276355B2
(en)
|
2015-03-12 |
2019-04-30 |
Asm Ip Holding B.V. |
Multi-zone reactor, system including the reactor, and method of using the same
|
|
US10566187B2
(en)
|
2015-03-20 |
2020-02-18 |
Lam Research Corporation |
Ultrathin atomic layer deposition film accuracy thickness control
|
|
US9777025B2
(en)
|
2015-03-30 |
2017-10-03 |
L'Air Liquide, Société pour l'Etude et l'Exploitation des Procédés Georges Claude |
Si-containing film forming precursors and methods of using the same
|
|
US11124876B2
(en)
|
2015-03-30 |
2021-09-21 |
L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude |
Si-containing film forming precursors and methods of using the same
|
|
US9502238B2
(en)
|
2015-04-03 |
2016-11-22 |
Lam Research Corporation |
Deposition of conformal films by atomic layer deposition and atomic layer etch
|
|
US10458018B2
(en)
|
2015-06-26 |
2019-10-29 |
Asm Ip Holding B.V. |
Structures including metal carbide material, devices including the structures, and methods of forming same
|
|
US10403744B2
(en)
*
|
2015-06-29 |
2019-09-03 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Semiconductor devices comprising 2D-materials and methods of manufacture thereof
|
|
US10600673B2
(en)
|
2015-07-07 |
2020-03-24 |
Asm Ip Holding B.V. |
Magnetic susceptor to baseplate seal
|
|
US10526701B2
(en)
|
2015-07-09 |
2020-01-07 |
Lam Research Corporation |
Multi-cycle ALD process for film uniformity and thickness profile modulation
|
|
US9899291B2
(en)
|
2015-07-13 |
2018-02-20 |
Asm Ip Holding B.V. |
Method for protecting layer by forming hydrocarbon-based extremely thin film
|
|
US10043661B2
(en)
|
2015-07-13 |
2018-08-07 |
Asm Ip Holding B.V. |
Method for protecting layer by forming hydrocarbon-based extremely thin film
|
|
US10083836B2
(en)
|
2015-07-24 |
2018-09-25 |
Asm Ip Holding B.V. |
Formation of boron-doped titanium metal films with high work function
|
|
US10087525B2
(en)
|
2015-08-04 |
2018-10-02 |
Asm Ip Holding B.V. |
Variable gap hard stop design
|
|
US9647114B2
(en)
|
2015-08-14 |
2017-05-09 |
Asm Ip Holding B.V. |
Methods of forming highly p-type doped germanium tin films and structures and devices including the films
|
|
US9711345B2
(en)
|
2015-08-25 |
2017-07-18 |
Asm Ip Holding B.V. |
Method for forming aluminum nitride-based film by PEALD
|
|
WO2017040623A1
(en)
|
2015-09-01 |
2017-03-09 |
Silcotek Corp. |
Thermal chemical vapor deposition coating
|
|
US9960072B2
(en)
|
2015-09-29 |
2018-05-01 |
Asm Ip Holding B.V. |
Variable adjustment for precise matching of multiple chamber cavity housings
|
|
US9909214B2
(en)
|
2015-10-15 |
2018-03-06 |
Asm Ip Holding B.V. |
Method for depositing dielectric film in trenches by PEALD
|
|
US10211308B2
(en)
|
2015-10-21 |
2019-02-19 |
Asm Ip Holding B.V. |
NbMC layers
|
|
US10322384B2
(en)
|
2015-11-09 |
2019-06-18 |
Asm Ip Holding B.V. |
Counter flow mixer for process chamber
|
|
US9455138B1
(en)
|
2015-11-10 |
2016-09-27 |
Asm Ip Holding B.V. |
Method for forming dielectric film in trenches by PEALD using H-containing gas
|
|
US10121655B2
(en)
|
2015-11-20 |
2018-11-06 |
Applied Materials, Inc. |
Lateral plasma/radical source
|
|
US9905420B2
(en)
|
2015-12-01 |
2018-02-27 |
Asm Ip Holding B.V. |
Methods of forming silicon germanium tin films and structures and devices including the films
|
|
US9607837B1
(en)
|
2015-12-21 |
2017-03-28 |
Asm Ip Holding B.V. |
Method for forming silicon oxide cap layer for solid state diffusion process
|
|
US9735024B2
(en)
|
2015-12-28 |
2017-08-15 |
Asm Ip Holding B.V. |
Method of atomic layer etching using functional group-containing fluorocarbon
|
|
US9627221B1
(en)
|
2015-12-28 |
2017-04-18 |
Asm Ip Holding B.V. |
Continuous process incorporating atomic layer etching
|
|
US11139308B2
(en)
|
2015-12-29 |
2021-10-05 |
Asm Ip Holding B.V. |
Atomic layer deposition of III-V compounds to form V-NAND devices
|
|
US20170211180A1
(en)
*
|
2016-01-22 |
2017-07-27 |
Silcotek Corp. |
Diffusion-rate-limited thermal chemical vapor deposition coating
|
|
US10529554B2
(en)
|
2016-02-19 |
2020-01-07 |
Asm Ip Holding B.V. |
Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
|
|
US9754779B1
(en)
|
2016-02-19 |
2017-09-05 |
Asm Ip Holding B.V. |
Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
|
|
US10468251B2
(en)
|
2016-02-19 |
2019-11-05 |
Asm Ip Holding B.V. |
Method for forming spacers using silicon nitride film for spacer-defined multiple patterning
|
|
US10501866B2
(en)
|
2016-03-09 |
2019-12-10 |
Asm Ip Holding B.V. |
Gas distribution apparatus for improved film uniformity in an epitaxial system
|
|
US10343920B2
(en)
|
2016-03-18 |
2019-07-09 |
Asm Ip Holding B.V. |
Aligned carbon nanotubes
|
|
US9892913B2
(en)
|
2016-03-24 |
2018-02-13 |
Asm Ip Holding B.V. |
Radial and thickness control via biased multi-port injection settings
|
|
US10087522B2
(en)
|
2016-04-21 |
2018-10-02 |
Asm Ip Holding B.V. |
Deposition of metal borides
|
|
US10865475B2
(en)
|
2016-04-21 |
2020-12-15 |
Asm Ip Holding B.V. |
Deposition of metal borides and silicides
|
|
US10190213B2
(en)
|
2016-04-21 |
2019-01-29 |
Asm Ip Holding B.V. |
Deposition of metal borides
|
|
US10032628B2
(en)
|
2016-05-02 |
2018-07-24 |
Asm Ip Holding B.V. |
Source/drain performance through conformal solid state doping
|
|
US10367080B2
(en)
|
2016-05-02 |
2019-07-30 |
Asm Ip Holding B.V. |
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|
|
KR102592471B1
(ko)
|
2016-05-17 |
2023-10-20 |
에이에스엠 아이피 홀딩 비.브이. |
금속 배선 형성 방법 및 이를 이용한 반도체 장치의 제조 방법
|
|
JP6575433B2
(ja)
*
|
2016-05-23 |
2019-09-18 |
株式会社デンソー |
半導体装置の製造方法
|
|
US11453943B2
(en)
|
2016-05-25 |
2022-09-27 |
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Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor
|
|
US10388509B2
(en)
|
2016-06-28 |
2019-08-20 |
Asm Ip Holding B.V. |
Formation of epitaxial layers via dislocation filtering
|
|
US9773643B1
(en)
|
2016-06-30 |
2017-09-26 |
Lam Research Corporation |
Apparatus and method for deposition and etch in gap fill
|
|
US10062563B2
(en)
|
2016-07-01 |
2018-08-28 |
Lam Research Corporation |
Selective atomic layer deposition with post-dose treatment
|
|
US10612137B2
(en)
|
2016-07-08 |
2020-04-07 |
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Organic reactants for atomic layer deposition
|
|
US9859151B1
(en)
|
2016-07-08 |
2018-01-02 |
Asm Ip Holding B.V. |
Selective film deposition method to form air gaps
|
|
US9793135B1
(en)
|
2016-07-14 |
2017-10-17 |
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Method of cyclic dry etching using etchant film
|
|
US10714385B2
(en)
|
2016-07-19 |
2020-07-14 |
Asm Ip Holding B.V. |
Selective deposition of tungsten
|
|
US10381226B2
(en)
|
2016-07-27 |
2019-08-13 |
Asm Ip Holding B.V. |
Method of processing substrate
|
|
US10395919B2
(en)
|
2016-07-28 |
2019-08-27 |
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Method and apparatus for filling a gap
|
|
US9812320B1
(en)
|
2016-07-28 |
2017-11-07 |
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Method and apparatus for filling a gap
|
|
US9887082B1
(en)
|
2016-07-28 |
2018-02-06 |
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Method and apparatus for filling a gap
|
|
KR102532607B1
(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
기판 가공 장치 및 그 동작 방법
|
|
US10177025B2
(en)
|
2016-07-28 |
2019-01-08 |
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Method and apparatus for filling a gap
|
|
US10037884B2
(en)
|
2016-08-31 |
2018-07-31 |
Lam Research Corporation |
Selective atomic layer deposition for gapfill using sacrificial underlayer
|
|
US10090316B2
(en)
|
2016-09-01 |
2018-10-02 |
Asm Ip Holding B.V. |
3D stacked multilayer semiconductor memory using doped select transistor channel
|
|
KR102369071B1
(ko)
|
2016-10-03 |
2022-03-02 |
어플라이드 머티어리얼스, 인코포레이티드 |
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|
|
US10410943B2
(en)
|
2016-10-13 |
2019-09-10 |
Asm Ip Holding B.V. |
Method for passivating a surface of a semiconductor and related systems
|
|
US10643826B2
(en)
|
2016-10-26 |
2020-05-05 |
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Methods for thermally calibrating reaction chambers
|
|
US11532757B2
(en)
|
2016-10-27 |
2022-12-20 |
Asm Ip Holding B.V. |
Deposition of charge trapping layers
|
|
US10229833B2
(en)
|
2016-11-01 |
2019-03-12 |
Asm Ip Holding B.V. |
Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures
|
|
US10714350B2
(en)
|
2016-11-01 |
2020-07-14 |
ASM IP Holdings, B.V. |
Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures
|
|
US10643904B2
(en)
|
2016-11-01 |
2020-05-05 |
Asm Ip Holdings B.V. |
Methods for forming a semiconductor device and related semiconductor device structures
|
|
US10435790B2
(en)
|
2016-11-01 |
2019-10-08 |
Asm Ip Holding B.V. |
Method of subatmospheric plasma-enhanced ALD using capacitively coupled electrodes with narrow gap
|
|
US10134757B2
(en)
|
2016-11-07 |
2018-11-20 |
Asm Ip Holding B.V. |
Method of processing a substrate and a device manufactured by using the method
|
|
KR102546317B1
(ko)
|
2016-11-15 |
2023-06-21 |
에이에스엠 아이피 홀딩 비.브이. |
기체 공급 유닛 및 이를 포함하는 기판 처리 장치
|
|
US10340135B2
(en)
|
2016-11-28 |
2019-07-02 |
Asm Ip Holding B.V. |
Method of topologically restricted plasma-enhanced cyclic deposition of silicon or metal nitride
|
|
KR102762543B1
(ko)
|
2016-12-14 |
2025-02-05 |
에이에스엠 아이피 홀딩 비.브이. |
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|
|
US11581186B2
(en)
|
2016-12-15 |
2023-02-14 |
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Sequential infiltration synthesis apparatus
|
|
US11447861B2
(en)
|
2016-12-15 |
2022-09-20 |
Asm Ip Holding B.V. |
Sequential infiltration synthesis apparatus and a method of forming a patterned structure
|
|
US9916980B1
(en)
|
2016-12-15 |
2018-03-13 |
Asm Ip Holding B.V. |
Method of forming a structure on a substrate
|
|
KR102700194B1
(ko)
|
2016-12-19 |
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에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
|
US10269558B2
(en)
|
2016-12-22 |
2019-04-23 |
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Method of forming a structure on a substrate
|
|
US10867788B2
(en)
|
2016-12-28 |
2020-12-15 |
Asm Ip Holding B.V. |
Method of forming a structure on a substrate
|
|
WO2018125141A1
(en)
*
|
2016-12-29 |
2018-07-05 |
Intel Corporation |
Methods for incorporating stabilized carbon into silicon nitride films
|
|
US11390950B2
(en)
|
2017-01-10 |
2022-07-19 |
Asm Ip Holding B.V. |
Reactor system and method to reduce residue buildup during a film deposition process
|
|
US10655221B2
(en)
|
2017-02-09 |
2020-05-19 |
Asm Ip Holding B.V. |
Method for depositing oxide film by thermal ALD and PEALD
|
|
US10468261B2
(en)
|
2017-02-15 |
2019-11-05 |
Asm Ip Holding B.V. |
Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures
|
|
US10529563B2
(en)
|
2017-03-29 |
2020-01-07 |
Asm Ip Holdings B.V. |
Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures
|
|
US10283353B2
(en)
|
2017-03-29 |
2019-05-07 |
Asm Ip Holding B.V. |
Method of reforming insulating film deposited on substrate with recess pattern
|
|
US10460932B2
(en)
*
|
2017-03-31 |
2019-10-29 |
Asm Ip Holding B.V. |
Semiconductor device with amorphous silicon filled gaps and methods for forming
|
|
US10103040B1
(en)
|
2017-03-31 |
2018-10-16 |
Asm Ip Holding B.V. |
Apparatus and method for manufacturing a semiconductor device
|
|
USD830981S1
(en)
|
2017-04-07 |
2018-10-16 |
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Susceptor for semiconductor substrate processing apparatus
|
|
KR102457289B1
(ko)
|
2017-04-25 |
2022-10-21 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법 및 반도체 장치의 제조 방법
|
|
RU2661320C1
(ru)
*
|
2017-04-26 |
2018-07-13 |
Закрытое акционерное общество Научно-инженерный центр "ИНКОМСИСТЕМ" |
Способ гидрофобизации субстрата
|
|
JP2018199863A
(ja)
*
|
2017-05-02 |
2018-12-20 |
アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated |
タングステン柱を形成する方法
|
|
US10446393B2
(en)
|
2017-05-08 |
2019-10-15 |
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Methods for forming silicon-containing epitaxial layers and related semiconductor device structures
|
|
US10892156B2
(en)
|
2017-05-08 |
2021-01-12 |
Asm Ip Holding B.V. |
Methods for forming a silicon nitride film on a substrate and related semiconductor device structures
|
|
US10770286B2
(en)
|
2017-05-08 |
2020-09-08 |
Asm Ip Holdings B.V. |
Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures
|
|
US10504742B2
(en)
|
2017-05-31 |
2019-12-10 |
Asm Ip Holding B.V. |
Method of atomic layer etching using hydrogen plasma
|
|
US10886123B2
(en)
|
2017-06-02 |
2021-01-05 |
Asm Ip Holding B.V. |
Methods for forming low temperature semiconductor layers and related semiconductor device structures
|
|
US12040200B2
(en)
|
2017-06-20 |
2024-07-16 |
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Semiconductor processing apparatus and methods for calibrating a semiconductor processing apparatus
|
|
US11306395B2
(en)
|
2017-06-28 |
2022-04-19 |
Asm Ip Holding B.V. |
Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus
|
|
US10685834B2
(en)
|
2017-07-05 |
2020-06-16 |
Asm Ip Holdings B.V. |
Methods for forming a silicon germanium tin layer and related semiconductor device structures
|
|
KR20190009245A
(ko)
|
2017-07-18 |
2019-01-28 |
에이에스엠 아이피 홀딩 비.브이. |
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|
|
US11374112B2
(en)
|
2017-07-19 |
2022-06-28 |
Asm Ip Holding B.V. |
Method for depositing a group IV semiconductor and related semiconductor device structures
|
|
US11018002B2
(en)
|
2017-07-19 |
2021-05-25 |
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Method for selectively depositing a Group IV semiconductor and related semiconductor device structures
|
|
US10541333B2
(en)
|
2017-07-19 |
2020-01-21 |
Asm Ip Holding B.V. |
Method for depositing a group IV semiconductor and related semiconductor device structures
|
|
US10312055B2
(en)
|
2017-07-26 |
2019-06-04 |
Asm Ip Holding B.V. |
Method of depositing film by PEALD using negative bias
|
|
US10605530B2
(en)
|
2017-07-26 |
2020-03-31 |
Asm Ip Holding B.V. |
Assembly of a liner and a flange for a vertical furnace as well as the liner and the vertical furnace
|
|
US10590535B2
(en)
|
2017-07-26 |
2020-03-17 |
Asm Ip Holdings B.V. |
Chemical treatment, deposition and/or infiltration apparatus and method for using the same
|
|
TWI815813B
(zh)
|
2017-08-04 |
2023-09-21 |
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|
|
US10692741B2
(en)
|
2017-08-08 |
2020-06-23 |
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Radiation shield
|
|
US10770336B2
(en)
|
2017-08-08 |
2020-09-08 |
Asm Ip Holding B.V. |
Substrate lift mechanism and reactor including same
|
|
US10249524B2
(en)
|
2017-08-09 |
2019-04-02 |
Asm Ip Holding B.V. |
Cassette holder assembly for a substrate cassette and holding member for use in such assembly
|
|
US11769682B2
(en)
|
2017-08-09 |
2023-09-26 |
Asm Ip Holding B.V. |
Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
|
|
US11139191B2
(en)
|
2017-08-09 |
2021-10-05 |
Asm Ip Holding B.V. |
Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
|
|
US10236177B1
(en)
|
2017-08-22 |
2019-03-19 |
ASM IP Holding B.V.. |
Methods for depositing a doped germanium tin semiconductor and related semiconductor device structures
|
|
USD900036S1
(en)
|
2017-08-24 |
2020-10-27 |
Asm Ip Holding B.V. |
Heater electrical connector and adapter
|
|
US11830730B2
(en)
|
2017-08-29 |
2023-11-28 |
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Layer forming method and apparatus
|
|
KR102491945B1
(ko)
|
2017-08-30 |
2023-01-26 |
에이에스엠 아이피 홀딩 비.브이. |
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|
|
US11056344B2
(en)
|
2017-08-30 |
2021-07-06 |
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Layer forming method
|
|
US11295980B2
(en)
|
2017-08-30 |
2022-04-05 |
Asm Ip Holding B.V. |
Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures
|
|
KR102401446B1
(ko)
|
2017-08-31 |
2022-05-24 |
에이에스엠 아이피 홀딩 비.브이. |
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|
|
US11161324B2
(en)
|
2017-09-13 |
2021-11-02 |
Silcotek Corp. |
Corrosion-resistant coated article and thermal chemical vapor deposition coating process
|
|
US10269559B2
(en)
|
2017-09-13 |
2019-04-23 |
Lam Research Corporation |
Dielectric gapfill of high aspect ratio features utilizing a sacrificial etch cap layer
|
|
US10607895B2
(en)
|
2017-09-18 |
2020-03-31 |
Asm Ip Holdings B.V. |
Method for forming a semiconductor device structure comprising a gate fill metal
|
|
KR102630301B1
(ko)
|
2017-09-21 |
2024-01-29 |
에이에스엠 아이피 홀딩 비.브이. |
침투성 재료의 순차 침투 합성 방법 처리 및 이를 이용하여 형성된 구조물 및 장치
|
|
US10844484B2
(en)
|
2017-09-22 |
2020-11-24 |
Asm Ip Holding B.V. |
Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
|
|
US10658205B2
(en)
|
2017-09-28 |
2020-05-19 |
Asm Ip Holdings B.V. |
Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber
|
|
US10403504B2
(en)
|
2017-10-05 |
2019-09-03 |
Asm Ip Holding B.V. |
Method for selectively depositing a metallic film on a substrate
|
|
US10319588B2
(en)
|
2017-10-10 |
2019-06-11 |
Asm Ip Holding B.V. |
Method for depositing a metal chalcogenide on a substrate by cyclical deposition
|
|
US10923344B2
(en)
|
2017-10-30 |
2021-02-16 |
Asm Ip Holding B.V. |
Methods for forming a semiconductor structure and related semiconductor structures
|
|
FR3073665B1
(fr)
*
|
2017-11-15 |
2019-11-29 |
Centre National De La Recherche Scientifique |
Procede de fabrication de couche mince transferable
|
|
KR102443047B1
(ko)
|
2017-11-16 |
2022-09-14 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치 방법 및 그에 의해 제조된 장치
|
|
US10910262B2
(en)
|
2017-11-16 |
2021-02-02 |
Asm Ip Holding B.V. |
Method of selectively depositing a capping layer structure on a semiconductor device structure
|
|
US11022879B2
(en)
|
2017-11-24 |
2021-06-01 |
Asm Ip Holding B.V. |
Method of forming an enhanced unexposed photoresist layer
|
|
JP7214724B2
(ja)
|
2017-11-27 |
2023-01-30 |
エーエスエム アイピー ホールディング ビー.ブイ. |
バッチ炉で利用されるウェハカセットを収納するための収納装置
|
|
TWI791689B
(zh)
|
2017-11-27 |
2023-02-11 |
荷蘭商Asm智慧財產控股私人有限公司 |
包括潔淨迷你環境之裝置
|
|
US10290508B1
(en)
|
2017-12-05 |
2019-05-14 |
Asm Ip Holding B.V. |
Method for forming vertical spacers for spacer-defined patterning
|
|
US10872771B2
(en)
|
2018-01-16 |
2020-12-22 |
Asm Ip Holding B. V. |
Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
|
|
TWI799494B
(zh)
|
2018-01-19 |
2023-04-21 |
荷蘭商Asm 智慧財產控股公司 |
沈積方法
|
|
KR102695659B1
(ko)
|
2018-01-19 |
2024-08-14 |
에이에스엠 아이피 홀딩 비.브이. |
플라즈마 보조 증착에 의해 갭 충진 층을 증착하는 방법
|
|
USD903477S1
(en)
|
2018-01-24 |
2020-12-01 |
Asm Ip Holdings B.V. |
Metal clamp
|
|
US11018047B2
(en)
|
2018-01-25 |
2021-05-25 |
Asm Ip Holding B.V. |
Hybrid lift pin
|
|
US10535516B2
(en)
|
2018-02-01 |
2020-01-14 |
Asm Ip Holdings B.V. |
Method for depositing a semiconductor structure on a surface of a substrate and related semiconductor structures
|
|
USD880437S1
(en)
|
2018-02-01 |
2020-04-07 |
Asm Ip Holding B.V. |
Gas supply plate for semiconductor manufacturing apparatus
|
|
US11081345B2
(en)
|
2018-02-06 |
2021-08-03 |
Asm Ip Holding B.V. |
Method of post-deposition treatment for silicon oxide film
|
|
US11685991B2
(en)
|
2018-02-14 |
2023-06-27 |
Asm Ip Holding B.V. |
Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
|
|
US10896820B2
(en)
|
2018-02-14 |
2021-01-19 |
Asm Ip Holding B.V. |
Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
|
|
US10731249B2
(en)
|
2018-02-15 |
2020-08-04 |
Asm Ip Holding B.V. |
Method of forming a transition metal containing film on a substrate by a cyclical deposition process, a method for supplying a transition metal halide compound to a reaction chamber, and related vapor deposition apparatus
|
|
KR102636427B1
(ko)
|
2018-02-20 |
2024-02-13 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법 및 장치
|
|
US10658181B2
(en)
|
2018-02-20 |
2020-05-19 |
Asm Ip Holding B.V. |
Method of spacer-defined direct patterning in semiconductor fabrication
|
|
US10975470B2
(en)
|
2018-02-23 |
2021-04-13 |
Asm Ip Holding B.V. |
Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment
|
|
US11473195B2
(en)
|
2018-03-01 |
2022-10-18 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus and a method for processing a substrate
|
|
US11629406B2
(en)
|
2018-03-09 |
2023-04-18 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate
|
|
US11114283B2
(en)
|
2018-03-16 |
2021-09-07 |
Asm Ip Holding B.V. |
Reactor, system including the reactor, and methods of manufacturing and using same
|
|
KR102646467B1
(ko)
|
2018-03-27 |
2024-03-11 |
에이에스엠 아이피 홀딩 비.브이. |
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|
|
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(ja)
|
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|
|
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|
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|
|
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|
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|
|
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(en)
|
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|
|
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(ko)
|
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|
|
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(ko)
|
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|
|
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(en)
|
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|
|
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(zh)
|
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|
|
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(en)
|
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|
|
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(ko)
|
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|
|
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(ko)
|
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|
|
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(zh)
|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
US10797133B2
(en)
|
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|
|
US11499222B2
(en)
|
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|
|
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|
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|
|
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|
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|
|
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(en)
|
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|
|
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|
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|
|
US10755922B2
(en)
|
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|
|
US10767789B2
(en)
|
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2020-09-08 |
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|
|
US10483099B1
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|
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|
|
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(ko)
|
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|
|
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|
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|
|
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|
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|
|
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(en)
|
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|
|
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(en)
|
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|
|
US11024523B2
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|
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|
|
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(ko)
|
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|
|
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(en)
|
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|
|
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(zh)
|
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|
|
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|
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|
|
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|
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|
|
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(en)
|
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|
|
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|
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|
|
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(ko)
|
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|
|
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(ko)
|
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|
|
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(en)
|
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|
|
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(en)
|
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|
|
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(en)
|
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|
|
US11087997B2
(en)
|
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|
|
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(ko)
|
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|
|
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(en)
|
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|
|
US11031242B2
(en)
|
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|
|
US10818758B2
(en)
|
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|
|
US10847366B2
(en)
|
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2020-11-24 |
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Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process
|
|
US10559458B1
(en)
|
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2020-02-11 |
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|
|
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(en)
|
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|
|
US11217444B2
(en)
|
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|
|
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(ko)
|
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|
|
US11158513B2
(en)
|
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|
|
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(ja)
|
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2024-06-24 |
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|
|
US11791159B2
(en)
|
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|
|
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(zh)
|
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|
|
US11562903B2
(en)
*
|
2019-01-17 |
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|
|
KR102727227B1
(ko)
|
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|
|
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(zh)
|
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|
|
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(ko)
|
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|
|
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(ko)
|
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|
|
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(zh)
|
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|
|
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(zh)
|
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|
|
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(zh)
|
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|
|
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(ko)
|
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|
|
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(ko)
|
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|
|
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(ko)
|
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|
|
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(ja)
|
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2020-10-08 |
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|
|
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(ko)
|
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|
|
KR102897355B1
(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
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|
|
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(ko)
|
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|
|
SG11202111962QA
(en)
|
2019-05-01 |
2021-11-29 |
Lam Res Corp |
Modulated atomic layer deposition
|
|
KR102869364B1
(ko)
|
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|
|
KR102929471B1
(ko)
|
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|
|
KR102929472B1
(ko)
|
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|
|
JP7612342B2
(ja)
|
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|
|
JP7598201B2
(ja)
|
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|
|
USD947913S1
(en)
|
2019-05-17 |
2022-04-05 |
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Susceptor shaft
|
|
USD975665S1
(en)
|
2019-05-17 |
2023-01-17 |
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|
|
US11589572B2
(en)
|
2019-05-23 |
2023-02-28 |
Scott A. Butz |
Moving decoy support system
|
|
USD935572S1
(en)
|
2019-05-24 |
2021-11-09 |
Asm Ip Holding B.V. |
Gas channel plate
|
|
USD922229S1
(en)
|
2019-06-05 |
2021-06-15 |
Asm Ip Holding B.V. |
Device for controlling a temperature of a gas supply unit
|
|
KR20200141002A
(ko)
|
2019-06-06 |
2020-12-17 |
에이에스엠 아이피 홀딩 비.브이. |
배기 가스 분석을 포함한 기상 반응기 시스템을 사용하는 방법
|
|
JP2022534793A
(ja)
|
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2022-08-03 |
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原子層堆積時における膜特性の原位置制御
|
|
KR102918757B1
(ko)
|
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2026-01-28 |
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석영 에피택셜 챔버를 세정하는 방법
|
|
KR20200143254A
(ko)
|
2019-06-11 |
2020-12-23 |
에이에스엠 아이피 홀딩 비.브이. |
개질 가스를 사용하여 전자 구조를 형성하는 방법, 상기 방법을 수행하기 위한 시스템, 및 상기 방법을 사용하여 형성되는 구조
|
|
USD944946S1
(en)
|
2019-06-14 |
2022-03-01 |
Asm Ip Holding B.V. |
Shower plate
|
|
WO2020252306A1
(en)
|
2019-06-14 |
2020-12-17 |
Silcotek Corp. |
Nano-wire growth
|
|
US11649560B2
(en)
|
2019-06-20 |
2023-05-16 |
Applied Materials, Inc. |
Method for forming silicon-phosphorous materials
|
|
USD931978S1
(en)
|
2019-06-27 |
2021-09-28 |
Asm Ip Holding B.V. |
Showerhead vacuum transport
|
|
KR102911421B1
(ko)
|
2019-07-03 |
2026-01-12 |
에이에스엠 아이피 홀딩 비.브이. |
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|
|
JP7499079B2
(ja)
|
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|
|
CN112216646B
(zh)
|
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2026-02-10 |
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|
|
KR102895115B1
(ko)
|
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2025-12-03 |
에이에스엠 아이피 홀딩 비.브이. |
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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(ja)
|
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|
|
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(en)
|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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(en)
|
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|
|
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(ko)
|
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|
|
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(en)
|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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(en)
|
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|
|
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|
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|
|
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(en)
|
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|
|
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(zh)
|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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(en)
|
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|
|
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|
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|
|
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|
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|
|
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(ko)
|
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|
|
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(en)
|
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|
|
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(en)
|
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|
|
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|
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|
|
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(en)
|
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|
|
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(ko)
|
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|
|
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(zh)
|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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(en)
|
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|
|
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(ko)
|
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|
|
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(zh)
*
|
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|
|
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(zh)
|
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|
|
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|
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|
|
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(en)
|
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|
|
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(ko)
|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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(en)
|
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|
|
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(ko)
|
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|
|
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|
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|
|
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(en)
|
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|
|
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|
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|
|
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(ko)
|
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|
|
US11876356B2
(en)
|
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|
|
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|
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|
|
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(ko)
|
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|
|
US12173404B2
(en)
|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
US11821078B2
(en)
|
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|
|
US11996289B2
(en)
|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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(ja)
*
|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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(ko)
|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
US12473635B2
(en)
|
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Dielectric article
|
|
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(ko)
|
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|
|
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|
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|
|
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|
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|
|
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(en)
|
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Silicon nitride and silicon oxide deposition methods using fluorine inhibitor
|
|
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(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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(ko)
|
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|
|
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(ko)
|
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|
|
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(en)
|
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Methods for forming a laminate film by cyclical plasma-enhanced deposition processes
|
|
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(zh)
|
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|
|
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(zh)
|
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|
|
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|
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|
|
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|
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|
|
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(en)
|
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Weighted lift pin
|
|
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(ko)
|
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|
|
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(en)
|
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|
|
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(zh)
|
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|
|
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(en)
|
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|
|
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(ko)
|
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|
|
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(zh)
|
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|
|
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(zh)
|
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|
|
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(ko)
|
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|
|
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(ko)
|
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|
|
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(zh)
|
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|
|
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(zh)
|
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|
|
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(zh)
|
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沉積系統、用於控制反應條件之方法、沉積方法
|
|
US12046468B2
(en)
*
|
2020-11-20 |
2024-07-23 |
Applied Materials, Inc. |
Conformal silicon-germanium film deposition
|
|
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(zh)
|
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|
|
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(zh)
|
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|
|
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(zh)
|
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2022-09-16 |
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|
|
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(ko)
|
2020-12-02 |
2022-06-09 |
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|
|
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(en)
|
2020-12-10 |
2025-03-18 |
Asm Ip Holding B.V. |
Methods and systems for depositing a layer
|
|
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(en)
|
2020-12-14 |
2024-12-03 |
Asm Ip Holding B.V. |
Method of forming structures for threshold voltage control
|
|
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(zh)
|
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2022-06-17 |
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|
|
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(zh)
|
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|
|
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(ko)
|
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2022-06-29 |
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|
|
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(zh)
|
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|
|
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(ko)
|
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2022-06-29 |
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|
|
US11551926B2
(en)
*
|
2021-01-22 |
2023-01-10 |
Micron Technology, Inc. |
Methods of forming a microelectronic device, and related systems and additional methods
|
|
EP4326921A4
(de)
*
|
2021-04-21 |
2025-05-07 |
Entegris, Inc. |
Siliciumvorläuferverbindungen und verfahren zur herstellung von siliciumhaltigen filmen
|
|
USD980814S1
(en)
|
2021-05-11 |
2023-03-14 |
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Gas distributor for substrate processing apparatus
|
|
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(en)
|
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|
|
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(en)
|
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Reactor wall for substrate processing apparatus
|
|
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(en)
|
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2023-03-14 |
Asm Ip Holding B.V. |
Gas flow control plate for substrate processing apparatus
|
|
US11830734B2
(en)
*
|
2021-05-19 |
2023-11-28 |
Applied Materials, Inc. |
Thermal deposition of silicon-germanium
|
|
USD990441S1
(en)
|
2021-09-07 |
2023-06-27 |
Asm Ip Holding B.V. |
Gas flow control plate
|
|
USD1099184S1
(en)
|
2021-11-29 |
2025-10-21 |
Asm Ip Holding B.V. |
Weighted lift pin
|
|
USD1060598S1
(en)
|
2021-12-03 |
2025-02-04 |
Asm Ip Holding B.V. |
Split showerhead cover
|
|
TW202426689A
(zh)
*
|
2021-12-23 |
2024-07-01 |
法商液態空氣喬治斯克勞帝方法研究開發股份有限公司 |
V族元素的新型無機矽基和聚矽基衍生物及其合成方法和使用其沈積之方法
|
|
FR3131332A1
(fr)
*
|
2021-12-23 |
2023-06-30 |
L'air Liquide Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude |
Nouveaux dérivés de silyle et polysilyle inorganiques d’éléments du groupe v et procédés de synthèse de ceux-ci et procédés d’utilisation de ceux-ci pour un dépôt
|
|
US12444605B2
(en)
|
2022-01-12 |
2025-10-14 |
Applied Materials, Inc. |
Epitaxial methods including a haloborane formula for growing boron-containing structures having increased boron concentrations
|
|
EP4215649A1
(de)
|
2022-01-24 |
2023-07-26 |
Ivan Timokhin |
Herstellung von geformten kristallinen schichten durch verwendung der inneren form/oberfläche der ampulle als formgebende oberfläche
|
|
US12333700B2
(en)
|
2022-03-30 |
2025-06-17 |
Applied Materials, Inc. |
Chemical-dose substrate deposition monitoring
|
|
US12568800B2
(en)
|
2022-03-30 |
2026-03-03 |
Applied Materials, Inc. |
Chemical-dose substrate deposition monitoring
|
|
US12480212B2
(en)
*
|
2022-03-30 |
2025-11-25 |
Applied Materials, Inc. |
Chemical-dose substrate deposition monitoring
|
|
JP7832429B2
(ja)
*
|
2022-06-21 |
2026-03-18 |
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半導体装置の製造方法および半導体製造装置
|
|
KR20250019118A
(ko)
*
|
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2025-02-07 |
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실리콘막의 제조 방법 및 실리콘막
|
|
WO2025129004A1
(en)
*
|
2023-12-15 |
2025-06-19 |
Asm Ip Holding B.V. |
Methods and systems for forming a layer comprising silicon and composition and synthesis of silicon precursor
|