JPS6233432A - リ−ドフレ−ム押圧器 - Google Patents

リ−ドフレ−ム押圧器

Info

Publication number
JPS6233432A
JPS6233432A JP60173020A JP17302085A JPS6233432A JP S6233432 A JPS6233432 A JP S6233432A JP 60173020 A JP60173020 A JP 60173020A JP 17302085 A JP17302085 A JP 17302085A JP S6233432 A JPS6233432 A JP S6233432A
Authority
JP
Japan
Prior art keywords
lead frame
pusher
presser
chip
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60173020A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0446453B2 (2
Inventor
Masanari Iwata
岩田　政成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60173020A priority Critical patent/JPS6233432A/ja
Publication of JPS6233432A publication Critical patent/JPS6233432A/ja
Publication of JPH0446453B2 publication Critical patent/JPH0446453B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7622—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP60173020A 1985-08-06 1985-08-06 リ−ドフレ−ム押圧器 Granted JPS6233432A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60173020A JPS6233432A (ja) 1985-08-06 1985-08-06 リ−ドフレ−ム押圧器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60173020A JPS6233432A (ja) 1985-08-06 1985-08-06 リ−ドフレ−ム押圧器

Publications (2)

Publication Number Publication Date
JPS6233432A true JPS6233432A (ja) 1987-02-13
JPH0446453B2 JPH0446453B2 (2) 1992-07-30

Family

ID=15952717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60173020A Granted JPS6233432A (ja) 1985-08-06 1985-08-06 リ−ドフレ−ム押圧器

Country Status (1)

Country Link
JP (1) JPS6233432A (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03233947A (ja) * 1990-02-09 1991-10-17 Fujitsu Ltd リードフレームインナーリード押え治具
KR20020069885A (ko) * 2001-02-28 2002-09-05 앰코 테크놀로지 코리아 주식회사 반도체패키지용 클램프

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5288970U (2) * 1975-12-26 1977-07-02
JPS60113438A (ja) * 1983-11-24 1985-06-19 Nec Corp ベ−スリボン保持機構

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5288970U (2) * 1975-12-26 1977-07-02
JPS60113438A (ja) * 1983-11-24 1985-06-19 Nec Corp ベ−スリボン保持機構

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03233947A (ja) * 1990-02-09 1991-10-17 Fujitsu Ltd リードフレームインナーリード押え治具
KR20020069885A (ko) * 2001-02-28 2002-09-05 앰코 테크놀로지 코리아 주식회사 반도체패키지용 클램프

Also Published As

Publication number Publication date
JPH0446453B2 (2) 1992-07-30

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