JPH0459950U - - Google Patents

Info

Publication number
JPH0459950U
JPH0459950U JP1990102440U JP10244090U JPH0459950U JP H0459950 U JPH0459950 U JP H0459950U JP 1990102440 U JP1990102440 U JP 1990102440U JP 10244090 U JP10244090 U JP 10244090U JP H0459950 U JPH0459950 U JP H0459950U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
heat sink
adhesive
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990102440U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990102440U priority Critical patent/JPH0459950U/ja
Publication of JPH0459950U publication Critical patent/JPH0459950U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Description

【図面の簡単な説明】
第１図ａ〜ｄはこの考案の一実施例である混成
集積回路装置の各製造工程を示す斜視図、平面図
および断面図、第２図ａ〜ｆは従来の混成集積回
路装置の各製造工程および不工合を説明する斜視
図、断面図である。 図において、１はヒートシンク、１ａは突起部
、２は基板、２ａは基板電極、２ｂは搭載部品、
３は接着剤、４はリード線、５は半田、６はワイ
ヤーを示す。なお、図中、同一符号は同一、また
は相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 基板を接着剤にてヒートシンクに接着する構造
    の混成集積回路装置において、前記接着剤の厚み
    を均一にするため前記ヒートシンクの前記基板接
    着面に３個以上の突起を設けたことを特徴とする
    混成集積回路装置。
JP1990102440U 1990-09-28 1990-09-28 Pending JPH0459950U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990102440U JPH0459950U (ja) 1990-09-28 1990-09-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990102440U JPH0459950U (ja) 1990-09-28 1990-09-28

Publications (1)

Publication Number Publication Date
JPH0459950U true JPH0459950U (ja) 1992-05-22

Family

ID=31846698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990102440U Pending JPH0459950U (ja) 1990-09-28 1990-09-28

Country Status (1)

Country Link
JP (1) JPH0459950U (ja)

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