JPH0456342U - - Google Patents

Info

Publication number
JPH0456342U
JPH0456342U JP1990099921U JP9992190U JPH0456342U JP H0456342 U JPH0456342 U JP H0456342U JP 1990099921 U JP1990099921 U JP 1990099921U JP 9992190 U JP9992190 U JP 9992190U JP H0456342 U JPH0456342 U JP H0456342U
Authority
JP
Japan
Prior art keywords
glass cloth
center layer
semiconductor device
wiring board
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990099921U
Other languages
English (en)
Other versions
JP2532486Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990099921U priority Critical patent/JP2532486Y2/ja
Publication of JPH0456342U publication Critical patent/JPH0456342U/ja
Application granted granted Critical
Publication of JP2532486Y2 publication Critical patent/JP2532486Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の半導体装置の断面
図、第２図は従来の半導体装置の断面図である。 １……半導体素子、２……接着剤、３……アラ
シドエポキシ、４……接着層、５……ガラス布エ
ポキシ基板、６……配線回路、７……ソルダーレ
ジスト、８……ボンデイングワイヤ、９……封入
樹脂、１０……外部接続用端子。

Claims (1)

    【実用新案登録請求の範囲】
  1. 配線基板に半導体素子を搭載し、上部を樹脂で
    覆い前記半導体素子を保護した半導体装置におい
    て、前記配線基板の中心層と上下部の主表面層と
    が異なる材料で構成されていて、前記中心層がガ
    ラス布エポキシ系又はガラス布トリアジン系又は
    ガラス布ポリイミド系の積層板からなり、前記表
    面層がアラシド繊維にエポキシ樹脂を含浸させて
    積層した金属張積層板からなり、前記中心層が全
    板厚に対して４０％乃至７０％を占めていること
    を特徴とする半導体装置。
JP1990099921U 1990-09-25 1990-09-25 半導体装置 Expired - Lifetime JP2532486Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990099921U JP2532486Y2 (ja) 1990-09-25 1990-09-25 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990099921U JP2532486Y2 (ja) 1990-09-25 1990-09-25 半導体装置

Publications (2)

Publication Number Publication Date
JPH0456342U true JPH0456342U (ja) 1992-05-14
JP2532486Y2 JP2532486Y2 (ja) 1997-04-16

Family

ID=31842191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990099921U Expired - Lifetime JP2532486Y2 (ja) 1990-09-25 1990-09-25 半導体装置

Country Status (1)

Country Link
JP (1) JP2532486Y2 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0221694A (ja) * 1988-07-08 1990-01-24 Matsushita Electric Works Ltd 多層プリント配線板
JPH02150345A (ja) * 1988-11-30 1990-06-08 Shin Kobe Electric Mach Co Ltd 銅張積層板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0221694A (ja) * 1988-07-08 1990-01-24 Matsushita Electric Works Ltd 多層プリント配線板
JPH02150345A (ja) * 1988-11-30 1990-06-08 Shin Kobe Electric Mach Co Ltd 銅張積層板

Also Published As

Publication number Publication date
JP2532486Y2 (ja) 1997-04-16

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