JPH0470739U - - Google Patents

Info

Publication number
JPH0470739U
JPH0470739U JP1990113835U JP11383590U JPH0470739U JP H0470739 U JPH0470739 U JP H0470739U JP 1990113835 U JP1990113835 U JP 1990113835U JP 11383590 U JP11383590 U JP 11383590U JP H0470739 U JPH0470739 U JP H0470739U
Authority
JP
Japan
Prior art keywords
pellet
circuit board
resin layer
hybrid integrated
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990113835U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990113835U priority Critical patent/JPH0470739U/ja
Publication of JPH0470739U publication Critical patent/JPH0470739U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す断面図、第２
図は従来の混成集積回路の一例を示す断面図であ
る。 １……ガラスエポキシ基板、２……ミニモール
ドトランジスタ、３……スポツトコーテイング樹
脂、４……ＩＣペレツト、５……ボンデイング線
、６……スルーホール、７……半田、８……金め
つき、９……ソルダーレジスト膜、１０……配線
、１１……接着剤。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁基板上にパターニングして設けた配線を有
    する回路基板と、前記回路基板上に搭載して前記
    配線とボンデイング線で接続したＩＣペレツトと
    、前記ＩＣペレツトを含んで封止した樹脂層とを
    有する混成集積回路において、前記ＩＣペレツト
    を回路基板上に搭載するための接着剤が前記ＩＣ
    ペレツトを封止する樹脂層と同一材料からなるこ
    とを特徴とする混成集積回路。
JP1990113835U 1990-10-30 1990-10-30 Pending JPH0470739U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990113835U JPH0470739U (ja) 1990-10-30 1990-10-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990113835U JPH0470739U (ja) 1990-10-30 1990-10-30

Publications (1)

Publication Number Publication Date
JPH0470739U true JPH0470739U (ja) 1992-06-23

Family

ID=31861452

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990113835U Pending JPH0470739U (ja) 1990-10-30 1990-10-30

Country Status (1)

Country Link
JP (1) JPH0470739U (ja)

Similar Documents

Publication Publication Date Title
JPH0375539U (ja)
JPS6232550U (ja)
JPS5846453U (ja) 半導体装置の封止構造
JPS614436U (ja) 半導体装置用パツケ−ジ
JPS6169863U (ja)
JPS5895052U (ja) 半導体装置
JPS5895054U (ja) 半導体装置
JPS59132641U (ja) 半導体装置用基板
JPH0365251U (ja)
JPS6068652U (ja) 半導体装置
JPH01121955U (ja)
JPS5895046U (ja) 混成集積回路
JPS6149453U (ja)
JPH0165142U (ja)
JPS6127338U (ja) 混成集積回路装置
JPS6157555U (ja)
JPS6217181U (ja)
JPH024249U (ja)
JPS6027444U (ja) 樹脂封止形半導体装置
JPS587347U (ja) 混成集積回路装置
JPS60125735U (ja) 多チツプ搭載混成集積回路
JPH01166565U (ja)
JPH0189722U (ja)
JPS6013743U (ja) 混成集積回路装置
JPH0179832U (ja)