JPH0456349U - - Google Patents

Info

Publication number
JPH0456349U
JPH0456349U JP1990099926U JP9992690U JPH0456349U JP H0456349 U JPH0456349 U JP H0456349U JP 1990099926 U JP1990099926 U JP 1990099926U JP 9992690 U JP9992690 U JP 9992690U JP H0456349 U JPH0456349 U JP H0456349U
Authority
JP
Japan
Prior art keywords
pellets
parts
boards
stacked
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990099926U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990099926U priority Critical patent/JPH0456349U/ja
Publication of JPH0456349U publication Critical patent/JPH0456349U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】
第１図は本考案の第１の実施例を示す断面図、
第２図は同じく第２の実施例を示す断面図、第３
図は従来例を示す断面図である。 １……リードフレーム、２……マウントランド
、３……配線基板、４，４ａ〜４ｃ……ＩＣペレ
ツト、５，６……ボンデイングワイヤ、７……ト
ランスフアモールド樹脂、８……金属バンプ、９
……ポリイミドテープ、１０……銅箔、１１……
絶縁シート、１２……配線端部。

Claims (1)

    【実用新案登録請求の範囲】
  1. フレキシブルな有機材からなる配線基板上に、
    金属バンプを介してＩＣペレツトが接続、搭載さ
    れ、前記ＩＣペレツトが接続、搭載された基板が
    複数個積み重ねられ、各基板間の必要な配線部分
    が電気的に接続されるとともに、外部取出し電極
    端子を除く全体がトランスフアモールド法で樹脂
    封止されてなる構造を有することを特徴とする混
    成集積回路。
JP1990099926U 1990-09-25 1990-09-25 Pending JPH0456349U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990099926U JPH0456349U (ja) 1990-09-25 1990-09-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990099926U JPH0456349U (ja) 1990-09-25 1990-09-25

Publications (1)

Publication Number Publication Date
JPH0456349U true JPH0456349U (ja) 1992-05-14

Family

ID=31842201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990099926U Pending JPH0456349U (ja) 1990-09-25 1990-09-25

Country Status (1)

Country Link
JP (1) JPH0456349U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100342811B1 (ko) * 1996-11-28 2002-11-27 앰코 테크놀로지 코리아 주식회사 복수개의칩이내장된에어리어어레이범프드반도체패키지

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100342811B1 (ko) * 1996-11-28 2002-11-27 앰코 테크놀로지 코리아 주식회사 복수개의칩이내장된에어리어어레이범프드반도체패키지

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