JPS60141873A - 化学メツキ用接着剤組成物 - Google Patents
化学メツキ用接着剤組成物Info
- Publication number
- JPS60141873A JPS60141873A JP58249263A JP24926383A JPS60141873A JP S60141873 A JPS60141873 A JP S60141873A JP 58249263 A JP58249263 A JP 58249263A JP 24926383 A JP24926383 A JP 24926383A JP S60141873 A JPS60141873 A JP S60141873A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- nbr
- chemical plating
- viscosity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58249263A JPS60141873A (ja) | 1983-12-27 | 1983-12-27 | 化学メツキ用接着剤組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58249263A JPS60141873A (ja) | 1983-12-27 | 1983-12-27 | 化学メツキ用接着剤組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60141873A true JPS60141873A (ja) | 1985-07-26 |
| JPH0314871B2 JPH0314871B2 (2) | 1991-02-27 |
Family
ID=17190357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58249263A Granted JPS60141873A (ja) | 1983-12-27 | 1983-12-27 | 化学メツキ用接着剤組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60141873A (2) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0226096A (ja) * | 1988-07-15 | 1990-01-29 | Yokohama Rubber Co Ltd:The | アディティブ法配線板の製造方法 |
| JPH06299133A (ja) * | 1993-04-14 | 1994-10-25 | Tomoegawa Paper Co Ltd | エポキシ樹脂接着組成物 |
| US5807910A (en) * | 1997-06-23 | 1998-09-15 | Industrial Technology Research Institute | Preolymerizing epoxy resin, functionalized rubber with filler to form adhesive |
| JPWO2022163547A1 (2) * | 2021-01-29 | 2022-08-04 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56122823A (en) * | 1980-02-29 | 1981-09-26 | Nitto Electric Ind Co Ltd | Flexible epoxy resin powder composition |
-
1983
- 1983-12-27 JP JP58249263A patent/JPS60141873A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56122823A (en) * | 1980-02-29 | 1981-09-26 | Nitto Electric Ind Co Ltd | Flexible epoxy resin powder composition |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0226096A (ja) * | 1988-07-15 | 1990-01-29 | Yokohama Rubber Co Ltd:The | アディティブ法配線板の製造方法 |
| JPH06299133A (ja) * | 1993-04-14 | 1994-10-25 | Tomoegawa Paper Co Ltd | エポキシ樹脂接着組成物 |
| US5807910A (en) * | 1997-06-23 | 1998-09-15 | Industrial Technology Research Institute | Preolymerizing epoxy resin, functionalized rubber with filler to form adhesive |
| JPWO2022163547A1 (2) * | 2021-01-29 | 2022-08-04 | ||
| WO2022163547A1 (ja) * | 2021-01-29 | 2022-08-04 | 日東電工株式会社 | 表面改質シート、積層体、表面改質部材、塗装物、表面改質部材の製造方法、及び塗装物の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0314871B2 (2) | 1991-02-27 |
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