JPS62261163A - サ−デイツプ型半導体装置用リ−ドフレ−ム - Google Patents

サ−デイツプ型半導体装置用リ−ドフレ−ム

Info

Publication number
JPS62261163A
JPS62261163A JP61105372A JP10537286A JPS62261163A JP S62261163 A JPS62261163 A JP S62261163A JP 61105372 A JP61105372 A JP 61105372A JP 10537286 A JP10537286 A JP 10537286A JP S62261163 A JPS62261163 A JP S62261163A
Authority
JP
Japan
Prior art keywords
lead
frame
outer frame
ceramic substrate
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61105372A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0545066B2 (2
Inventor
Masao Ueda
植田　正夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP61105372A priority Critical patent/JPS62261163A/ja
Publication of JPS62261163A publication Critical patent/JPS62261163A/ja
Publication of JPH0545066B2 publication Critical patent/JPH0545066B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP61105372A 1986-05-07 1986-05-07 サ−デイツプ型半導体装置用リ−ドフレ−ム Granted JPS62261163A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61105372A JPS62261163A (ja) 1986-05-07 1986-05-07 サ−デイツプ型半導体装置用リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61105372A JPS62261163A (ja) 1986-05-07 1986-05-07 サ−デイツプ型半導体装置用リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS62261163A true JPS62261163A (ja) 1987-11-13
JPH0545066B2 JPH0545066B2 (2) 1993-07-08

Family

ID=14405866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61105372A Granted JPS62261163A (ja) 1986-05-07 1986-05-07 サ−デイツプ型半導体装置用リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS62261163A (2)

Also Published As

Publication number Publication date
JPH0545066B2 (2) 1993-07-08

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