JPH0472648U - - Google Patents

Info

Publication number
JPH0472648U
JPH0472648U JP1990116180U JP11618090U JPH0472648U JP H0472648 U JPH0472648 U JP H0472648U JP 1990116180 U JP1990116180 U JP 1990116180U JP 11618090 U JP11618090 U JP 11618090U JP H0472648 U JPH0472648 U JP H0472648U
Authority
JP
Japan
Prior art keywords
semiconductor device
resin
sealed semiconductor
protrusion
island
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990116180U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990116180U priority Critical patent/JPH0472648U/ja
Publication of JPH0472648U publication Critical patent/JPH0472648U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例を示す樹脂封止半導体
装置の断面図、第２図はその樹脂封止半導体装置
のアイランド部の拡大斜視図、第３図は従来の樹
脂封止半導体装置の断面図、第４図は従来の他の
樹脂封止半導体装置の断面図、第５図はその半導
体装置の応力緩和障壁とＩＣチツプとの平面的配
置関係を示す図、第６図は従来技術の問題点説明
図である。 ２０……リードフレーム、２１……インナリー
ド、２２……アイランド、２３……半導体素子、
２５……金属細線、２６……円柱状の突起、２７
……封止樹脂。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) リードフレームを用いた樹脂封止半導体装
    置において、 アイランドのコーナ部にその頭部が外殻表面に
    露出する高さの柱状の突起を形成するようにした
    ことを特徴とする樹脂封止半導体装置。 (2) 前記突起は熱伝導性の高い材料からなるこ
    とを特徴とする請求項１記載の樹脂封止半導体装
    置。
JP1990116180U 1990-11-07 1990-11-07 Pending JPH0472648U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990116180U JPH0472648U (ja) 1990-11-07 1990-11-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990116180U JPH0472648U (ja) 1990-11-07 1990-11-07

Publications (1)

Publication Number Publication Date
JPH0472648U true JPH0472648U (ja) 1992-06-26

Family

ID=31863998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990116180U Pending JPH0472648U (ja) 1990-11-07 1990-11-07

Country Status (1)

Country Link
JP (1) JPH0472648U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013058547A (ja) * 2011-09-07 2013-03-28 Toshiba Corp 半導体装置
JP6180646B1 (ja) * 2016-02-25 2017-08-16 三菱電機株式会社 半導体パッケージ、及びモジュール

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013058547A (ja) * 2011-09-07 2013-03-28 Toshiba Corp 半導体装置
JP6180646B1 (ja) * 2016-02-25 2017-08-16 三菱電機株式会社 半導体パッケージ、及びモジュール
WO2017145331A1 (ja) * 2016-02-25 2017-08-31 三菱電機株式会社 半導体パッケージ、及びモジュール
US10964631B2 (en) 2016-02-25 2021-03-30 Mitsubishi Electric Corporation Semiconductor package and module

Similar Documents

Publication Publication Date Title
JPH0369248U (ja)
JPH0472648U (ja)
JPH03124662U (ja)
JPH03101542U (ja)
JPH0226261U (ja)
JPH024258U (ja)
JPH03101524U (ja)
JPH0215739U (ja)
JPS61182036U (ja)
JPH0330430U (ja)
JPH0442742U (ja)
JPH0270450U (ja)
JPS61186236U (ja)
JPS625644U (ja)
JPH0245651U (ja)
JPS6450442U (ja)
JPH0160547U (ja)
JPH0192144U (ja)
JPS61102048U (ja)
JPS6284928U (ja)
JPH0456335U (ja)
JPH0356152U (ja)
JPH0442745U (ja)
JPS6242247U (ja)
JPH0373455U (ja)